JP2010278309A - Method of manufacturing circuit board and method of manufacturing circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which bur formation is suppressed and a method of manufacturing a circuit device. <P>SOLUTION: In the method of manufacturing the circuit board, a separation region 34 is formed which cuts a region where grooves formed to separate the board intersect. When a first groove 30 and a second groove 32 are formed on an upper surface of the board 10, burs which are hardly removed are formed at the place where the first groove 30 and second groove 32 intersect. The place where those grooves intersect is partially removed to be taken away from the board 10 together with the part where the formed burs need to be removed. Eventually, no conductive bur is left on the board 10 to prevent short-circuiting due to burs. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit board manufacturing method and a circuit device manufacturing method in which a plurality of circuit elements are mounted on an upper surface.

  When forming a circuit device composed of circuit elements mounted on a circuit board, after forming a conductive pattern constituting a large number of units on the upper surface of a single large board and connecting the circuit elements to the conductive pattern, A method of separating each unit has been conventionally employed (see Patent Document 1 below).

  A conventional method for manufacturing a circuit device will be described with reference to FIG. FIG. 8A, FIG. 8B, and FIG. 8C are cross-sectional views showing each step.

  With reference to FIG. 8A, first, conductive patterns 104 constituting a large number of units 106 are formed on the upper surface of the substrate 100, and first grooves 108 and second grooves 110 are provided at the boundaries of the units 106.

  The planar size of the substrate 100 is such that a large number of units 106 are formed. For example, a substrate made of aluminum having a thickness of about 1.5 mm is employed. The upper surface of such a substrate 1000 is covered with an insulating layer 102 made of a resin material mixed with a filler.

  On the upper surface of the insulating layer 102, a conductive pattern 104 is formed which is patterned into a predetermined shape by etching a conductive foil having a thickness of about several tens of μm. Here, the unit 106 is a unit element constituting one circuit device, and the conductive pattern 104 having the same shape is formed for each unit 106. Although not shown here, a large number of units 106 are arranged on the substrate 100 in a matrix.

  The first groove 108 is a groove formed from the upper surface of the substrate 100 along the boundary of each unit 106 and has a V-shaped cross-sectional shape. Since the units 106 are formed in a matrix on the substrate 100, the first grooves 108 provided between the units 106 are formed in a lattice. Here, when the thickness of the substrate 100 is 1.5 mm, the depth of the first groove 108 is about 0.6 mm.

  The second groove 110 is provided on the lower surface of the substrate 100 corresponding to the location where the first groove 108 is formed. The depth of the second groove 110 is the same as that of the first groove 108.

  The first groove 108 and the second groove 110 described above are formed by partially cutting the substrate 100 using a cutting saw that rotates at high speed.

  Referring to FIG. 8B, next, the circuit element 112 is electrically connected to the conductive pattern 104 of each unit 106. Here, as the circuit element 112, a semiconductor element such as a transistor or an IC, or a chip element such as a chip resistor or a chip capacitor is shown. A semiconductor element such as an IC is connected to the conductive pattern 104 via a thin metal wire.

  Referring to FIG. 8C, next, the substrate 100 is divided at locations where the first grooves 108 and the second grooves 110 are provided, and separated into the respective units 106. In the region where the first groove 108 and the second groove 110 are provided, the thickness of the substrate 100 is locally thinned, so that the substrate 100 can be easily separated in this region. As a method for separating the substrate 100, there are a method in which the substrate 100 is bent and separated at a location where both grooves are provided, a method in which the substrate 100 is diced at this location, and the like.

  After the above-described separation process is completed, a lead is fixed to a pad made of the conductive pattern 104, and the circuit element 112 and the substrate 100 are sealed using a sealing resin or a case material, thereby completing the circuit device.

  By manufacturing the circuit device by the above-described method, a large number of circuit devices can be efficiently manufactured.

JP 2003-318334 A

  However, the above-described circuit board and circuit device manufacturing method has a problem that burrs are generated when the first groove 108 and the second groove 110 are formed.

  Specifically, referring to FIG. 8A, since units 106 are arranged in a matrix on the upper surface of substrate 100, first grooves 108 are formed in a lattice pattern on the upper surface of substrate 100. . Similarly, the second grooves 110 are also formed in a lattice shape on the lower surface of the substrate 100.

  However, as shown in the image of FIG. 9, burrs are generated at portions where the first grooves 108 formed on the upper surface of the substrate 100 intersect. In this figure, the first groove 108A is formed in the vertical direction on the paper surface, the first groove 108B is formed in the horizontal direction on the paper surface, and the first groove 108A and the first groove 108B cross each other. Has occurred in large quantities. Here, the locations where burrs occur are indicated by white arrows.

  The reason that burrs occur at the location where the first grooves 108 intersect is that when the first groove 108A is formed in the vertical direction and then the first groove 108B that intersects in the horizontal direction is formed, the location where both grooves intersect is formed. This is because a part of the metal material constituting the substrate 100 protrudes and adheres to the inside of the first groove 108A.

  As a method of removing this burr, there is a method of injecting a gas such as air or a liquid such as water to the burr at a high pressure. However, since the adhesion strength between the burr and the substrate 100 is very high, it is difficult to remove all the burr from the substrate 100 even by this method.

  As described above, when conductive burrs made of metal such as aluminum are generated, there is a possibility that the burrs adhere to conductive patterns and circuit elements incorporated in the substrate in a later process, thereby causing a short circuit.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a method for manufacturing a circuit board and a method for manufacturing a circuit device that suppress the remaining of burrs generated on the substrate by forming a separation groove. There is to do.

  The method for manufacturing a circuit board according to the present invention includes a step of preparing a substrate in which units composed of a plurality of conductive patterns are formed in a matrix, and a main surface of the substrate, along a boundary between the units. A step of providing orthogonal first and second grooves, and a step of separating the substrate for each of the units at a position where the first groove and the second groove are provided. A removal region is provided by partially removing a portion where the first groove and the second groove intersect.

  In the present invention, in order to separate the units formed in a matrix on the upper surface of the substrate, the first and second grooves for separation are provided in a lattice shape on the upper surface of the substrate. And the metal substrate of the location where a 1st groove | channel and a 2nd groove | channel cross | intersect is partially removed, and the removal area | region is provided. By doing so, even if burrs are generated at a location where the first groove and the second groove intersect, it is possible to separate the burrs from the substrate together with this location. Therefore, the occurrence of a short circuit due to the conductive burrs remaining on the substrate is suppressed.

  Furthermore, the above-described removal region may be formed before the separation groove is formed. If the first groove and the second groove for separation are formed after the removal region is formed, these grooves do not intersect with each other, so that generation of burrs is prevented and even if burrs are generated, the amount thereof is extremely reduced.

It is a figure which shows the manufacturing method of the circuit board of this invention, and the manufacturing method of a circuit apparatus, (A) is a top view, (B) is the expanded top view, (C) is sectional drawing. It is a figure which shows the manufacturing method of the circuit board of this invention, and the manufacturing method of a circuit device, (A) is a perspective view, (B) is a perspective view, (C) is an enlarged perspective view, (D) is a sectional view. It is a figure which shows the manufacturing method of the circuit board of this invention, and the manufacturing method of a circuit apparatus, (A) is sectional drawing, (B) is a top view. It is sectional drawing which shows the manufacturing method of the circuit board of this invention, and the manufacturing method of a circuit device. It is a figure which shows the manufacturing method of the circuit board of this invention, and the manufacturing method of a circuit apparatus, (A) is sectional drawing, (B) is sectional drawing. It is a figure which shows the structure of the light emitting module manufactured by this invention, (A) is a top view, (B) and (C) are sectional drawings. It is a figure which shows the structure of the hybrid integrated circuit device manufactured by this invention, (A) is a perspective view, (B) is sectional drawing. It is a figure which shows the manufacturing method of the circuit device of background art, (A)-(C) is sectional drawing. It is an image which shows the metal burr | flash which generate | occur | produces in background art.

<First Embodiment: Circuit Board and Circuit Device Manufacturing Method>
In the present embodiment, a method for manufacturing a circuit board and a circuit device will be described with reference to FIGS.

  Referring to FIG. 1, first, a substrate 10 made of a metal such as aluminum or copper is prepared. 1A is a plan view showing the substrate 10, FIG. 1B is an enlarged plan view partially showing the substrate 10, and FIG. 1C is a cross-sectional view of the substrate 10.

  Referring to FIG. 1A, the size of the substrate 10 in plan view is, for example, about vertical × horizontal = 20 cm × 40 cm, and the substrate is composed of several tens to several hundreds of circuit device materials. Become. Here, a region that becomes one circuit device is referred to as a unit 16.

  The units 16 are arranged in a matrix on the upper surface of the substrate 10. A vertical dicing line 12 and a horizontal dicing line 14 are defined between the units 16. In the step of forming the separation groove on the substrate 10, the separation groove is formed along the dicing line 12 and the dicing line 14 on the upper surface and / or the lower surface of the substrate 10. The substrate 10 is separated into units 16 along these dicing lines 12 and 14.

  Referring to FIG. 1B, a plurality of conductive patterns 24 patterned in a predetermined shape are formed on the upper surface of each unit 16. Each unit 16 is formed with a conductive pattern 24 having the same shape. The shape of the conductive pattern 24 differs depending on the type of circuit incorporated in each unit 16. Here, as an example, a conductive pattern 24 for connecting a plurality of LEDs is shown.

  Referring to FIG. 1C, when aluminum is adopted as the material of the substrate 10, the upper surface of the substrate 10 is covered with an oxide film 18 (Al2O3) formed by alumite treatment. Similarly, the lower surface of the substrate 10 is also covered with an oxide film 20 formed by alumite treatment. The oxide films 18 and 20 are materials that are more excellent in wear resistance and corrosion resistance than aluminum, which is the material of the substrate 10. Therefore, by covering the upper and lower main surfaces of the substrate 10 with the oxide films 18 and 20, the wear resistance and corrosion resistance of the substrate 10 itself are improved. The thickness of the substrate 10 is about 1.5 mm, and the thickness of each oxide film is about 5 μm to 10 μm.

The insulating film 22 is formed so as to cover the entire upper surface of the substrate 10 and is made of a resin material such as an epoxy resin that is highly filled with a filler such as granular alumina or silica. By containing the filler, the thermal resistance of the insulating film 22 is reduced, and the thermal expansion coefficient of the insulating film 22 becomes a value approximate to that of the substrate 10. The thickness of the insulating film 22 is, for example, about 50 μm. The conductive pattern 24 is formed by wet-etching a metal film mainly made of copper having a thickness of about 50 μm into a predetermined shape. Furthermore, the upper surface of the insulating film 22 and the conductive pattern 24 are entirely covered with a solder resist, except for locations that are connected to circuit elements later.

  Referring to FIG. 2, next, a separation groove is formed in the substrate 10 along the dicing line. 2A is a perspective view showing this step, FIG. 2B is a perspective view showing the substrate 10 after a separation groove is formed, and FIG. 2C is an enlarged cross-sectional view. FIG. 2D is a cross-sectional view showing a state where grooves are formed.

  Referring to FIG. 2A, in this step, the upper surface of the substrate 10 is partially ground along the dicing line 14 using a cut saw 26 that rotates at a high speed and moves rightward on the paper surface. . Specifically, the substrate 10 made of aluminum, the oxide film 18 and the insulating film 22 are removed in a groove shape by the cut saw 26. Further, when the solder resist is formed on the upper surface of the insulating film 22, the solder resist is ground together with the substrate 10. In addition, since the conductive pattern which comprises each unit is formed inside the part enclosed by the dicing lines 12 and 14, a conductive pattern is not cut off by the cutting process of this process.

  Since the cross-sectional shape of the blade provided at the periphery (tip) of the cut saw 26 has a triangular shape, the groove formed by the cut saw 26 also has a triangular shape. However, the cross-sectional shape of the groove formed in this step may be another shape, for example, a U-shape or a square shape.

  The direction in which the cut saw 26 rotates is the direction indicated by the arrow in FIG. That is, the traveling direction of the lower outer periphery of the cut saw 26 is the same as the traveling direction of the cut saw (the right direction on the paper surface). In other words, the moving direction of the blade provided in the cut saw 26 in the lower half of the cut saw 26 is the same as the traveling direction of the cut saw 26 itself. By doing so, the amount of burrs generated when the substrate 10 is ground by the cut saw 26 is reduced.

  Similarly, grinding by the cut saw 26 is performed along the dicing line 12 orthogonal to the dicing line 14. That is, after forming the groove along the dicing line 14, the substrate 10 is rotated 90 degrees, and the groove is formed again by the cut saw 26.

  Further, here, grinding is performed from the lower surface of the substrate 10 using the cut saw 28. Specifically, as in the case of the upper surface of the substrate 10, the substrate 10 is ground from the lower surface by a cut saw 28 that rotates at high speed along the dicing line 12 and the dicing line 14 defined in advance, so that a separation groove is formed. Form. The substrate 10 and the oxide film 20 are partially removed by grinding with the cut saw 28 to form a separation groove.

  Further, the rotation direction of the cut saw 28 is as indicated by an arrow in FIG. Specifically, the movement direction of the blade provided around the cut saw 28 in the upper half of the cut saw 28 is the same as the direction in which the cut saw 28 itself moves during grinding (rightward on the paper surface). .

  FIG. 2B shows the substrate 10 in which each groove is formed by grinding using the above-described cut saw. A first groove 30 and a second groove 32 are formed in a lattice shape from the upper surface of the substrate 10, and a third groove 46 and a fourth groove 48 are formed from the lower surface of the substrate 10. Here, the first groove 30 and the third groove 46 are arranged so as to overlap in a plan view along the dicing line 12 shown in FIG. Furthermore, the second groove 32 and the fourth groove 48 are arranged so as to overlap in a plan view along the dicing line 14 shown in FIG.

  Here, in the above description, the first groove 30 and the second groove 32 are provided in a lattice shape on the upper surface of the substrate 10, and the third groove 46 and the fourth groove 48 are provided in a lattice shape on the lower surface. A separation groove may be provided only on the surface. That is, the first groove 30 and the second groove 32 are provided only on the upper surface of the substrate 10, and the lower surface of the substrate 10 may remain flat. Furthermore, the third groove 46 and the fourth groove 48 may be provided only on the lower surface of the substrate 10, and the upper surface may remain flat.

  Furthermore, the depths of the grooves (first groove 30 and second groove 32) provided on the upper surface of the substrate 10 and the depths of the grooves (third groove 46 and fourth groove 48) provided on the lower surface may be the same. However, either one may be formed relatively deep.

  In general, when the above-described grinding is performed on aluminum, which has high viscosity among metals, a large amount of burrs tend to be generated on the ground surface. In this step, the amount of burrs generated is reduced by grinding the anodized substrate 10.

  Specifically, referring to FIGS. 2C and 2D, the upper surface of substrate 10 made of aluminum is entirely covered with oxide film 18 having a thickness of about several μm formed by anodizing. Has been. This oxide film 18 (Al 2 O 3) is a material harder than aluminum constituting the substrate 10 itself. Therefore, even if the substrate 10 is ground by the blade 26A of the cut-and-sew, since the upper surface of the substrate 10 in the vicinity of the portion to be ground by the blade 26A is covered with the oxide film 18 and pressed, the generation of burrs accompanying this grinding occurs. It is suppressed.

  Further, since the lower surface of the substrate 10 is also entirely covered with the oxide film 20, even if grinding is performed with the blade 28A of the cut saw, the lower surface of the substrate 10 is covered with the oxide film 20, so Is suppressed.

  As described above, in this embodiment, generation of burrs due to cutting is suppressed as much as possible, but burrs are still generated locally. Specifically, on the upper surface of the substrate 10, burrs are generated at locations where the first grooves 30 and the second grooves 32 intersect. Further, on the lower surface of the substrate 10, a burr is generated at a location where the third groove 46 and the fourth groove 48 intersect. If these burrs are left as they are, they cause a short circuit and are removed together with a part of the substrate 10 in the next step.

  Referring to FIG. 3, next, the substrate 10 is partially removed, and burrs generated in the previous process are separated from the substrate 10. FIG. 3A is a cross-sectional view showing this step, and FIG. 3B is a plan view partially showing the substrate 10 after this step.

  Referring to FIGS. 3A and 3B, the substrate 10 in the vicinity of the location where the first groove 30 and the second groove 32 intersect on the upper surface of the substrate 10 and the vicinity thereof are partially removed. As this removal method, there is a press working using a press die or a cutting work using a router.

  When the removal region 34 is provided by partially removing the substrate 10 by press working, a portion crossing the first groove 30 and the second groove 32 and its peripheral portion (removal region 34) shown in FIG. Then, it is removed by punching with a press die. As the direction of punching, the removal region 34 may be punched from the top to the bottom, or the removal region 34 may be punched from the bottom to the top.

  A burr is generated at a location where the first groove 30 and the second groove 32 intersect, but this burr is also removed together with a part of the substrate 10 in this step. Further, burrs are also generated at the locations where the third grooves 46 and the fourth grooves 48 provided on the back surface of the substrate 10 intersect, and these burrs are also removed together with the removed portion of the substrate 10 by the above-described pressing.

  The shape of the removal region 34 is not particularly limited, but a specific shape is preferably a polygon such as a circle or a rectangle. In particular, as the shape of the removal region 34, when a quadrilateral shape having a corner at a position overlapping the first groove 30 or the second groove is adopted, the side formed by providing the removal region 34 becomes a linear shape. As a result, the shape of the manufactured circuit board in plan view is simplified.

  Referring to FIG. 3 (B), the shape of the removal region 34 is a rhombus that partially protrudes into the unit. Further, the corners constituting the rhombus shape of the removal region 34 are arranged at positions overlapping the first groove 30 or the second groove 32. The portion projecting into the removal region 34 is provided to allow the conductive wire connected to the conductive pattern to pass through to the lower surface side.

  Here, in the above description, the burrs are removed by forming the removal region 34 after each separation groove is formed in the substrate 10, but this order may be changed. That is, the substrate 10 where the grooves intersect each other may be removed in advance to provide the removal region 34, and then each separation groove may be formed in the substrate 10. By doing in this way, with reference to FIG. 3 (B), since the 1st groove | channel 30 and the 2nd groove | channel do not cross | intersect, generation | occurrence | production of a burr | flash is suppressed.

  Next, referring to FIG. 4, circuit elements are connected to the conductive pattern 24 of each unit 16. Here, as a circuit element to be connected, a light emitting device 40 in which an LED is sealed with resin is employed. In each light emitting device 40, the connection terminal connected to the built-in LED is exposed on the lower surface, and this connection terminal is connected to the conductive pattern 24 formed on the upper surface of the substrate 10 via the solder 38.

  In the present embodiment, the solder resist 36 is formed except for locations where circuit elements such as the light emitting device 40 are connected. That is, the conductive pattern 24 and the insulating film 22 are covered with the solder resist 36 except for the portion connected to the light emitting device 40. The solder resist 36 is a material mainly composed of a resin material such as an epoxy resin, and in this case, the solder resist 36 is white in order to increase the reflectance of light emitted from the light emitting device 40.

  Here, when a hybrid integrated circuit described later is incorporated in each unit 16, a transistor such as a MOSFET, an IC, and the like are connected to the conductive pattern 24 via a thin metal wire. Furthermore, chip elements such as chip resistors and chip capacitors are fixed to the conductive pattern 24 via solder.

  Next, referring to FIG. 5, the substrate 10 is separated into each unit 16. The unit 16 can be separated by bending the substrate 10 at the boundary between the units 16 (where a groove is formed) or by using a sharp cutter.

  With reference to FIG. 5A, a method of dividing each unit 16 by bending the substrate 10 will be described. In this method, the substrate 10 is bent so that a portion where the left first groove 30 and the third groove 46 are formed on the paper surface serves as a fulcrum. Since the place where the first groove 30 and the third groove 46 are formed is connected only by the thickness portion where both grooves are not formed, the substrate 10 can be easily removed from this connection portion by bending a plurality of times at this place. Can be separated. Further, the side surface of the substrate 10 is held when bending so that the electric circuit formed on the upper surface of the substrate 10 is not destroyed.

  With reference to FIG. 5B, a method for dividing the substrate 10 by the cutter 44 will be described. A disk-shaped cutter 44 having a sharp tip is provided on the support 42 so as to be rotatable. Then, the remaining thickness portion of the substrate 10 between the first groove 30 and the third groove 46 is removed by moving the support portion 42 while pressing the cutter 44 against the first groove 30.

  Further, the separation of the unit 16 described above is also performed at a location where the second groove 32 and the fourth groove 48 shown in FIG. 2B are formed. Furthermore, as a method for separating each unit 16, laser irradiation, punching, or the like may be adopted in addition to the above-described method.

  Each unit 16 that has undergone the above-described steps may be provided to the user as a product as it is, or a circuit formed on the upper surface may be sealed. In the case of sealing, the upper surface and side surfaces of the substrate 10 included in each unit 16 are covered with a sealing resin formed by transfer molding or dipping. Further, sealing with a case material covering the upper surface may be performed.

<Second Embodiment: Configuration of Circuit Device to be Manufactured>
With reference to FIGS. 6 and 7, the configuration of the circuit device manufactured by the above-described manufacturing method will be described. As an example of the manufactured circuit device, the light emitting module 50 will be described with reference to FIG. 6, and the configuration of the hybrid integrated circuit device 60 will be described with reference to FIG.

  The configuration of the light emitting module 50 will be described with reference to FIG. 6A is a plan view showing the light emitting module 50, FIG. 6B is a cross-sectional view taken along the line BB ′ of FIG. 6A, and FIG. 6C is FIG. It is sectional drawing in CC 'line of A).

  Referring to these drawings, light emitting module 50 includes circuit board 52, conductive patterns 24A-24F formed on the upper surface of circuit board 52, and light emitting device 40 connected to these conductive patterns 24A-24F. It is prepared for.

  The circuit board 52 is manufactured by the above-described manufacturing method and is made of a metal such as aluminum having a thickness of about 1.5 mm. The upper and lower surfaces of the circuit board 52 are covered with oxide films 18 and 20 formed by anodizing. The upper surface of the oxide film 18 is covered with an insulating film 22 made of a resin material containing a filler, and a conductive pattern 24 is formed on the upper surface of the insulating film 22. Further, the conductive pattern 24 other than the portion connected to the light emitting device 40 is covered with a solder resist 36.

  Referring to FIG. 6A, conductive patterns 24A-24F that are separated from each other are formed on the upper surface of circuit board 52, and these conductive patterns 24A-24F have a circular outer edge as a whole. Is arranged. The light emitting device 40 is connected so as to bridge adjacent conductive patterns. As a result, the five light emitting devices 40 are connected in series via the conductive patterns 24A-24F. Further, a part of the conductive pattern 24 </ b> A is a terminal portion 54 </ b> A that is exposed without being covered with the solder resist 36. Further, a part of the conductive pattern 24F is exposed to form a terminal portion 54B. Terminal portions 54A and 54B are connected to an external power source.

  The shape of the circuit board 52 in plan view has a quadrangular shape with chamfered corners. Referring to FIG. 6A, the circuit board 52 includes side surfaces 52A-52H. The side surfaces 52A, 52C, 52E, and 52G are side surfaces formed by providing separation grooves as shown in FIG. On the other hand, the side surfaces 52B, 52D, 52F, and 52H are side surfaces formed by the punching process or the router process shown in FIG.

  In addition, a rectangular cutout 54 is formed on the inner side from the side surface 52H, and this cutout 54 is used to pass the conductive wire connected to the terminal portions 54A and 54B from the upper surface side to the lower surface side. It is done. The side surface of the notch 54 is formed by pressing or router processing.

  Referring to FIG. 6B, side surface 52A and side surface 52E are side surfaces provided with an inclined surface. Specifically, the side surface 52A has an inclined surface 55 that inclines so as to bulge outward continuously from the upper surface of the circuit board 52, and an inclined surface 56 that inclines so as to bulge outward continuously from the lower surface of the circuit board 52. It is composed of This configuration is the same for the side surfaces 52C, 52E, and 52G.

  With reference to FIG. 6C, the side surface 52 </ b> B is a flat surface perpendicular to the upper surface and the lower surface of the circuit board 52. This configuration is the same for the side surfaces 52D, 52F, and 52H.

  The light emitting module 50 having the above-described configuration is incorporated as an illumination source in a lighting device such as a flashlight. When employed in a flashlight, the light emitting module 50 is incorporated at the front end of the casing constituting the flashlight. Terminal portions 54A and 54B shown in FIG. 6A are connected to a built-in battery. Further, the conductors connecting the terminal portions 54A, 54B and the battery are arranged so as to pass through the notch portion 54.

  The configuration of the hybrid integrated circuit device 60 will be described with reference to FIG. FIG. 7A is a perspective view showing the hybrid integrated circuit device 60, and FIG. 7B is a sectional view thereof.

  The hybrid integrated circuit device 60 includes a circuit board 52, a conductive pattern 24 formed on the upper surface of the circuit board 52, a circuit element 62 connected to the conductive pattern 24, and leads connected to pads made of the conductive pattern 24. 64 is mainly provided.

  With reference to FIG. 7A, the shape of the circuit board 52 in plan view is a rectangular shape with corners cut off, as described above. That is, the main side surfaces 52A, 52C, 52E, and 52G are arranged so as to have a rectangular shape, and the side surfaces 52B, 52D, 52F, and 52H are arranged so that the corners of the rectangular shape are chamfered linearly.

  As described with reference to FIG. 6, the main side surfaces 52 </ b> A, 52 </ b> C, 52 </ b> E, 52 </ b> G are formed of inclined surfaces, and the side surfaces 52 </ b> B, 52 </ b> D, 52 </ b> F, 52 </ b> H are perpendicular to the upper surface of the circuit board 52.

  As circuit elements connected to the conductive pattern 24, a large number of transistors, ICs, chip capacitors, chip resistors, and the like are employed. The circuit element 62 and the conductive pattern 24 are connected using a conductive bonding material such as solder or a thin metal wire.

  Referring to FIG. 7B, the upper surface and side surfaces of circuit board 52 having the above-described configuration are covered with sealing resin 58. Here, in order to release the heat generated by driving the circuit element 62 to the outside through the circuit board 52, the lower surface of the circuit board 52 is not covered with the sealing resin 58 and exposed to the outside. ing. However, the lower surface of the circuit board 52 may be covered with the sealing resin 58 in order to improve the moisture resistance of the entire apparatus.

10 substrate 12 dicing line 14 dicing line 16 unit 18 oxide film 20 oxide film 22 insulating films 24, 24A-24F conductive pattern 26 cut saw 26A blade 28 cut saw 28A blade 30 first groove 32 second groove 34 removal region 36 solder resist 38 solder 40 Light emitting device 40A, 40B, 40C, 40D Light emitting device 42 Support portion 44 Cutter 46 Third groove 48 Fourth groove 50 Light emitting module 52 Circuit board 52A, 52B, 52C, 52D, 52E, 52F, 52G, 52H Side face 54 Notch 54A, 54B Terminal 55 Inclined surface 56 Inclined surface 58 Sealing resin 60 Hybrid integrated circuit device 62 Circuit element 64 Lead

Claims (8)

A step of preparing a substrate on which units composed of a plurality of conductive patterns are formed in a matrix;
Providing a first groove and a second groove orthogonal to each other along a boundary of each unit on one main surface of the substrate;
Separating the substrate for each of the units at a location where the first groove and the second groove are provided, and
A method of manufacturing a circuit board, comprising: providing a removal region by partially removing a portion where the first groove and the second groove of the substrate intersect. In the step of providing the first groove and the second groove,
2. The method for manufacturing a circuit board according to claim 1, wherein a third groove and a fourth groove are provided on the other main surface of the substrate corresponding to the first groove and the second groove.   3. The method for manufacturing a circuit board according to claim 2, wherein the shape of the removal region is a polygonal shape having a corner portion at a position overlapping the first groove or the second groove. Burr occurs at the point where the first groove and the second groove intersect and the point where the third groove and the fourth groove intersect,
4. The method for manufacturing a circuit board according to claim 3, wherein when the removal region is provided, the burr is separated from the substrate together with a portion to be removed of the substrate.   The circuit board manufacturing method according to claim 4, wherein the removal region is formed by pressing or cutting. The substrate is a metal substrate mainly composed of aluminum in which the one main surface and the other main surface are coated with an oxide film,
6. The first groove, the second groove, the third groove, and the fourth groove are formed by grinding the substrate with a dicing saw that rotates at a high speed. A method of manufacturing a circuit board.   The circuit board manufacturing method according to claim 6, wherein when the dicing saw grinds the substrate, a traveling direction of a blade provided in the dicing saw is the same as a traveling direction of the dicing saw. Method. A method for manufacturing a circuit device, comprising: a step of fixing a circuit element to a circuit board manufactured by the method for manufacturing a circuit board according to claim 1.