JP2017188528A - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP2017188528A
JP2017188528A JP2016075046A JP2016075046A JP2017188528A JP 2017188528 A JP2017188528 A JP 2017188528A JP 2016075046 A JP2016075046 A JP 2016075046A JP 2016075046 A JP2016075046 A JP 2016075046A JP 2017188528 A JP2017188528 A JP 2017188528A
Authority
JP
Japan
Prior art keywords
electrode member
plate
semiconductor device
power semiconductor
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016075046A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017188528A5 (https=
Inventor
準 徳丸
Jun Tokumaru
準 徳丸
藤野　純司
Junji Fujino
純司 藤野
貴雅 岩井
Takamasa Iwai
貴雅 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2016075046A priority Critical patent/JP2017188528A/ja
Publication of JP2017188528A publication Critical patent/JP2017188528A/ja
Publication of JP2017188528A5 publication Critical patent/JP2017188528A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016075046A 2016-04-04 2016-04-04 半導体装置 Pending JP2017188528A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Publications (2)

Publication Number Publication Date
JP2017188528A true JP2017188528A (ja) 2017-10-12
JP2017188528A5 JP2017188528A5 (https=) 2019-05-09

Family

ID=60045716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016075046A Pending JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Country Status (1)

Country Link
JP (1) JP2017188528A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021100199A1 (https=) * 2019-11-22 2021-05-27
JP2022048877A (ja) * 2020-09-15 2022-03-28 株式会社東芝 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156560U (https=) * 1988-04-21 1989-10-27
JPH05315490A (ja) * 1992-05-07 1993-11-26 Fuji Electric Co Ltd 半導体素子
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2015107871A1 (ja) * 2014-01-15 2015-07-23 パナソニックＩｐマネジメント株式会社 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156560U (https=) * 1988-04-21 1989-10-27
JPH05315490A (ja) * 1992-05-07 1993-11-26 Fuji Electric Co Ltd 半導体素子
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
WO2015107871A1 (ja) * 2014-01-15 2015-07-23 パナソニックＩｐマネジメント株式会社 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021100199A1 (https=) * 2019-11-22 2021-05-27
WO2021100199A1 (ja) * 2019-11-22 2021-05-27 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
JP7237192B2 (ja) 2019-11-22 2023-03-10 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
JP2022048877A (ja) * 2020-09-15 2022-03-28 株式会社東芝 半導体装置
JP7438071B2 (ja) 2020-09-15 2024-02-26 株式会社東芝 半導体装置

Similar Documents

Publication Publication Date Title
US9418918B2 (en) Lead for connection to a semiconductor device
CN107004662B (zh) 半导体装置及其制造方法
JP4924411B2 (ja) 電力半導体装置
US9966327B2 (en) Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device
JP4438489B2 (ja) 半導体装置
US9076782B2 (en) Semiconductor device and method of manufacturing same
JP2006134990A (ja) 半導体装置
US20170103962A1 (en) Semiconductor device and method for manufacturing same
CN107615464A (zh) 电力用半导体装置的制造方法以及电力用半导体装置
JP2011009410A (ja) 半導体モジュール
JP6260566B2 (ja) 回路構成体
JP6244272B2 (ja) 半導体装置
JP2007184525A (ja) 電子機器装置
US20200286800A1 (en) Semiconductor device manufacturing method and semiconductor device
JP5732880B2 (ja) 半導体装置及びその製造方法
JP2021019064A (ja) 半導体装置及び半導体装置の製造方法
JP2016181607A (ja) 半導体装置及びその製造方法
JP7594950B2 (ja) 半導体装置
JP2017050441A (ja) 半導体装置
JP2017188528A (ja) 半導体装置
JP4557804B2 (ja) 半導体装置及びその製造方法
JP2018041871A (ja) 半導体装置及びその製造方法
US20210280500A1 (en) Semiconductor device
JP2011023748A (ja) 電子機器装置
JP2014187180A (ja) 半導体装置用接合体、パワーモジュール用基板及びパワーモジュール

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190326

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190326

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200121

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20200804