JP2017188657A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2017188657A JP2017188657A JP2017011410A JP2017011410A JP2017188657A JP 2017188657 A JP2017188657 A JP 2017188657A JP 2017011410 A JP2017011410 A JP 2017011410A JP 2017011410 A JP2017011410 A JP 2017011410A JP 2017188657 A JP2017188657 A JP 2017188657A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
第1の実施形態について図1から図4を参照して説明する。
次に、前述の基板処理装置10が行う基板処理の流れについて説明する。
第2の実施形態について図5を参照して説明する。なお、第2の実施形態では、第1の実施形態との相違点(撥液層のサイズ)について説明し、その他の説明を省略する。
第3の実施形態について図6及び図7を参照して説明する。なお、第3の実施形態では、第1の実施形態との相違点(撥液層の設置個所)について説明し、その他の説明を省略する。
第4の実施形態について図8を参照して説明する。なお、第4の実施形態では、第1の実施形態との相違点(撥液層の設置個所)について説明し、その他の説明を省略する。
前述の各実施形態においては、最初の処理(例えば、レジスト除去処理)を行った後に、純水での洗浄処理、APMでの洗浄処理、更に、純水での洗浄処理の3回の洗浄処理を行うことを例示したが、これに限るものではなく、例えば、APMの洗浄処理や1回目の純水の洗浄処理などを省略することも可能であり、その処理の内容や回数は特に限定されるものではない。
20 基板保持プレート
40 処理液保持プレート
40a 吐出口
41 ヒータ
42 温度センサ
43 撥液層
43a 撥液層
44 撥液層
45 撥液層
46 撥液層
47 撥液層
60 昇降機構
S 処理液
W 基板
Claims (5)
- 基板を保持する基板保持部と、
処理液を吐出する吐出口を有し、前記基板保持部により保持された前記基板の表面に対向して離れた位置に設けられ、前記吐出口から吐出された前記処理液を前記基板保持部により保持された前記基板の表面との間に保持する処理液保持プレートと、
前記処理液保持プレートに設けられ、前記処理液保持プレートを加熱するヒータと、
前記基板保持部により保持された前記基板に対して前記処理液保持プレート及び前記ヒータを昇降させる昇降機構と、
前記処理液保持プレートの前記基板側の表面に前記吐出口を囲むように環状に設けられ、前記処理液をはじく撥液層と、
を備えることを特徴とする基板処理装置。 - 前記処理液保持プレートに設けられ、前記処理液保持プレートの温度を検出する温度センサと、
前記処理液保持プレートの前記基板側の面に前記温度センサに対向するように設けられ、前記処理液をはじく撥液層と、
さらに備えることを特徴とする請求項1に記載の基板処理装置。 - 基板を保持する基板保持部と、
処理液を吐出する吐出口を有し、前記基板保持部により保持された前記基板の表面に対向して離れた位置に設けられ、前記吐出口から吐出された前記処理液を前記基板保持部により保持された前記基板の表面との間に保持する処理液保持プレートと、
前記処理液保持プレートに設けられ、前記処理液保持プレートを加熱するヒータと、
前記基板保持部により保持された前記基板に対して前記処理液保持プレート及び前記ヒータを昇降させる昇降機構と、
前記処理液保持プレートに設けられ、前記処理液保持プレートの温度を検出する温度センサと、
前記処理液保持プレートの前記基板側の面に前記温度センサに対向するように設けられ、前記処理液をはじく撥液層と、
を備えることを特徴とする基板処理装置。 - 前記処理液保持プレートの前記基板側の表面における前記基板と対向しない領域に設けられ、前記処理液をはじく撥液層をさらに備えることを特徴とする請求項1から請求項3のいずれか一項に記載の基板処理装置。
- 前記処理液保持プレートの側面に設けられ、前記処理液をはじく撥液層をさらに備えることを特徴とする請求項1から請求項4のいずれか一項に記載の基板処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170027596A KR101921818B1 (ko) | 2016-03-31 | 2017-03-03 | 기판 처리 장치 |
TW106108367A TWI681451B (zh) | 2016-03-31 | 2017-03-14 | 基板處理裝置 |
CN201710200850.XA CN107275258B (zh) | 2016-03-31 | 2017-03-30 | 基板处理装置 |
KR1020180119702A KR102265170B1 (ko) | 2016-03-31 | 2018-10-08 | 기판 처리 장치 |
JP2021104140A JP7106723B2 (ja) | 2016-03-31 | 2021-06-23 | 基板処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2016073091 | 2016-03-31 | ||
JP2016073091 | 2016-03-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021104140A Division JP7106723B2 (ja) | 2016-03-31 | 2021-06-23 | 基板処理装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017188657A true JP2017188657A (ja) | 2017-10-12 |
JP2017188657A5 JP2017188657A5 (ja) | 2020-03-05 |
JP6903441B2 JP6903441B2 (ja) | 2021-07-14 |
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JP2017011410A Active JP6903441B2 (ja) | 2016-03-31 | 2017-01-25 | 基板処理装置 |
JP2021104140A Active JP7106723B2 (ja) | 2016-03-31 | 2021-06-23 | 基板処理装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021104140A Active JP7106723B2 (ja) | 2016-03-31 | 2021-06-23 | 基板処理装置 |
Country Status (4)
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JP (2) | JP6903441B2 (ja) |
KR (2) | KR101921818B1 (ja) |
CN (1) | CN107275258B (ja) |
TW (1) | TWI681451B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002075947A (ja) * | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
JP2002343759A (ja) * | 2001-05-21 | 2002-11-29 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
JP2003051477A (ja) * | 2001-08-08 | 2003-02-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006216794A (ja) * | 2005-02-03 | 2006-08-17 | Tokyo Electron Ltd | 洗浄装置、塗布、現像装置及び洗浄方法 |
JP2008135703A (ja) * | 2006-10-23 | 2008-06-12 | Tokyo Electron Ltd | 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006129505A1 (ja) * | 2005-06-03 | 2006-12-07 | Konica Minolta Holdings, Inc. | 液体吐出装置及び液体吐出方法 |
JP2007059417A (ja) | 2005-08-22 | 2007-03-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
CN102782807B (zh) * | 2010-01-22 | 2015-07-08 | 芝浦机械电子装置股份有限公司 | 基板处理装置及基板处理方法 |
JP3169239U (ja) * | 2011-05-11 | 2011-07-21 | 東京エレクトロン株式会社 | 基板搬送アーム |
US20140231012A1 (en) * | 2013-02-15 | 2014-08-21 | Dainippon Screen Mfg, Co., Ltd. | Substrate processing apparatus |
JP6271304B2 (ja) * | 2013-03-29 | 2018-01-31 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
-
2017
- 2017-01-25 JP JP2017011410A patent/JP6903441B2/ja active Active
- 2017-03-03 KR KR1020170027596A patent/KR101921818B1/ko active IP Right Grant
- 2017-03-14 TW TW106108367A patent/TWI681451B/zh active
- 2017-03-30 CN CN201710200850.XA patent/CN107275258B/zh active Active
-
2018
- 2018-10-08 KR KR1020180119702A patent/KR102265170B1/ko active IP Right Grant
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2021
- 2021-06-23 JP JP2021104140A patent/JP7106723B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002075947A (ja) * | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
JP2002343759A (ja) * | 2001-05-21 | 2002-11-29 | Tokyo Electron Ltd | 液処理装置および液処理方法 |
JP2003051477A (ja) * | 2001-08-08 | 2003-02-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2006216794A (ja) * | 2005-02-03 | 2006-08-17 | Tokyo Electron Ltd | 洗浄装置、塗布、現像装置及び洗浄方法 |
JP2008135703A (ja) * | 2006-10-23 | 2008-06-12 | Tokyo Electron Ltd | 洗浄装置、洗浄方法、およびコンピュータ読取可能な記憶媒体 |
Also Published As
Publication number | Publication date |
---|---|
CN107275258B (zh) | 2020-09-29 |
KR20180114539A (ko) | 2018-10-18 |
JP6903441B2 (ja) | 2021-07-14 |
KR101921818B1 (ko) | 2018-11-23 |
JP7106723B2 (ja) | 2022-07-26 |
KR102265170B1 (ko) | 2021-06-16 |
CN107275258A (zh) | 2017-10-20 |
JP2021158376A (ja) | 2021-10-07 |
TW201802923A (zh) | 2018-01-16 |
KR20170113082A (ko) | 2017-10-12 |
TWI681451B (zh) | 2020-01-01 |
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