JP2017166824A5 - - Google Patents
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- JP2017166824A5 JP2017166824A5 JP2016049120A JP2016049120A JP2017166824A5 JP 2017166824 A5 JP2017166824 A5 JP 2017166824A5 JP 2016049120 A JP2016049120 A JP 2016049120A JP 2016049120 A JP2016049120 A JP 2016049120A JP 2017166824 A5 JP2017166824 A5 JP 2017166824A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016049120A JP6659160B2 (ja) | 2016-03-14 | 2016-03-14 | 半導体素子のパワーサイクル評価試験制御装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016049120A JP6659160B2 (ja) | 2016-03-14 | 2016-03-14 | 半導体素子のパワーサイクル評価試験制御装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017166824A JP2017166824A (ja) | 2017-09-21 |
| JP2017166824A5 true JP2017166824A5 (enExample) | 2018-10-04 |
| JP6659160B2 JP6659160B2 (ja) | 2020-03-04 |
Family
ID=59913295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016049120A Active JP6659160B2 (ja) | 2016-03-14 | 2016-03-14 | 半導体素子のパワーサイクル評価試験制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6659160B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11562891B2 (en) * | 2018-11-29 | 2023-01-24 | Piotech Co., Ltd. | Method of temperature measurement used in radio-frequency processing apparatus for semiconductor |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7056318B2 (ja) * | 2018-03-30 | 2022-04-19 | 日本電気株式会社 | 冷却評価システムおよび冷却評価方法 |
| CN110502842B (zh) * | 2019-08-26 | 2023-05-30 | 阳光电源股份有限公司 | 功率半导体模块的热模型建模方法及其应用方法和装置 |
| KR20210133375A (ko) * | 2020-04-28 | 2021-11-08 | 현대자동차주식회사 | 파워 모듈의 전력 반도체 소자 정션 온도 추정 방법 및 장치 |
| CN113721122B (zh) * | 2020-05-25 | 2024-04-05 | 中车永济电机有限公司 | 焊层寿命失效的测试方法 |
| CN112285595B (zh) * | 2020-10-15 | 2023-10-10 | 深圳市南北半导体有限责任公司 | 一种led灯珠的循环测试方法 |
| CN113113370A (zh) * | 2021-03-31 | 2021-07-13 | 杭州芯耘光电科技有限公司 | 一种双循环散热系统及其控制方法 |
| CN114152863B (zh) * | 2021-11-27 | 2023-12-08 | 北京工业大学 | 一种智能可控温的GaN功率循环实验装置 |
| CN118191550B (zh) * | 2024-05-15 | 2024-07-19 | 天津海瑞电子科技有限公司 | 功率模块循环测试方法 |
| CN118330271A (zh) * | 2024-06-14 | 2024-07-12 | 浙江杭可仪器有限公司 | 一种测试平台外置的igbt功率循环测试设备 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4418772B2 (ja) * | 2005-04-28 | 2010-02-24 | 富士通マイクロエレクトロニクス株式会社 | 温度制御装置 |
| JP4321539B2 (ja) * | 2006-03-28 | 2009-08-26 | 住友電気工業株式会社 | デバイス評価装置およびデバイス評価方法 |
| JP6047474B2 (ja) * | 2013-09-25 | 2016-12-21 | エスペック株式会社 | 環境試験装置 |
-
2016
- 2016-03-14 JP JP2016049120A patent/JP6659160B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11562891B2 (en) * | 2018-11-29 | 2023-01-24 | Piotech Co., Ltd. | Method of temperature measurement used in radio-frequency processing apparatus for semiconductor |
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