JP2018101720A - Multi-piece wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which makes it possible to perform electrolytic plating before singulation by dicing and which is unlikely to cause burrs and cracks at the time of singulation by dicing.SOLUTION: A multi-piece wiring board 2Aon which a plurality of electronic component housing packages 1Aare arranged in a grid and dicing grooves 5 are formed on border lines of individual electronic component housing packages 1Aincludes: an insulating plate 6; conductor layers 7 joined to at least one of an upper surface and a lower surface of the insulating board 6; plating wiring 8 for connecting the conductor layers 7 with each other on at least one of the upper surface and the lower surface of the insulating plate 6; and insulator layers 10 each of which covers at least a surface of the plating wiring 8 at a portion where the dicing groove 5 is formed, in which a bottom of the dicing groove 5, which is formed on the insulator layer 10 does not reach the plating wiring 8.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multi-piece wiring board in which a plurality of wiring board regions are arranged vertically and horizontally, and divided grooves are formed along the boundaries of the wiring board regions, and a method for manufacturing the same.

  Conventionally, as an electronic component package for mounting an electronic component such as a semiconductor element or a crystal resonator, for example, techniques disclosed in Patent Document 1 and Patent Document 2 described below are known.

Patent Document 1 has a name of “wiring board and multi-cavity wiring board”, a wiring board on which various electronic components such as a crystal resonator can be mounted on the surface so as to be able to be sealed, and a large number including a plurality of the wiring boards. An invention related to a single-piece wiring board is disclosed.
When the invention disclosed in Patent Document 1 is described using the reference numerals described in the document as they are, the substrate body 2a made of ceramic (insulating material) and having a front surface 3 and a rear surface 4 that are rectangular in plan view, A plurality of back surface electrodes 10 formed on the back surface 4 of the substrate body 2a, a frame-shaped conductor portion 7 which is disposed on the front surface 3 side of the substrate body 2a and has a rectangular frame shape in plan view, and the substrate body 2a, Via conductors 9 conducting between the plurality of back surface electrodes 10 and the frame-shaped conductor portion 7, and between the plurality of back surface electrodes 10 and the sides 4 a and 4 b on the back surface 4 of the substrate body 2 a 4 is exposed, and on the back surface 4 of the substrate body 2a, at least one or more convex wirings between the plurality of back surface electrodes 10 and a pair of sides 4a and 4b intersecting each other. 12 is formed. .
In the invention disclosed in Patent Document 1, such an individual package as shown in FIGS. 1 to 5 in Patent Document 1 is shown in FIGS. 7 and 8 in the same document. It is manufactured by dividing and dividing a multi-piece substrate along the dividing groove.
An upper conductor layer (for example, frame-shaped conductor portion 7) is provided on the surface side of the product region (a grid-like region at the center) of the multi-cavity substrate as shown in FIGS. On the other hand, a lower conductor layer (for example, the back conductor layer 10) is formed on the back side.
Further, the lower conductor layers described above are connected to each other by a wiring for plating (main line portion 30) as shown in FIG. 8 in Patent Document 1, and the lower conductor layer and the upper conductor layer are connected to the substrate body. It is electrically connected through a via conductor 9 formed so as to penetrate the inside of 2a.
For this reason, by carrying out electrolytic plating while energizing the wiring for plating on the multi-piece substrate as described above, the wiring for plating exposed on the surface of the upper conductor layer and the lower conductor layer, the substrate body 2a, etc. A plating film can be formed on the surface of the film.

Patent Document 2 has a name of “ceramic package and manufacturing method thereof”, and a groove for division (hereinafter referred to as a snap line) is formed in a laminated body of ceramic green sheets so as to be divided into a ceramic package after firing. An invention relating to a ceramic package and a method for manufacturing the same is disclosed.
A ceramic package which is an invention disclosed in Patent Document 2 has a ceramic green sheet laminate provided with conductor wiring, and has grooves for dividing after firing in the X direction and the Y direction perpendicular to each other. In a ceramic package formed by firing a laminate of sheets and dividing along a groove, the groove is a deep groove in one of the X direction and the Y direction, and the other is a shallow groove in contrast to the deep groove. It is characterized by this.
According to the invention disclosed in Patent Document 2 having the above-described configuration, the plated wiring can be accommodated in the internal cross section of the ceramic package, so that the division grooves can be formed on the front surface and the back surface of the multi-piece substrate. As a result, when dividing and dividing a multi-piece substrate made of the invention disclosed in Patent Document 2, burrs are generated, or the fracture surface is formed in an unintended direction. It can suppress suitably that a defect arises.

Japanese Patent Laid-Open No. 2006-72606 JP 2002-9188 A

Usually, the plating wiring is formed across the boundary (division planned position) between the ceramic packages. For this reason, in the board | substrate body 2a in the invention disclosed by patent document 1, the surface which forms a plating wiring cannot form a division groove.
For this reason, in the case of the invention disclosed in Patent Document 1, burrs are generated when divided into individual pieces, or external defects occur in the ceramic package due to the formation of the fractured surface in an unintended direction. There was a problem that the risk was increased, thereby reducing the productivity of the product.

According to the invention disclosed in Patent Document 2, the problems as disclosed in Patent Document 1 can be solved.
On the other hand, in order to store the plated wiring in the ceramic substrate, it is necessary to use a multilayer substrate, which may be disadvantageous for reducing the height of the ceramic package.

  The present invention has been made in response to such a conventional situation, and when dividing a multi-piece wiring board into individual pieces, a large number that can prevent the appearance defect and increase the yield rate. A wiring board and a manufacturing method thereof are provided.

In order to solve the above problems, the multi-piece wiring board according to the first aspect of the present invention has a plurality of electronic component storage packages arranged in a grid pattern, and a dividing groove is formed on the boundary line between the individual electronic component storage packages. A multi-layer wiring board, wherein the insulating plate, the conductive layer bonded to at least one of the upper and lower surfaces of the insulating plate, and the conductive layers are connected to each other on either the upper or lower surface A plating wiring and an insulating layer covering at least a portion of the plating wiring where the dividing groove is formed, and the bottom of the dividing groove formed on the insulating layer is: It does not reach the plating wiring.
In the first invention having the above configuration, the insulating plate has an action of insulating conductors including a conductor layer disposed on the surface and / or inside thereof. Further, the conductor layer has an effect of transmitting an electric signal to the surface or inside of the insulating plate and serving as a base when joining a metal frame or an electronic component as necessary. Furthermore, the wiring for plating has the effect | action of connecting the conductor layers joined to at least one of the upper surface or lower surface of an insulating board, and making it mutually conduct | electrically_connect. Further, the insulating layer covers the portion where the dividing groove on the plating wiring is formed, and thus has an effect of preventing the dividing groove from reaching the plating wiring. Furthermore, the bottom of the dividing groove formed on the insulator layer is configured not to reach the plating wiring, thereby reliably preventing the plating wiring from being divided by the dividing groove when forming the dividing groove. Has an effect.

The multi-piece wiring board according to the second invention is the first invention described above, wherein at least a part of the insulator layer in the thickness direction is embedded in the insulating plate and formed on the insulator layer. The bottoms of the divided grooves formed and the bottoms of the divided grooves formed other than on the insulator layer are continuous.
In the second invention having the above-described structure, in addition to the same action as that of the first invention described above, a blade having a blade edge aligned at a constant position is pushed against the multi-cavity wiring board before firing at the time of manufacture. Even when applied, it has the effect of forming the dividing grooves arranged parallel to each other (including the concept of substantially parallel) at one time without damaging the plating wiring.

The multi-piece wiring board according to the third invention is the first or second invention described above, and the insulator layer has the surface height and the surface height of the insulating plate embedded substantially the same. It is characterized by this.
The third invention having the above-described configuration has the same action as that of the first or second invention described above. In addition, when the insulator layer according to the third invention is formed of ceramic in particular, the ceramic is more fragile than metal, so that the insulator layer is likely to be damaged in the manufacturing process of the multi-piece wiring board. And the risk that a defect occurs in the insulator layer increases as the protrusion amount of the insulator layer on the surface of the insulator increases. In addition, the defect in the insulator layer means that the division groove in the defect portion disappears, and in that case, an appearance defect tends to occur when the multi-piece wiring board is divided into pieces.
Therefore, according to the third aspect of the present invention, there is an effect of reducing the risk that a defect occurs in the insulator layer at the time of manufacture.

A multi-piece wiring substrate according to a fourth aspect of the present invention is any one of the first to third aspects described above, wherein the insulating plate is a ceramic multilayer substrate.
In addition to the same operation as the first to third inventions described above, the fourth invention with the above configuration is that the insulating plate is a ceramic multilayer substrate, so that the wiring circuit is accommodated between the layers made of the insulating plate. Is possible.
In this case, it becomes possible to manufacture an individual electronic component storage package (wiring board) having a more compact form and having a complicated transmission circuit.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a multi-piece wiring board, wherein a plurality of electronic component storage packages are arranged in a grid pattern, and a dividing groove is formed on a boundary line between the individual electronic component storage packages. A method for producing a multi-cavity wiring board, wherein an unfired conductive paste is disposed at a desired location of a sheet-like unfired ceramic sheet to form an unfired conductor layer and unfired plated wiring. And a non-fired insulator layer forming step of laminating a non-fired insulator layer on the non-fired plated wiring, and a step of forming a split groove, and the split groove formed in the non-fired insulator layer is The unsintered plated wiring is not reached.
The fifth invention having the above-described configuration is obtained by capturing the first invention as a method invention. In the fifth invention having the above-described configuration, the unfired conductive paste is disposed in the desired portion of the sheet-like unfired ceramic sheet so that the unfired conductor layer and the unfired plated wiring are disposed. Has the effect of forming. Further, the unsintered insulator layer forming step has an effect of forming a non-sintered insulator layer on at least the unsintered plated wiring. Further, the divided groove forming step has an effect of forming the divided grooves in the unfired ceramic sheet having the unfired conductive paste and the unfired insulator layer. And when performing this division | segmentation groove | channel formation process, the division | segmentation groove | channel formed will be in the state which has not reached | attained the unsintered plating wiring, and when the division | segmentation groove | channel is formed, unintentional division | segmentation arises in the unbaking plating wiring Has the effect of preventing

The method for manufacturing a multi-cavity wiring board according to a sixth aspect of the present invention is the fifth aspect described above, wherein after the unfired insulator layer forming step, the unfired insulator layer is pressed to form an unfired insulator. And a pressing step of embedding part or all of the layer in the thickness direction inside the unfired ceramic sheet.
The sixth invention having the above-described configuration includes a pressing step of embedding part or all of the unfired insulator layer in the thickness direction of the unfired ceramic sheet in addition to the same action as that of the above-described fifth invention. This has the effect of reducing the height difference between the upper surface of the unfired insulator layer protruding on the unfired ceramic sheet and the surface of the unfired ceramic sheet. Thereby, when forming a division | segmentation groove | channel on a non-baking insulator layer, it has the effect | action of suppressing that the defect | deletion which a non-fired insulator layer does not intend occurs.

The method for manufacturing a multi-cavity wiring board according to a seventh aspect of the present invention is the fifth aspect described above, wherein after the pressing step, the dividing grooves are formed by a plurality of blades having the same cutting edge height. And a dividing groove forming step.
In the seventh invention having the above-described configuration, in addition to the same action as that of the above-described sixth invention, when using a plurality of blades having the same height of the blade edge when forming the dividing grooves, A plurality of divided grooves arranged in parallel to each other on the surface of the unfired ceramic sheet can be obtained by performing the operation of pressing the blade once on the surface of the unfired ceramic sheet having the conductive paste and the unfired insulator layer. It has the effect of forming at a time.
On the other hand, as another method for forming the dividing groove on the surface of the unfired ceramic sheet, a method of irradiating laser light is known. However, when forming the dividing groove by laser irradiation, the dividing groove is used. Need to be formed one by one, and it is difficult to improve the productivity.
On the other hand, when the dividing groove is formed using a blade, a plurality of dividing grooves can be formed at the same time, so that it has an effect of improving productivity when manufacturing a multi-piece wiring board. .

According to the first and fifth inventions as described above, the multi-cavity wiring in which the plating wiring is not divided by the division grooves while having the division grooves on both the upper surface and the lower surface of the multi-cavity wiring board. A substrate can be manufactured.
In this case, when the insulating layer is broken along the dividing groove when the multi-layered wiring board is divided into individual parts having the plating film formed on the surface of the conductor layer arranged on the surface of the wiring board It is possible to suitably prevent the appearance of defective burrs caused by burrs or chips on the fractured surface to be formed. Therefore, according to the first aspect of the invention, when manufacturing the individual electronic component storage package, it is possible to prevent the product from being defective due to the appearance defect, thereby improving the productivity of the product. be able to.
According to the first and fifth inventions, since the insulator layer is formed on the plated wiring in the portion where the dividing groove is formed, the plating film is formed on the portion where the dividing groove is formed on the plated wiring. Is not formed. Therefore, as in the case of the prior art (for example, the invention disclosed in Patent Document 1), when the multi-piece wiring board according to the first invention is divided into pieces, it is formed on the plated wiring. There is no problem that the plating film is stretched, torn, or part of the plating film is peeled off from the fracture surface. As a result, when the multi-piece wiring board according to the first and fifth inventions is divided into pieces, the risk of appearance defects occurring in the separated electronic component storage package is greatly reduced. Can do.
Therefore, according to the first and fifth inventions, it is possible to increase the non-defective product rate of the individual ceramic package having the plating film on the surface and to greatly improve the productivity.

According to each of the second, third, sixth, and seventh inventions described above, in addition to the same effects as those obtained by the first invention, the surface of the unfired ceramic sheet and the The height difference from the surface of the fired insulator layer can be reduced. In this case, it becomes possible to form a dividing groove using a blade in an unfired ceramic sheet having an unfired conductive paste and an unfired insulator layer during the production.
When dividing grooves are formed by irradiating laser light, the dividing grooves must be formed one by one, whereas when a blade is used, a plurality of dividing grooves can be formed simultaneously. For this reason, the productivity of the multi-cavity wiring board according to the present invention can be improved.

In particular, as in the case of the third invention, when there is no difference in level between the surface of the unfired ceramic sheet and the surface of the unfired insulator layer (which is a concept including “not substantially”), insulation is performed at the time of manufacture. It is possible to prevent the chipping or partial loss of part of the body layer.
As described above, in the multi-cavity wiring board, the loss of the insulating layer in the part where the split grooves are formed means that a part of the split grooves disappears from the multi-cavity wiring board. . In this case, the appearance defect is likely to decrease when the multi-piece wiring board is divided into individual pieces to manufacture an electronic component storage package.
On the other hand, according to the third invention, since the insulator layer is embedded in the thickness portion of the insulator, it is possible to prevent an external force from acting on the insulator layer from acting, It is possible to reliably prevent the body layer from being lost.

It is a top view of the lower surface side of the multi-piece wiring board which concerns on Example 1 of this invention. It is a top view of the upper surface side of the multi-piece wiring board which concerns on Example 1 of this invention. It is a fragmentary sectional view of the multi-piece wiring board concerning Example 1 of the present invention. (A) It is a top view of the electronic component storage package which concerns on Example 1 of this invention, (b) It is sectional drawing in the BB line. (A) Partial cross-sectional view of a multi-cavity wiring board according to a modification of the first embodiment of the present invention, (b) Partial cross-section of a multi-cavity wiring board according to another modification of the first embodiment of the present invention. FIG. (A) It is a fragmentary sectional view which shows the formation state of the division | segmentation groove | channel in the electronic component storage package which concerns on Example 1 of this invention, (b) In the electronic component storage package which concerns on the modification of Example 1 of this invention It is a fragmentary sectional view which shows the formation state of a division groove, (c) It is a fragmentary sectional view which shows the formation state of the division groove in the electronic component storage package which concerns on the other modification of Example 1 of this invention. It is a flowchart which shows the manufacturing process of the multi-cavity wiring board which concerns on Example 1 of this invention. (A) It is a cross-sectional conceptual diagram of the unbaking ceramic sheet preparation process in the manufacturing process of the multi-cavity wiring board which concerns on Example 1 of this invention. (B) It is a cross-sectional conceptual diagram of the unbaking electrically conductive paste arrangement | positioning process in the manufacturing method. (C) It is a cross-sectional conceptual diagram of the unbaking insulating layer formation process in the manufacturing method. (D) It is a cross-sectional conceptual diagram of the division | segmentation groove | channel formation process in the manufacturing method. (E) It is a cross-sectional conceptual diagram of the metal ring joining process in the manufacturing process of the multi-cavity wiring board based on Example 1 of this invention. (F) It is a cross-sectional conceptual diagram of the plating film formation process in the manufacturing method. (G) It is a cross-sectional conceptual diagram of the division | segmentation and piece-dividing process in the manufacturing method. (H) It is a cross-sectional conceptual diagram of the pressing step in the manufacturing process of the multi-cavity wiring board according to the modification of Example 1 of the present invention, (i) is a cross-sectional conceptual diagram of the dividing groove forming step in the manufacturing method, (J) It is a cross-sectional conceptual diagram at the time of completion of the metal ring joining process and plating film formation process in the manufacturing method, (k) It is a cross-sectional conceptual diagram of the division | segmentation and individualization process in the manufacturing method. (A) It is a top view of the electronic component storage package which concerns on Example 2 of this invention, (b) It is sectional drawing in the CC line. It is a flowchart which shows the manufacturing process of the electronic component storage package which concerns on Example 2 of this invention.

  A multi-cavity wiring board and a manufacturing method thereof according to an embodiment of the present invention will be described in detail with reference to FIGS.

First, a multi-cavity wiring board according to the first embodiment and its modification will be described with reference to FIGS. 1 to 3.
FIG. 1 is a plan view of the lower surface side of a multi-piece wiring board according to Embodiment 1 of the present invention. FIG. 2 is a plan view of the upper surface side of the multi-piece wiring board according to the first embodiment of the present invention. FIG. 3 is a partial cross-sectional view of the multi-piece wiring board according to the first embodiment of the present invention. 3 is a cross-sectional view taken along line AA in FIG.
As shown in FIGS. 1 and 2, the multi-piece wiring board 2A _{1 according to the} first embodiment of the present invention includes a plurality of electronic component storage packages 1A ₁ arranged in a grid pattern, and each electronic component storage package. The dividing groove 5 is formed on the boundary line of the insulating plate 6 and is joined to at least one of the insulating plate 6 and the upper surface 6a or the lower surface 6b of the insulating plate 6 (see FIG. 3 for the upper surface 6a and the lower surface 6b). The conductive layer 7, the plating wiring 8 that connects the conductive layers 7 on either the upper surface 6a or the lower surface 6b of the insulating plate 6, and the portion where the dividing grooves 5 are formed. And an insulating layer 10 covering at least the wiring 8, and further, as shown in FIG. 3, the dividing groove 5 is formed in the insulating layer 7 so that the bottom does not reach the plating wiring 8. It is formed.

In the multi-cavity wiring board 2A _{1 according to the} first embodiment, an area in which a plurality of electronic component storage packages 1A ₁ are arranged in a grid pattern is referred to as a product area 3. As shown in FIGS. 1 and 2, the multi-piece wiring board 2 </ b> A ₁ according to the first embodiment may include a dummy area 4 around the product area 3 as necessary (selective essential components). ).
In general, in a multi-piece wiring board, a portion near the periphery tends to be warped or distorted, and tends to be defective when it is made into a final product (a piece-shaped electronic component storage package). . In view of such circumstances, by providing the dummy region 4 so as to surround the product region 3, the product region 3 is not provided in the peripheral region where the warp and the distortion are generated, and the insulation is less likely to be affected by the warp and the distortion. The product region 3 may be provided at the center of the plate 6. In this case, it is possible to greatly reduce the risk that the final product becomes defective as compared with the case where the dummy region 4 is not provided.

As shown in FIG. 3, in the multi-cavity wiring board 2A1 according to the _first embodiment, a metal ring 12 may be bonded on the conductor layer 7 provided on the upper surface 6a side of the insulating plate 6 ( Optional mandatory component). Although not shown in FIG. 3, the metal ring 12 is joined to the conductor layer 7 provided on the upper surface 6a side of the insulating plate 6 via, for example, a metal brazing material.
The effect of the multi-piece wiring board 2A1 according to the _first embodiment having the metal ring 12 will be described later.

Further, in the multi-cavity wiring board 2A _{1 according to the} first embodiment as shown in FIGS. 1 to 3, the insulating layer 10 is laminated on the plating wiring 8 in the portion where the dividing groove 5 is formed, The dividing groove 5 is formed in the insulator layer 10, and in addition, the plating wiring 8 is divided by the dividing groove 5 because the bottom of the dividing groove 5 does not reach the plating wiring 8. Can be suitably prevented.
Therefore, according to the multi-cavity wiring board 2A1 according to the _first embodiment, the electrode wiring is connected to the terminal portion 11 provided at the terminal portion of the plating wiring 8, and the electrolytic plating treatment is performed. When the bare surface of the conductor layer 7 to be connected and the conductor layer 7 include the metal ring 12, a plating film 13 can be formed on the bare surface of the metal ring 12 (see FIG. 3).

In the multi-cavity wiring board 2A _{1 according to the} first embodiment, the conductor layer 7 disposed on the upper surface 6a side of the insulating plate 6 and the conductor layer 7 disposed on the lower surface 6b side of the insulating plate 6 are provided. Alternatively, they may be electrically connected by a via conductor 9 formed through the insulating plate 6 (optional essential component).
In this case, by energizing the plating wiring 8 formed on the lower surface 6 b side of the insulating plate 6, the conductor layer 7 formed on the lower surface 6 b side of the insulating plate 6, or the conductor layer 7 is connected to the metal ring 12. In addition to being able to form the plating film 13 on the bare surface, the conductor layer 7 formed on the surface 6a side of the insulating plate 6 and the case where the conductor layer 7 includes the metal ring 12 The plating film 13 can also be formed on the bare surface.

When the plating wiring 8 is formed on both the upper surface 6 a side and the lower surface 6 b side of the insulating plate 6, the conductor layers 7 and the metal on both surfaces of the insulating plate 6 are provided even if the insulating plate 6 is not provided with the via conductor 9. A plating film 13 can be formed on the bare surface of the ring 12.
That is, when the via conductor 9 is not provided on the insulating plate 6, the plating wiring 8 is provided on each of the upper surface 6a side and the lower surface 6b side of the insulating plate 6, and the upper surface 6a side and the lower surface 6b side of the insulating plate 6 are provided. By covering at least the insulating layer 10 at the intersection with the dividing groove 5 in the plating wiring 8 provided on each of them, both the plating wiring 8 and the dividing groove 5 exist on the surface of the insulating plate 6. I can leave.
In this case, even when the plating wiring 8 is provided on both the upper surface 6 a side and the lower surface 6 b side of the insulating plate 6, it is possible to suitably prevent the plating wiring 8 from being divided by the dividing grooves 5.
In the present specification, when one surface of the insulating plate 6 is the upper surface 6a, the opposite surface is called the lower surface 6b, and these can be interchanged.

In general, “wiring for plating” means wiring for current path during device operation in order to be able to perform electroplating by connecting each wiring to the electrode for plating separately from wiring as current path during device operation. It is a general term for wiring provided separately.
In addition, this “plating wiring” usually does not indicate only a multi-piece wiring board or a surface provided on the surface (upper surface or lower surface) of each wiring board (electronic component storage package), but inside the wiring board. May be provided. Furthermore, it is not necessary to provide the current path for the "plating wiring" and device operation in a state where both are completely separated and independent. Depending on the purpose and function of the wiring board, the "plating wiring" and the device operation In some cases, part of the current path wiring is shared.
However, in this specification, what is formed to electrically connect the conductor layers 7 arranged on the same plane on the upper surface 6a or the lower surface 6b of the insulating plate 6 in the horizontal direction is particularly referred to as “plating wiring 8”. I will call it.

Next, the effect of the multi-cavity wiring board 2A1 according to the _first embodiment will be described in more detail with reference to FIG.
4A is a plan view of the electronic component storage package according to the first embodiment of the present invention, and FIG. 4B is a cross-sectional view taken along the line BB. The same parts as those described in FIGS. 1 to 3 are denoted by the same reference numerals, and description of the configuration is omitted.
According to the multi-piece wiring board 2A1 according to the _first embodiment as shown in FIGS. 1 to 3, the dividing grooves 5 are formed so as to be paired with both the upper surface 6a and the lower surface 6b of the insulating plate 6. Therefore, it is possible to form a fracture surface 5b (see FIG. 4) in which the bottoms of the divided grooves 5 that form a pair at the time of dividing into pieces are connected.
Incidentally, like those by dividing the multiple patterning wiring board 2A ₁ according to the first embodiment along the dividing grooves 5, as described above formed by singulation is shown in FIG. 4 (a), (b) 1 is an electronic component storage package 1A _{1 according} to the first embodiment.

Then, the multi-piece wiring substrate 2A ₁ according to the first embodiment illustrated in FIGS. 1 to 3, provided with a dividing groove 5 on both sides of the upper surface 6a and the lower surface 6b of the through insulating plate 6 above, and this split groove 5 There by being formed in pairs on both surfaces of the insulating plate 6, when the individual pieces by dividing the multiple patterning wiring board 2A _1, either one of the upper surface 6a or the lower surface 6b of the insulation board 6 It is possible to prevent the fracture surface 5b from being formed in an unintended direction as in the case where the dividing groove 5 is formed only in the case (for example, Patent Document 1).
As a result, burrs and chips are generated on the fracture surface 5b of the electronic component storage package 1A1 according to the _first embodiment obtained by dividing the multi-cavity wiring board 2A1 according to the _first embodiment, which causes the appearance defect. Can be prevented.
Further, in the multi-cavity wiring board 2A _{1 according to the} first embodiment, the plating wiring 8 in the portion where the dividing groove 5 is formed is covered with the insulator layer 10, and therefore, it is arranged immediately below the dividing groove 5. The plating film 13 is not formed on the plating wiring 8.
Therefore, when the individual pieces by dividing the multiple patterning wiring board 2A ₁ according to Example 1 after forming the plating film 13, a plating film 13 at the periphery of the electronic component storing package 1A ₁ is turned up, stretched This will not cause any problems such as tearing. Therefore, also from this point, it is possible to suitably prevent the appearance defect from occurring in the electronic component storage package 1A ₁ manufactured from the multi-piece wiring board 2A _{1 according} to the _first embodiment.
Thus, according to the number according to the first embodiment patterning wiring board 2A _1, since the non-defective electronic component storing package 1A ₁ can be efficiently produced, it is possible to improve the productivity.

As shown in FIG. 4B, the electronic component storage package 1A _{1 according to the} first embodiment has an electronic component 14 (for example, a crystal) in a hollow portion (cavity) formed of an insulating plate 6 and a metal ring 12. After a resonator or a semiconductor element is housed or mounted, the metal ring 12 is used in a state where the opening of the metal ring 12 is sealed with a metal lid 15.
An electronic device according to the present invention includes the electronic component storage package 1A _{1 according} to the first embodiment shown in FIG. 4B, the electronic component 14, and the lid 15.

Next, a multi-piece wiring board according to a modification of the first embodiment will be described with reference to FIG.
FIG. 5A is a partial cross-sectional view of a multi-piece wiring board according to a modification of the first embodiment of the present invention, and FIG. 5B is a multi-piece according to another modification of the first embodiment of the present invention. It is a fragmentary sectional view of a wiring board. The same parts as those described in FIGS. 1 to 4 are denoted by the same reference numerals, and description of the configuration is omitted.
The multi-piece wiring board 2A _{2 according} to the modification of the first embodiment is such that a part in the thickness direction of the insulator layer 10 in the multi-piece wiring board 2A _{1 according to the} first embodiment shown in FIG. Further, the bottom of the dividing groove 5 formed in the insulating plate 6 and the bottom of the dividing groove 5 formed in the insulator layer 10 are continuous. Needless to say, at this time, not only the insulating layer 10 but also at least a part in the thickness direction of the conductor layer 7 and the plating wiring 8 disposed under the insulating layer 10 are embedded in the insulating plate 6. .
In the multi-piece wiring board 2A _{2 according} to the modified example of the first embodiment, the height difference between the surface of the insulating plate 6 (the lower surface 6b in FIG. 5) and the upper surface of the insulating layer 10 is shown in FIG. It can be made smaller than that of the multi-piece wiring substrate 2A ₁ of example 1.

In this case, at the time of manufacturing the multi-cavity wiring board 2A _{2 according} to the modification of the first embodiment, the insulator layer 10 (or the unfired insulator layer 10) protruding on the insulating plate 6 is physically exposed from the outside. It is possible to suitably prevent a part of the chip from being lost due to an impact.
As another factor that makes it difficult for the insulator layer 10 (or the unfired insulator layer 10) to be lost, the insulator layer 10, the conductor layer 7, and the plating wiring 8 are embedded in the insulating plate 6. In other words, the adhesion between the components can be improved.
Note that the multiple patterning wiring during the production of the substrate 2A ₁ and multiple patterning wiring board 2A _2, a portion of the insulator layer 10 is deficient, a portion of the dividing groove 5 formed on the surface of the insulating plate 6 It means disappearing. Then, in the portion where the dividing groove 5 is not formed in the insulating plate 6, when the multi-piece wiring board is divided into pieces, burrs and chips are generated on the periphery (fracture surface 5 b) of the electronic component storage package. Cannot be prevented, and its productivity cannot be improved.
Therefore, according to the multi-piece wiring board 2A ₂ according to the modification of the first embodiment, the yield rate of the electronic component storage package 1A ₂ obtained by dividing the wiring board 2A ₂ can be further increased to improve the productivity. Can do.

Also, multiple patterning wiring board 2A ₃ according to another modification of the first embodiment, those having the same configuration as the multi-piece wiring board 2A ₂ according to a modification of the first embodiment shown in FIG. 5 (a) However, the insulating layer 10 is embedded in the insulating plate 6 so that the height from the surface of the insulating plate 6 to the upper surface of the insulating layer 10 is substantially zero. Needless to say, at this time, not only the insulator layer 10 but also the conductor layer 7 and the plating wiring 8 arranged under the insulator layer 10 are embedded in the insulating plate 6. Further, the height from the surface of the insulating plate 6 to the upper surface of the insulating layer 10 is desirably completely zero, but is practically impossible, and is expressed here as “substantially zero”. Note that even when “substantially” is described in the subsequent stage, it is ideal that the state is desirable, but it means that it is impossible to realize the state completely in reality.
According to the multi-cavity wiring board 2A ₃ according to another modification of the first embodiment, since the insulator layer 10 does not protrude on the surface of the insulating plate 6, the insulator layer 10 is externally provided during the manufacture. It is possible to more surely prevent a part from being lost due to a physical impact from
As a result, according to the multi-cavity wiring board 2A ₃ according to another modification of the first embodiment, the electronic component housing is obtained by dividing the multi-cavity wiring boards 2A ₁ and 2A ₂ into pieces. yield rate of use package 1A ₃ to be able to further increase, the productivity can be further improved.

Here, the divided grooves 5 formed in each of the multi-cavity wiring boards 2A _{1 to} 2A _{3 according to} the _first embodiment will be described with reference to FIG.
FIG. 6A is a partial cross-sectional view illustrating a formation state of the dividing grooves in the electronic component storage package according to the first embodiment of the present invention, and FIG. 6B relates to a modification of the first embodiment of the present invention. It is a fragmentary sectional view which shows the formation state of the division | segmentation groove | channel in the electronic component storage package, (c) is a part which shows the formation state of the division | segmentation groove | channel in the electronic component storage package which concerns on the other modification of Example 1 of this invention. It is sectional drawing. The same parts as those described in FIGS. 1 to 5 are denoted by the same reference numerals, and description of the configuration is omitted. Further, the top view and the bottom view of the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modification of the first embodiment and other modifications are both the top views of the multi-cavity wiring board 2A _{2 according to} the first embodiment ( 2 and the bottom view (FIG. 1). Further, FIG. 5 shows a cross section taken along the line DD in FIG. In addition, broken line hatching is given to the portion where the dividing groove 5 is formed in FIG.
The insulating boards 6 of the multi-cavity wiring boards 2A _{1 to} 2A _{3 according to} the _first embodiment are obtained by firing an unfired ceramic sheet (for example, a ceramic green sheet). The conductor layer 7, the plating wiring 8 and the via conductor 9 are all formed by baking an unfired conductive paste which is made into a paste by adding an organic solvent or the like to conductive metal powder. is there.
The dividing grooves 5 in the multi-cavity wiring boards 2A _{1 to} 2A _{3 according to the first} embodiment emit laser light in a state where the insulating plate 6, the conductor layer 7, the plating wiring 8 and the via conductor 9 are not fired. It is formed by irradiating or pressing a flat blade.
In the case where the dividing grooves 5 are formed by laser light irradiation, the dividing grooves 5 can be formed after firing. However, it is easier to form the dividing grooves 5 in an unfired state. In addition, it is difficult to cause problems such as dust and the like adhering to the product when the dividing grooves 5 are formed.

When a part of the insulator layer 10 (and the conductor layer 7 and the plating wiring 8) is not embedded in the insulating plate 6 as in the multi-cavity wiring board 2A1 according to the _first embodiment, the dividing groove When the flat blade is pressed against the green body to form 5, the split groove 5 is formed only in the portion where the insulator layer 10 exists, and the split groove 5 is formed on the other unfired insulating plate 6. Can not form.
Therefore, it is necessary to form the division grooves 5 formed in the multi-piece wiring board 2A _{1 according} to the first embodiment by laser light irradiation.
In the multi-cavity wiring board 2A _{1 according to the} first embodiment, a laser beam is irradiated to form the dividing groove 5, and thus the surface of the insulating plate 6 is formed as shown in FIG. The dividing groove 5 is also formed on the side surface of the insulating layer 10 so as to connect the dividing groove 5 to be formed and the dividing groove 5 formed on the surface of the insulating layer 10.

On the other hand, in the case of the multi-piece wiring boards 2A ₂ and 2A _{3 according to} the modified example of the first embodiment and other modified examples, at least a part of the insulating layer 10 in the thickness direction is embedded in the insulating plate 6. in, the height difference between the surface and the surface of the insulating plate 6 of the insulator layer 10 is in a state of a small or substantially zero than the multiple patterning wiring board 2A _1, to form dividing grooves 5 with a blade it can. In the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modified example of the first embodiment and other modified examples, it is possible to form the divided grooves 5 by irradiating laser light. Dividing grooves 5 as shown in FIG. 6 (a) are formed.
In FIGS. 6B and 6C, when the dividing grooves 5 are formed by using blades in each of the multi-piece wiring boards 2A ₂ and 2A _{3 according to} the modified example of the first embodiment and other modified examples. Is illustrated.

As shown in FIGS. 6B and 6C, when the dividing groove 5 is formed using a blade, it is formed on the bottom 5c of the dividing groove 5 formed on the surface of the insulating plate 6 and the insulator layer 10. The bottom 5c of the divided groove 5 is continuous.
As described above, in the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modified example of the first embodiment and other modified examples, the dividing grooves 5 can be formed by using the blade in the manufacturing process. And when forming the division | segmentation groove | channel 5 using a braid | blade, the several division | segmentation groove | channel 5 distribute | arranged mutually parallel can be formed simultaneously. In this case, the plurality of blades may be pressed against the unfired multi-piece wiring boards 2A ₂ and 2A ₃ in a state where the blades are aligned at substantially the same height.
On the other hand, when the division grooves 5 are formed by irradiating laser light, only one division groove 5 can be formed.
Therefore, in the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modification of the first embodiment and other modifications, the dividing grooves 5 are efficiently formed on the unfired multi-cavity wiring boards 2A ₂ and 2A ₃ . Since it can form, the productivity can be improved.

In addition, in the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modified example of Example 1 and other modified examples, at least part of the thickness portions of the insulator layer 10, the conductor layer 7, and the plating wiring 8 or entirely, because it is embedded in the insulating plate 6, a relatively increased compared to insulating layer 10, the contact area of the electrically conductive layer 7 or plated wiring 8 is the case of multi-cavity circuit board 2A ₁ To do.
As a result, when the dividing groove 5 is formed using a blade, the risk that the unsintered insulator layer 10 is detached from the unsintered conductor layer 7 and the plating wiring 8 can be greatly reduced.
As described above, according to the multi-cavity wiring boards 2A ₂ and 2A ₃ according to the modified example of the first embodiment and other modified examples, the risk of the product becoming defective during manufacture is reduced while improving the production efficiency. can do.

The following describes a multi-piece wiring substrate manufacturing method 2A ₁ according to the first embodiment with reference to FIGS.
FIG. 7 is a flowchart showing manufacturing steps of the multi-cavity wiring board according to the first embodiment of the present invention. FIG. 8A is a conceptual cross-sectional view of an unfired ceramic sheet manufacturing process in the manufacturing process of the multi-cavity wiring board according to Example 1 of the present invention, and FIG. 8B is an unfired in the manufacturing method. FIG. 8C is a conceptual cross-sectional view of the conductive paste disposing step, FIG. 8C is a conceptual cross-sectional view of the green insulating layer forming step in the manufacturing method, and FIG. 8D is a cross-sectional view of the dividing groove forming step in the manufacturing method. It is a conceptual diagram. Further, FIG. 9 (e) is a conceptual cross-sectional view of a metal ring bonding process in the manufacturing process of the multi-cavity wiring board according to Example 1 of the present invention, and FIG. 9 (f) is a plating film forming process in the manufacturing method. FIG. 9G is a conceptual cross-sectional view of the dividing / dividing step in the manufacturing method. The same parts as those described in FIGS. 1 to 6 are denoted by the same reference numerals, and description of the configuration is omitted.
Multiple patterning wiring board 2A ₁ according to the first embodiment is manufactured by the manufacturing method 16A of multiple patterning wiring board comprising the steps S01~S09 shown in FIG.

  First, in the unfired ceramic sheet manufacturing process of step S01 shown in FIG. 7, the powder (for example, alumina, zirconia, etc.) of the ceramic material (insulating material) before firing is optionally mixed with other component powders (for example, silica, A slurry is prepared by mixing an organic binder, a solvent, a plasticizer, and the like. Then, this slurry is formed into a sheet shape by a conventionally well-known method (for example, a doctor blade method or a calender roll method) to produce an unfired ceramic sheet 6 'as an insulating sheet for taking a large number of pieces. See 8 (a)].

Next, as shown in FIG. 8 (b), the unfired conductive paste arrangement step of step S02 shown in FIG. 7 is performed on each of the upper surface 6a and the lower surface 6b of the unfired ceramic sheet 6 ′ after firing. And a step of applying a conductive paste 7 ′ to be the plating wiring 8.
This step S02 is a step of forming through holes in the unfired ceramic sheet 6 ′ as necessary, and filling the through holes with a conductive paste 7 ′ that becomes the via conductor 9 after firing, or an unfired ceramic sheet. There is a case in which a step of depositing the conductive paste 7 ′ on the inner surface of the through hole formed in 6 ′ may be included.
Further, since the plating wiring 8 before firing is also made of the conductive paste 7 ′, in FIG. 7, the portion (region where hatching is dense) that becomes the plating wiring 8 after firing is also denoted by reference numeral “7 ′”. The same applies to FIGS. 10H and 10I shown later.

The unsintered insulator layer forming step in step S03 shown in FIG. 7 is performed on the layer made of the conductive paste 7 ′ formed on the unfired ceramic sheet 6 ′ as shown in FIG. The step of laminating the unsintered insulator layer 10 'so as to cover at least the planned division position 5a (the boundary between the electronic component storage packages 1A according to the _first embodiment).

Further, in the split groove forming step of step S04 shown in FIG. 7, as shown in FIG. 8D, the division target position 5a of the unfired ceramic sheet 6 ′ is irradiated with laser light, and the unfired ceramic sheet 6 ′. This is a step of forming the dividing groove 5 on the surface of the substrate, the surface of the unfired insulator layer 10 ', and the side surface of the unfired insulator layer 10' connecting them [see FIG. 6 (a)]. In this divided groove forming step, it is necessary to form the divided groove 5 so that the bottom of the divided groove 5 does not reach the conductive paste 7 ′ that becomes the wiring 8 for plating after firing.
And the baking process of step S05 shown in FIG. 7 after this is a process of baking the non-fired body in which the divided grooves 5 are formed. By performing this baking process, the insulating plate 6, the conductor layer 7, A fired body comprising the plating wiring 8, the insulator layer 10 and the dividing groove 5 can be obtained.
The cross-sectional appearance of this fired body is the same as that shown in FIG. 8D, but the unfired ceramic sheet 6 ′ in FIG. 8D is the insulating plate 6 and the conductive paste 7 ′ is the conductor. The unsintered insulator layer 10 ′ is replaced by the insulator layer 10 in the layer 7 and the plating wiring 8.

  Next, as shown in FIG. 9 (e), the metal ring bonding process of step S06 shown in FIG. 7 is performed by using a metal brazing material (not shown) on the conductor layer 7 formed on the upper surface 6a side of the insulating plate 6 as required. This is a step of joining the metal ring 12 using, for example.

Further, in the plating film forming step of step S07 shown in FIG. 7, the electrode is connected to the terminal portion 11 (see FIG. 1) provided at the terminal portion of the plating wiring 8 formed on the surface of the insulating plate 6 to perform electrolysis. In the case where the conductor layer 7 includes the metal ring 12 on the bare surface of the conductor layer 7 formed on the surface of the insulating plate 6 and the bare surface of the conductor layer 7 by performing the plating process. Is a step of forming a plating film 13 on the bare surface of the metal ring 12.
Then, according to the multi-cavity wiring board manufacturing method 16A according to the first embodiment as described above, the multi-cavity wiring board as shown in FIGS. 1 to 3 is performed by performing steps S01 to S07 shown in FIG. 2A ₁ can be produced.

Moreover, the product region 3 of a number produced by the method 16A of multiple patterning wiring board according to the first embodiment patterning wiring board 2A _1, formed by individual pieces and divided along the dividing grooves 5 (Fig. 7 The step S08 of dividing / dividing into pieces is the electronic component storage package 1A1 according to the _first embodiment of the present invention.
Then, the electronic component storage package manufacturing method 17A according to the first embodiment is obtained by adding the dividing / dividing process of step S08 to steps S01 to S07 shown in FIG.

According to the manufacturing method 16A of multiple patterning wiring board according to the first embodiment as described above, even when the multi-cavity circuit board 2A ₁ having a plating wiring 8 on the upper surface 6a and / or lower surface 6b, the plating The dividing groove 5 can be formed so as to form a pair on both the upper surface 6a and the lower surface 6b of the insulating plate 6 without damaging the wiring 8 for use.
As a result, when the product area 3 of the multi-piece wiring board 2A _{1 according to} the first embodiment is divided along the dividing groove 5 into individual pieces, the peripheral edge (fracture surface) of each electronic component storage package 1A ₁ is obtained. It is possible to prevent burrs and chips from occurring in 5b). In this case, since the non-defective product rate of the electronic component storage package 1A _{1 according to} the first embodiment is increased, the productivity can be improved.
Note that the multi-piece wiring board 2A ₁ and the electronic component storage package 1A _{1 according to the first} embodiment do not necessarily include the metal ring 12. When the multi-piece wiring board 2A ₁ and the electronic component storage package 1A _{1 according} to the _first embodiment do not include the metal ring 12, the insulating plate 6 is formed on the conductor layer 7 formed on the upper surface 6a or the lower surface 6b side. An electronic component is mounted, and the electronic component is sealed and used with a lid having a cavity wall [for example, a metal ring 12 and a lid 15 shown in FIG. become.
An electronic device according to the present invention also includes the electronic component storage package 1A _{1 according} to the first embodiment that does not include the metal ring 12, the electronic component 14, and a lid body having a cavity wall (not shown). )

Subsequently, a manufacturing method of the multi-cavity wiring boards 2A ₁ and 2A _{2 according to} the modified example of the first embodiment and other modified examples will be described with reference to FIGS.
FIG. 10 (h) is a conceptual cross-sectional view of the pressing step in the manufacturing process of the multi-cavity wiring board according to the modification of the first embodiment of the present invention, and FIG. FIG. 10 (j) is a cross-sectional conceptual diagram, FIG. 10 (j) is a cross-sectional conceptual diagram upon completion of the metal ring joining step and the plating film forming step in the manufacturing method, and FIG. 10 (k) is a dividing / dividing step in the manufacturing method. FIG. The same parts as those described in FIGS. 1 to 9 are denoted by the same reference numerals, and description of the configuration is omitted.
Although the manufacturing method of the multi-cavity wiring boards 2A ₁ and 2A _{2 according to} the modified example of Example 1 and other modified examples is the same, the unfired insulator layer 10 ′ is embedded in the unfired ceramic sheet 6 ′. The amount is different. The manufacturing method of the multi-cavity wiring boards 2A ₁ and 2A _{2 according to} the modification of the first embodiment and the other modifications is the same as the manufacturing method 16A of the multi-cavity wiring board shown in FIG. Step S09 is provided between the insulator layer forming step) and step S04 (dividing groove forming step).

  The pressing step of step S09 shown in FIG. 7 illustrates the lower surface 6b side of the green body made of the green ceramic sheet 6 ′, the conductive paste 7 ′ and the green insulator layer 10 ′ shown in FIG. 8C. As shown in FIG. 10H, at least a part of the conductive paste 7 ′ and the unfired insulator layer 10 ′ in the thickness direction is pressed into the unfired ceramic sheet 6 ′. It is a process of embedding inside.

In this step S09, a large number of conductive pastes 7 'and at least part of the unfired insulator layer 10' in the thickness direction are embedded in the unfired ceramic sheet 6 'according to the modification of the first embodiment. The wiring board 2A ₂ [see FIG. 5A].
In addition, in this step S09, substantially all of the conductive paste 7 'and the unfired insulator layer 10' in the thickness direction are embedded in the unfired ceramic sheet 6 'according to another modification of the first embodiment. This is a single-piece wiring board 2A ₃ [see FIG. 5 (b)].

Further, the steps after the pressing step of Step S09 when manufacturing the multi-piece wiring boards 2A ₂ and 2A _{3 according} to the modified example of the first embodiment and the other modified examples are the multi-piece taking according to the above-described first embodiment. This is the same as steps S04 to S07 in wiring board manufacturing method 16A.
More specifically, the dividing groove forming process in step S04 in the method for manufacturing the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modified example of the first embodiment and other modified examples is the same as FIG. The plating film forming process of step S07 of the manufacturing method corresponds to FIG. In FIG. 10, the firing process in step S05 and the metal ring joining process in step S06 in the method for manufacturing the multi-cavity wiring boards 2A ₂ and 2A _{3 according to} the modification of the first embodiment and other modifications are omitted. ing.

Furthermore, after manufacturing the multi-piece wiring boards 2A ₂ and 2A _{3 according} to the modified example of the first embodiment and other modified examples, the multi-piece wiring boards 2A ₂ and 2A ₃ are divided along the respective dividing grooves 5 into individual pieces. It is possible to obtain the electronic component storage packages 1A ₂ and 1A _{3 according} to the first modification and the other variations [see FIG. 10 (k), but only the electronic component storage package 1A ₂ is shown here. Yes].
In addition, what divided | segmented and divided | segmented into the step S08 in step S01-S07 and step S09 which are each manufacturing process of the multi-piece wiring board which concerns on the modification of Example 1, and another modification is added. This is a method for manufacturing electronic component storage packages 1A ₂ and 1A _{3 according to} a modification of Example 1 and other modifications (not shown).

According to the multi-cavity wiring board manufacturing method according to the modification of Example 1 and other modifications, the process (Step S09) is compared to the multi-cavity wiring board manufacturing method 16A according to Example 1. Although it increases, the non-defective product rate of the electronic component storage packages 1A ₂ and 1A _{3 according to} the modified example of the first embodiment and other modified examples, which are final products, can be further increased, thereby further improving the productivity. Can do.

Finally, referring to FIGS. 11 and 12, the multi-piece wiring board, the electronic component storage package 1B and the manufacturing method thereof according to the second embodiment will be described in detail.
FIG. 11A is a plan view of an electronic component storage package according to Embodiment 2 of the present invention, and FIG. 11B is a cross-sectional view taken along the line C-C.
As shown in FIGS. 11A and 11B, the product storage package 1 </ b> B according to the second embodiment is formed by forming a ceramic multilayer substrate with a plurality of insulating plates 6. In the multi-cavity wiring board 2B in which the electronic component storage packages 1B according to the second embodiment are arranged in a grid pattern, a ceramic multilayer substrate is formed by the plurality of insulating plates 6. .
Electronic component storing package 1B according to this second embodiment, as shown in FIG. 11 (b), corresponding to the metal ring 12 in the electronic component storing package 1A ₁ to 1A ₃ according to Example 1 above The component is a ceramic frame 18.
In addition, as shown in FIG. 11B, the electronic component storage package 1B according to the second embodiment includes the conductor layer 7 on the upper surface of the frame body 18, and further, The bare surface is covered with a plating film 13.
That is, in the multi-cavity wiring board 2B according to the second embodiment in which a plurality of electronic component storage packages 1B according to the second embodiment are arranged in a grid pattern, the plating wiring 8 formed on the surface of the ceramic multilayer substrate. And the conductor layer 7 formed on the upper surface of the frame 18 need to be electrically connected. Therefore, in the electronic component storage package 1B according to the second embodiment, the conductor layer 7 formed on the frame 18 and the conductor formed on the lower surface 6b side of the insulating plate 6 disposed on the lower layer side thereof. The layer 7 is electrically connected via the via conductor 9.

Such an electronic component storage package 1B according to the second embodiment includes an electronic component 14 (for example, a crystal resonator or a semiconductor element) in a hollow portion (cavity) including a flat insulating plate 6 and a frame 18. And the like, and the lid 15 is used by joining the conductor layer 7 formed on the upper surface of the frame 18 directly or via a metal ring (not shown).
Note that the electronic device storage package 1B according to the second embodiment, the electronic component 14, and the lid 15 are also electronic devices according to the present invention.
FIG. 11 illustrates an example in which the electronic component storage package 1B of Example 2 includes a two-layer ceramic laminate, but the ceramic laminate is a laminate of two or more layers. May be. In this case, since the wiring pattern can be accommodated between the layers made of the insulating plate 6, a more sophisticated electronic component housing package can be manufactured.
In addition, the multi-cavity wiring board 2B and the electronic component storage package 1B according to the second embodiment do not necessarily have the frame 18. In this case, when a ceramic multilayer substrate is constituted by a plurality of insulating plates 6, the electronic component 14 is simply mounted instead of being sealed on the upper surface 6a or lower surface 6b side. The electronic device according to the present invention also includes the multi-piece wiring board 2B according to the second embodiment that does not include the frame 18 and the electronic component 14.

A method of manufacturing the electronic component storage package shown in the second embodiment shown in FIG. 11 will be described with reference to FIG.
FIG. 12 is a flowchart showing manufacturing steps of the electronic component storage package according to the second embodiment of the present invention. The same parts as those described in FIGS. 1 to 11 are denoted by the same reference numerals, and description of the configuration is omitted.
The manufacturing method 16B of the multi-cavity wiring board according to the second embodiment is different from the manufacturing method 16A of the multi-cavity wiring board according to the first embodiment shown in FIG. 7 (steps S01 to S07, with or without step S09). Is an unsintered ceramic sheet laminating step of step S10 between the unsintered insulator layer forming step of step S03 and the split groove forming step of step S04.
Further, the step of laminating the unfired ceramic sheet in step S10 includes laminating a plurality of unfired bodies including at least the unfired ceramic sheet 6 ', the conductive paste 7', and the unfired insulator layer 10 ', and heat and pressure. It is the process of integrating by.

According to the multi-cavity wiring board manufacturing method 16B according to the second embodiment, the multi-cavity wiring having the divided grooves 5 on both the upper surface 6a and the lower surface 6b of the ceramic multilayer substrate including the plurality of insulating plates 6 is provided. The substrate 2B can be manufactured. Further, in the manufacturing method 16B of the multi-cavity wiring board according to the second embodiment, even when the dividing grooves 5 are formed on the upper surface 6a and the lower surface 6b of the ceramic multilayer substrate, the dividing wiring 5 causes damage to the plating wiring 8. Does not happen.
In addition, the multi-cavity wiring board 2B according to the second embodiment manufactured by the above-described multi-cavity wiring board manufacturing method 16B is divided along the dividing grooves 5 into individual pieces, thereby obtaining individual pieces. A good product having no burrs or chips on the periphery of the electronic component storage package 1B can be efficiently manufactured, and thereby the productivity of the electronic component storage package 1B according to the second embodiment can be improved.
In addition, the division / piece of step S08 is performed in 16B (steps S01 to S07 and step S10 shown in FIG. 12, with or without the pressing step in step S09) of the multi-cavity wiring board manufacturing method according to the second embodiment. What added the singulation process is the manufacturing method 17B of the electronic component storage package according to the second embodiment.
According to the electronic component storage package manufacturing method 17B according to the second embodiment, it is possible to efficiently produce the electronic component storage package 1B having high functionality and few appearance defects.

  As described above, the present invention is a multi-piece wiring board that can be subjected to electroplating before dividing into pieces, and is less likely to cause burrs and chips when divided into pieces, and a method for manufacturing the same. In particular, it can be used in the technical field related to electronic components.

1A ₁ , 1A ₂ , 1A ₃ , 1B... Electronic component storage package 2A ₁ , 2A ₂ , 2A ₃ , 2B... Multiple circuit board 3... Product area 4 .. Dummy area 5. Boundary 5b ... fracture surface 5c ... bottom 6 ... insulating plate 6 '... unfired ceramic sheet 6a ... upper surface 6b ... lower surface 7 ... conductor layer 7' ... conductive paste 8 ... plating wiring 9 ... via conductor 10 ... insulator layer 10 '... Insulator layer (ceramic paste) 11 ... Terminal part 12 ... Metal ring 13 ... Plating film 14 ... Electronic component 15 ... Ladder 16A, 16B ... Manufacturing method of multi-piece wiring board 17A, 17B ... Electronic component storage package Manufacturing method 18 ... Frame

Claims (7)

A plurality of electronic component storage packages are arranged in a grid pattern, and a multi-piece wiring board in which division grooves are formed on the boundary lines of the individual electronic component storage packages,
An insulating plate, a conductor layer bonded to at least one of the upper surface and the lower surface of the insulating plate, a plating wiring connecting the conductor layers on either the upper surface or the lower surface, and the division An insulating layer covering at least the wiring for plating in the portion where the groove is formed, and
The multi-cavity wiring board, wherein a bottom of the dividing groove formed on the insulator layer does not reach the plating wiring. At least a portion in the thickness direction of the insulator layer is embedded in the insulating plate;
The bottom of the said division | segmentation groove | channel currently formed on the said insulator layer and the bottom of the said division | segmentation groove | channel formed except on the said insulator layer are continuing. Multi-piece wiring board.   The multi-piece wiring board according to claim 2, wherein the surface of the insulator layer is embedded in substantially the same height as the surface of the insulating plate.   The multi-piece wiring board according to any one of claims 1 to 3, wherein the insulating plate is a ceramic multilayer board. A method of manufacturing a multi-piece wiring board in which a plurality of electronic component storage packages are arranged in a grid pattern, and a dividing groove is formed on a boundary line of each of the electronic component storage packages,
A non-fired conductive paste arrangement step of forming a non-fired conductive layer and a non-fired plated wiring by arranging the non-fired conductive paste at a desired location of the sheet-like green ceramic sheet;
An unsintered insulator layer forming step of laminating an unsintered insulator layer on at least the unsintered plated wiring; and
Forming the dividing groove, and
The method for manufacturing a multi-cavity wiring board, wherein the dividing grooves formed in the unfired insulator layer do not reach the unfired plated wiring.   After the unsintered insulator layer forming step, pressing the unsintered insulator layer and embedding part or all of the unsintered insulator layer in the thickness direction in the unsintered ceramic sheet; and The method for manufacturing a multi-piece wiring board according to claim 5, wherein:   The multi-cavity wiring according to claim 6, further comprising a divided groove forming step of forming the divided grooves with a plurality of blades having a blade edge having substantially the same height after the pressing step. A method for manufacturing a substrate.

Images