JP2017120887A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of removing foreign matters attached to an upper surface of a peripheral wall portion of a cup.SOLUTION: A substrate processing apparatus according to one aspect of an embodiment includes a holding unit, a processing liquid supply unit, a cup, and a cleaning liquid supply unit. The holding unit holds a substrate. The processing liquid supply unit supplies a processing liquid to the substrate. The cup includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed on an upper surface of the peripheral wall portion along a circumferential direction, the cup surrounding the holding unit. The cleaning liquid supply unit supplies a cleaning liquid to the upper surface of the peripheral wall portion.SELECTED DRAWING: Figure 5

Description

  Embodiments disclosed herein relate to a substrate processing apparatus and a substrate processing method.

  2. Description of the Related Art Conventionally, there has been known a substrate processing apparatus that supplies a predetermined processing liquid to a substrate such as a semiconductor wafer or a glass substrate to perform various processes (see, for example, Patent Document 1).

  In the above-described substrate processing apparatus, for example, the processing liquid splashed from the substrate is received and discharged by a cup provided so as to surround the periphery of the substrate. Such a cup includes, for example, a peripheral wall portion erected from the bottom portion and a liquid receiving portion that is provided on the upper surface of the peripheral wall portion and receives the processing liquid scattered from the substrate, and the liquid receiving portion can be raised and lowered with respect to the peripheral wall portion. It is comprised so that.

JP2013-089628A

  However, in the above-described conventional technology, the treatment liquid atmosphere of the treatment liquid used or the scattered treatment liquid enters, for example, the gap between the liquid receiving portion and the peripheral wall portion, and the penetrated treatment liquid atmosphere is dried. It was found that foreign matters such as crystals of the treatment liquid adhere to the upper surface of the peripheral wall portion of the cup.

  An object of one embodiment of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of removing foreign matters attached to the upper surface of a peripheral wall portion of a cup.

  A substrate processing apparatus according to an aspect of an embodiment includes a holding unit, a processing liquid supply unit, a cup, and a cleaning liquid supply unit. The holding unit holds the substrate. The processing liquid supply unit supplies a processing liquid to the substrate. The cup includes a bottom portion, a cylindrical peripheral wall portion erected from the bottom portion, a liquid receiving portion that is provided above the peripheral wall portion and receives the processing liquid scattered from the substrate, and a circumferential direction on the upper surface of the peripheral wall portion And surrounding the holding portion. The cleaning liquid supply unit supplies the cleaning liquid to the upper surface of the peripheral wall.

  According to one aspect of the embodiment, foreign matter adhering to the upper surface of the peripheral wall portion of the cup can be removed.

FIG. 1 is a diagram illustrating a schematic configuration of a substrate processing system according to the first embodiment. FIG. 2 is a diagram showing a schematic configuration of the processing unit. FIG. 3 is a schematic cross-sectional view showing a specific configuration example of the processing unit. FIG. 4 is a schematic plan view of the first peripheral wall portion. 5 is a schematic cross-sectional view taken along line VV in FIG. FIG. 6A is a schematic cross-sectional view taken along the line VI-VI in FIG. 4 and shows a state of cleaning in a state where the first liquid receiving portion is lowered. FIG. 6B is a diagram illustrating a state of cleaning in a state where the first liquid receiving unit is raised. FIG. 7 is a flowchart illustrating a processing procedure of processing executed by the substrate processing system according to the first embodiment. FIG. 8 is a flowchart illustrating an example of a processing procedure of the cleaning process of the first peripheral wall portion executed in the substrate processing system. FIG. 9 is a schematic plan view of the first peripheral wall portion in the first modification. FIG. 10 is an enlarged longitudinal sectional view showing the vicinity of the discharge port of the cleaning liquid supply pipe in the second modification. FIG. 11 is a diagram illustrating an example of the relationship between the distance from the discharge port of the part to be cleaned and the flow rate of the cleaning liquid. FIG. 12A is a schematic cross-sectional view showing a first peripheral wall portion in a third modification. FIG. 12B is a schematic cross-sectional view showing a first peripheral wall portion in a fourth modification. FIG. 13 is a schematic bottom view of the back surface of the holding unit according to the second embodiment. FIG. 14A is a schematic bottom view showing the first fixing portion in an enlarged manner. FIG. 14B is a schematic bottom view showing the first fixing portion according to the comparative example. 15 is a cross-sectional view taken along line XV-XV in FIG. FIG. 16 is an enlarged schematic bottom view showing the second fixing portion. 17 is a cross-sectional view taken along line XVII-XVII in FIG. FIG. 18 is a schematic plan view of a first peripheral wall portion in the third embodiment. FIG. 19 is a schematic enlarged plan view of FIG. 20 is a sectional view taken along line XX-XX in FIG. FIG. 21 is a schematic plan view of a first peripheral wall portion in the fourth embodiment. FIG. 22 is a schematic enlarged plan view of FIG. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG. FIG. 24 is a flowchart illustrating another example of the cleaning process.

  Hereinafter, embodiments of a substrate processing apparatus and a substrate processing method disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

<1. Configuration of substrate processing system>
(First embodiment)
FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to the present embodiment. In the following, in order to clarify the positional relationship, the X axis, the Y axis, and the Z axis that are orthogonal to each other are defined, and the positive direction of the Z axis is the vertically upward direction.

  As shown in FIG. 1, the substrate processing system 1 includes a carry-in / out station 2 and a processing station 3. The carry-in / out station 2 and the processing station 3 are provided adjacent to each other.

  The carry-in / out station 2 includes a carrier placement unit 11 and a transport unit 12. A plurality of carriers C that accommodate a plurality of substrates, in this embodiment a semiconductor wafer (hereinafter referred to as a wafer W) in a horizontal state, are placed on the carrier placement unit 11.

  The transport unit 12 is provided adjacent to the carrier placement unit 11 and includes a substrate transport device 13 and a delivery unit 14 inside. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 13 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism. Do.

  The processing station 3 is provided adjacent to the transfer unit 12. The processing station 3 includes a transport unit 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on the transport unit 15.

  The transport unit 15 includes a substrate transport device 17 inside. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. Further, the substrate transfer device 17 can move in the horizontal direction and the vertical direction and can turn around the vertical axis, and transfers the wafer W between the delivery unit 14 and the processing unit 16 using a wafer holding mechanism. I do.

  The processing unit 16 performs predetermined substrate processing on the wafer W transferred by the substrate transfer device 17.

  Further, the substrate processing system 1 includes a control device 4. The control device 4 is a computer, for example, and includes a control unit 18 and a storage unit 19. The storage unit 19 stores a program for controlling various processes executed in the substrate processing system 1. The control unit 18 controls the operation of the substrate processing system 1 by reading and executing the program stored in the storage unit 19.

  Such a program may be recorded on a computer-readable storage medium, and may be installed in the storage unit 19 of the control device 4 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 of the loading / unloading station 2 takes out the wafer W from the carrier C placed on the carrier placement unit 11 and receives the taken-out wafer W. Place on the transfer section 14. The wafer W placed on the delivery unit 14 is taken out from the delivery unit 14 by the substrate transfer device 17 of the processing station 3 and carried into the processing unit 16.

  The wafer W carried into the processing unit 16 is processed by the processing unit 16, then unloaded from the processing unit 16 by the substrate transfer device 17, and placed on the delivery unit 14. Then, the processed wafer W placed on the delivery unit 14 is returned to the carrier C of the carrier placement unit 11 by the substrate transfer device 13.

  Next, a schematic configuration of the processing unit 16 of the substrate processing system 1 will be described with reference to FIG. FIG. 2 is a diagram showing a schematic configuration of the processing unit 16.

  As shown in FIG. 2, the processing unit 16 includes a chamber 20, a substrate holding mechanism 30, a processing fluid supply unit 40, and a recovery cup 50.

  The chamber 20 accommodates the substrate holding mechanism 30, the processing fluid supply unit 40, and the recovery cup 50. An FFU (Fan Filter Unit) 21 is provided on the ceiling of the chamber 20. The FFU 21 forms a down flow in the chamber 20.

  The substrate holding mechanism 30 includes a holding unit 31, a support unit 32, and a driving unit 33. The holding unit 31 holds the wafer W horizontally. The support | pillar part 32 is a member extended in a perpendicular direction, a base end part is rotatably supported by the drive part 33, and supports the holding | maintenance part 31 horizontally in a front-end | tip part. The drive unit 33 rotates the column unit 32 around the vertical axis. The substrate holding mechanism 30 rotates the support unit 31 by rotating the support unit 32 using the drive unit 33, thereby rotating the wafer W held by the support unit 31. .

  The processing fluid supply unit 40 supplies a processing fluid to the wafer W. The processing fluid supply unit 40 is connected to a processing fluid supply source 70.

  The collection cup 50 is disposed so as to surround the holding unit 31, and collects the processing liquid scattered from the wafer W by the rotation of the holding unit 31. A drain port 51 is formed at the bottom of the recovery cup 50, and the processing liquid collected by the recovery cup 50 is discharged from the drain port 51 to the outside of the processing unit 16. Further, an exhaust port 52 for discharging the gas supplied from the FFU 21 to the outside of the processing unit 16 is formed at the bottom of the recovery cup 50.

<2. Specific configuration of processing unit>
Next, the configuration of the processing unit 16 will be described more specifically with reference to FIG. FIG. 3 is a schematic cross-sectional view showing a specific configuration example of the processing unit 16.

  As shown in FIG. 3, an inert gas supply source 23 is connected to the FFU 21 via a valve 22. The FFU 21 discharges an inert gas such as N 2 gas supplied from the inert gas supply source 23 into the chamber 20 as a downflow gas. As described above, by using an inert gas as the downflow gas, the wafer W can be prevented from being oxidized.

  A holding member 311 that holds the wafer W from the side surface is provided on the upper surface of the holding unit 31 of the substrate holding mechanism 30. The wafer W is horizontally held by the holding member 311 while being slightly separated from the upper surface of the holding unit 31.

  The processing fluid supply unit 40 includes a nozzle 41, an arm 42 that horizontally supports the nozzle 41, and a turning lift mechanism 43 that turns and lifts the arm 42. One end of a pipe (not shown) is connected to the nozzle 41, and the other end of the pipe branches into a plurality. Then, an alkaline processing solution supply source 70a, an acid processing solution supply source 70b, an organic processing solution supply source 70c, and a DIW supply source 70d are connected to each end of the branched pipe. Further, valves 60 a to 60 d are provided between the supply sources 70 a to 70 d and the nozzle 41.

  The processing fluid supply unit 40 supplies the alkaline processing liquid, the acid processing liquid, the organic processing liquid, and DIW (normal temperature pure water) supplied from the above supply sources 70a to 70d from the nozzle 41 to the surface of the wafer W. Then, the wafer W is liquid-processed.

  In the above description, the surface of the wafer W is liquid-treated. However, the present invention is not limited to this. For example, the back surface and the peripheral edge of the wafer W may be liquid-treated. In the present embodiment, the alkaline processing liquid, the acid processing liquid, the organic processing liquid, and DIW are supplied from one nozzle 41, but the processing fluid supply unit 40 corresponds to each processing liquid. A plurality of nozzles may be provided.

  First and second rotating cups 101 and 102 that rotate integrally with the holding portion 31 are provided at the peripheral portion of the holding portion 31. As shown in FIG. 3, the second rotary cup 102 is disposed inside the first rotary cup 101.

  The first rotary cup 101 and the second rotary cup 102 are formed in a ring shape as a whole. When the first and second rotating cups 101 and 102 are rotated together with the holding unit 31, the processing liquid splashed from the rotating wafer W is guided to the recovery cup 50.

  The collection cup 50 includes a first cup 50a, a second cup 50b, and a third cup 50c in order from the inside near the rotation center of the wafer W held and rotated by the holding unit 31. Further, the recovery cup 50 includes a cylindrical inner wall portion 54d centering on the rotation center of the wafer W on the inner peripheral side of the first cup 50a.

  The first to third cups 50 a to 50 c and the inner wall portion 54 d are provided on the bottom portion 53 of the recovery cup 50. Specifically, the first cup 50a includes a first peripheral wall portion 54a and a first liquid receiving portion 55a.

  The first peripheral wall portion 54a is erected from the bottom portion 53 and is formed in a cylindrical shape (for example, a cylindrical shape). A space is formed between the first peripheral wall portion 54a and the inner wall portion 54d, and this space serves as a first drainage groove 501a for collecting and discharging the processing liquid and the like. The first liquid receiving portion 55a is provided above the upper surface 54a1 of the first peripheral wall portion 54a.

  The first cup 50 a includes a first lifting mechanism 56 and is configured to be lifted and lowered by the first lifting mechanism 56. Specifically, the first elevating mechanism 56 includes a first support member 56a and a first elevating drive unit 56b.

  The first support member 56a is a plurality of (for example, three, only one is shown in FIG. 3) long members. The first support member 56a is movably inserted through an insertion hole formed in the first peripheral wall portion 54a. For example, a cylindrical rod can be used as the first support member 56a, but is not limited thereto.

  The first support member 56a is positioned so that its upper end is exposed from the upper surface 54a1 of the first peripheral wall portion 54a, and is connected to the lower surface of the first liquid receiving portion 55a to support the first liquid receiving portion 55a from below. . On the other hand, the 1st raising / lowering drive part 56b is connected to the lower end of the 1st support member 56a.

  The first raising / lowering drive unit 56b raises / lowers the first support member 56a in, for example, the Z-axis direction, whereby the first support member 56a raises / lowers the first liquid receiving portion 55a relative to the first peripheral wall portion 54a. An air cylinder can be used as the first elevating drive unit 56b. The first elevating drive unit 56b is controlled by the control device 4.

  The first liquid receiving part 55a driven by the first lifting / lowering driving part 56b is moved between a processing position for receiving the processing liquid scattered from the rotating wafer W and a retreating position retracted downward from the processing position. It will be.

  Specifically, when the first liquid receiving part 55a is in the processing position, an opening is formed inside the upper end of the first liquid receiving part 55a, and a flow path leading from the opening to the first drainage groove 501a is formed.

  On the other hand, as shown in FIG. 3, the inner wall portion 54 d includes an extending portion 54 d 1 that extends so as to be inclined toward the peripheral edge portion of the holding portion 31. When the first liquid receiving portion 55a is in the retracted position, the first liquid receiving portion 55a abuts on the extending portion 54d1 of the inner wall portion 54d, the opening inside the upper end is closed, and the flow path leading to the first drainage groove 501a is closed.

  The second cup 50b has the same configuration as the first cup 50a. Specifically, the second cup 50b includes a second peripheral wall portion 54b, a second liquid receiving portion 55b, and a second lifting mechanism 57, and is adjacent to the first peripheral wall portion 54a side of the first cup 50a. Be placed.

  The second peripheral wall portion 54b is erected on the outer peripheral side of the first peripheral wall portion 54a at the bottom 53, and is formed in a cylindrical shape. A space formed between the second peripheral wall portion 54b and the first peripheral wall portion 54a serves as a second drain groove 501b for collecting and discharging the processing liquid and the like.

  The second liquid receiving portion 55b is located on the outer peripheral side of the first liquid receiving portion 55a and is provided above the upper surface 54b1 of the second peripheral wall portion 54b.

  The 2nd raising / lowering mechanism 57 is provided with the 2nd support member 57a and the 2nd raising / lowering drive part 57b. The second support member 57a is a plurality of (for example, three, only one is shown in FIG. 3) long members, and is movably inserted into an insertion hole formed in the second peripheral wall portion 54b. Note that, for example, a cylindrical rod can be used as the second support member 57a, but is not limited thereto.

  The second support member 57a is positioned such that its upper end is exposed from the upper surface 54b1 of the second peripheral wall portion 54b, and is connected to the lower surface of the second liquid receiving portion 55b to support the second liquid receiving portion 55b from below. . The upper surface 54b1 of the second peripheral wall portion 54b is positioned so as to be downward in the vertical direction with respect to the upper surface 54a1 of the first peripheral wall portion 54a.

  The 2nd raising / lowering drive part 57b is connected to the lower end of the 2nd support member 57a. The second lifting / lowering drive unit 57b moves the second support member 57a up and down, for example, in the Z-axis direction. Thereby, the 2nd support member 57a raises / lowers the 2nd liquid receiving part 55b with respect to the 2nd surrounding wall part 54b.

  Note that an air cylinder can be used as the second elevating drive unit 57b. The second elevating drive unit 57b is also controlled by the control device 4.

  Then, the second liquid receiving portion 55b is also moved between the processing position and the retracted position. Specifically, when the second liquid receiving part 55b is in the processing position and the first liquid receiving part 55a is in the retracted position, an opening is formed inside the upper end of the second liquid receiving part 55b, and the second liquid receiving part 55b is A flow path leading to the drainage groove 501b is formed.

  On the other hand, as shown in FIG. 3, when the second liquid receiving portion 55b is in the retracted position, the second liquid receiving portion 55b is in contact with the first liquid receiving portion 55a, and the opening inside the upper end is closed to communicate with the second drainage groove 501b. The road is blocked. In the above description, the second liquid receiving portion 55b in the retracted position is in contact with the first liquid receiving portion 55a. However, the present invention is not limited to this. For example, the second liquid receiving portion 55b is in contact with the inner wall portion 54d to close the opening inside the upper end. It may be.

  The 3rd cup 50c is provided with the 3rd peripheral wall part 54c and the 3rd liquid receiving part 55c, and is arranged adjacent to the 2nd cup 50b on the opposite side to the 1st cup 50a. The third peripheral wall portion 54c is erected on the outer peripheral side of the second peripheral wall portion 54b at the bottom 53, and is formed in a cylindrical shape. A space between the third peripheral wall portion 54c and the second peripheral wall portion 54b serves as a third drainage groove 501c for collecting and discharging the processing liquid and the like.

  The third liquid receiving portion 55c is formed so as to be continuous from the upper end of the third peripheral wall portion 54c. The third liquid receiver 55c is formed so as to surround the periphery of the wafer W held by the holder 31 and to extend above the first liquid receiver 55a and the second liquid receiver 55b.

  As shown in FIG. 3, the third liquid receiving portion 55c has an opening formed inside the upper end of the third liquid receiving portion 55c when the first and second liquid receiving portions 55a and 55b are both at the retracted position. A flow path leading from the opening to the third drain groove 501c is formed.

  On the other hand, the third liquid receiving part 55c is in a position where the second liquid receiving part 55b is raised, or in a position where both the first liquid receiving part 55a and the second liquid receiving part 55b are raised. In this case, the second liquid receiving portion 55b contacts, the opening inside the upper end is closed, and the flow path leading to the third drainage groove 501c is closed.

  The bottom 53 corresponding to the first to third cups 50a to 50c described above, more precisely, the bottom 53 corresponding to the first to third drain grooves 501a to 501c are respectively provided with drain ports 51a to 51c. It is formed at intervals along the circumferential direction of 50.

  Here, the processing liquid discharged from the drain port 51a is an acid-based processing liquid, the processing liquid discharged from the drain port 51b is an alkaline processing liquid, and the processing liquid discharged from the drain port 51c is an organic processing liquid. An example will be described. In addition, the kind of process liquid discharged | emitted from each above-mentioned drainage port 51a-51c is an illustration to the last, and is not limited.

  The drainage port 51a is connected to the drainage pipe 91a. The drainage pipe 91a is inserted with a valve 62a in the middle, and is branched into a first drainage pipe 91a1 and a second drainage pipe 91a2 at the position of the valve 62a. As the valve 62a, for example, a three-way valve that can be switched between a valve closing position, a position where the discharge path is opened to the first drain pipe 91a1, and a position where the drain path is opened to the second drain pipe 91a2. Can be used.

  When the acid-based treatment liquid described above is reusable, the first drainage pipe 91a1 is connected to an acid-based treatment liquid supply source 70b (for example, a tank that stores the acid-based treatment liquid), and the waste liquid is treated with an acid-based treatment. Return to the liquid supply source 70b. That is, the first drainage pipe 91a1 functions as a circulation line. The second drain pipe 91a2 will be described later.

  The drain port 51b is connected to the drain pipe 91b. A valve 62b is inserted in the middle of the drain pipe 91b. Further, the drain port 51c is connected to the drain pipe 91c. A valve 62c is inserted in the middle of the drain pipe 91c. The valves 62b and 62c are controlled by the control device 4.

  Then, when performing the substrate processing, the processing unit 16 performs the first liquid receiving portion 55a of the first cup 50a and the second cup 50b of the first cup 50b according to the type of processing liquid used in each processing during the substrate processing. The two-liquid receiving part 55b is moved up and down, and the drainage ports 51a to 51c are switched.

  For example, when processing the wafer W by discharging the acid-based processing liquid onto the wafer W, the control device 4 controls the driving unit 33 of the substrate holding mechanism 30 to rotate the holding unit 31 at a predetermined rotation speed. The valve 60b is opened.

  At this time, the control device 4 raises the first cup 50a. That is, the control device 4 raises the first and second support members 56a and 57a via the first and second lifting and lowering drive parts 56b and 57b, and raises the first liquid receiving part 55a to the processing position. A flow path leading from the opening inside the upper end of the first liquid receiving portion 55a to the first drainage groove 501a is formed. As a result, the acid-based processing liquid supplied to the wafer W flows downward and flows into the first drain groove 501a.

  Further, the control device 4 controls the valve 62a so as to open the discharge path toward the first drain pipe 91a1. As a result, the acid-based treatment liquid that has flowed into the first drainage groove 501a is returned to the acid-based treatment liquid supply source 70b via the drainage pipe 91a and the first drainage pipe 91a1. Then, the acid-based treatment liquid returned to the acid-based treatment liquid supply source 70b is supplied again to the wafer W. Thus, the first cup 50a is connected to a circulation line that circulates the collected acid-based treatment liquid and supplies it to the wafer W again.

  Further, for example, when processing the wafer W by discharging an alkaline processing liquid onto the wafer W, the control device 4 similarly controls the driving unit 33 to rotate the valve 60a while rotating the holding unit 31 at a predetermined rotational speed. Open.

  At this time, the control device 4 raises only the second cup 50b. That is, the control device 4 raises the second support member 57a via the second lifting / lowering drive part 57b and raises the second liquid receiving part 55b to the processing position, so that the inner side of the upper end of the second liquid receiving part 55b is increased. A flow path leading from the opening to the second drainage groove 501b is formed. Here, it is assumed that the first cup 50a is lowered. Thereby, the alkaline processing liquid supplied to the wafer W flows downward and flows into the second drain groove 501b.

  The control device 4 keeps the valve 62b open. Thereby, the alkaline processing liquid in the second drainage groove 501b is discharged to the outside of the processing unit 16 through the drainage pipe 91b. Thus, the drainage pipe 91b functions as a drainage line for discharging the collected second processing liquid to the outside of the processing unit 16. That is, the second cup 50b is connected to the drain line.

  For example, when processing the wafer W by discharging the organic processing liquid onto the wafer W, the control device 4 similarly controls the driving unit 33 to rotate the valve 60c while rotating the holding unit 31 at a predetermined rotational speed. Open.

  At this time, the control device 4 lowers the first and second cups 50a and 50b (see FIG. 3). That is, the control device 4 lowers the first and second support members 56a and 57a via the first and second elevating drive units 56b and 57b, and moves the first and second liquid receiving units 55a and 55b to the retracted position. Lower. By doing in this way, the flow path which leads from the opening inside the upper end of the 3rd liquid receiving part 55c to the 3rd drainage groove 501c is formed. Thereby, the organic processing liquid supplied to the wafer W flows downward and flows into the third drain groove 501c.

  Further, the control device 4 keeps the valve 62c open, so that the organic processing liquid in the third drainage groove 501c is discharged to the outside of the processing unit 16 through the drainage pipe 91c. Thus, the third cup 50c is also connected to a drain line (for example, a drain pipe 91c) that discharges the recovered third processing liquid to the outside of the processing unit 16.

  In addition, the discharge path | route of the above-mentioned acid processing liquid, alkaline processing liquid, organic processing liquid, and washing | cleaning liquid is an illustration, and is not limited. That is, for example, each drainage port 51a-51c is connected to one drainage pipe, and a plurality of valves corresponding to the properties of the treatment liquid such as acidic and alkaline are provided in one drainage pipe, The discharge path may be branched from the valve position.

  Further, a drain pipe 92a that communicates with an insertion hole through which the first support member 56a is inserted in the first peripheral wall portion 54a is connected to the drain pipe 91b. The drainage pipe 92a discharges cleaning liquid (described later) that has entered the insertion hole of the first peripheral wall portion 54a, and the cleaning liquid is discharged to the outside of the processing unit 16 through the drainage pipe 91b.

  Further, the drainage pipe 92c connected to the insertion hole through which the second support member 57a is inserted is connected to the drainage pipe 91c. The drainage pipe 92b discharges the cleaning liquid that has entered the insertion hole of the second peripheral wall portion 54b, and the cleaning liquid is discharged to the outside of the processing unit 16 through the drainage pipe 91c.

  Exhaust ports 52a, 52b, and 52c are formed in the bottom 53, the first peripheral wall portion 54a, and the second peripheral wall portion 54b of the recovery cup 50, respectively. The exhaust ports 52a, 52b, and 52c are connected to one exhaust pipe, and the exhaust pipe is branched into first to third exhaust pipes 93a to 93c on the downstream side of the exhaust. A valve 64a is inserted in the first exhaust pipe 93a, a valve 64b is inserted in the second exhaust pipe 93b, and a valve 64c is inserted in the third exhaust pipe 93c.

  The first exhaust pipe 93a is an acidic exhaust pipe, the second exhaust pipe 93b is an alkaline exhaust, and the third exhaust pipe 93c is an organic exhaust pipe. These are switched by the control device 4 in accordance with each processing of the substrate processing.

  For example, at the time of execution of processing that generates acidic exhaust gas, switching to the first exhaust pipe 93a is performed by the control device 4, and acidic exhaust gas is discharged through the valve 64a. Similarly, in the case of processing that causes alkaline exhaust, switching to the second exhaust pipe 93b is performed by the control device 4, and alkaline exhaust is discharged through the valve 64b. In the case of processing that generates organic exhaust, switching to the third exhaust pipe 93c is performed by the control device 4, and the organic exhaust is discharged through the valve 64c.

  Hereinafter, in this embodiment, BHF (mixed solution of hydrofluoric acid and ammonium fluoride solution (buffered hydrofluoric acid)) is used as the acid-based treatment liquid. Further, SC1 (a mixture of ammonia, hydrogen peroxide and water) is used as the alkaline processing liquid, and IPA (isopropyl alcohol) is used as the organic processing liquid. Note that the types of the acid processing solution, the alkali processing solution, and the organic processing solution are not limited to these.

  By the way, when BHF is used in the processing unit 16, the BHF treatment liquid atmosphere or the scattered BHF enters, for example, the gap between the first liquid receiving portion 55a and the first peripheral wall portion 54a, and the invaded BHF atmosphere. As a result, it was found that foreign matters such as BHF crystals adhere to the upper surface 54a1 of the first peripheral wall portion 54a. In addition, there exists a possibility that the above foreign materials may adhere not only to BHF but also in the case of other types of processing liquids.

  Therefore, the processing unit 16 according to the present embodiment is configured to supply the cleaning liquid to the upper surface 54a1 of the first peripheral wall portion 54a of the first cup 50a. Thereby, foreign matters such as crystals attached to the upper surface 54a1 of the first peripheral wall portion 54a can be removed.

<3. Specific Configuration of Cleaning Liquid Supply Unit and First Circumferential Wall>
Hereinafter, the configuration for supplying the cleaning liquid to the upper surface 54a1 of the first peripheral wall portion 54a will be described in detail with reference to FIG. FIG. 4 is a schematic plan view when the first peripheral wall portion 54a is viewed from above the Z-axis. FIG. 5 is a schematic cross-sectional view taken along line VV in FIG. In FIG. 5, for convenience of understanding, the first liquid receiving portion 55 a provided on the upper surface 54 a 1 of the first peripheral wall portion 54 a is indicated by an imaginary line.

  As shown in FIG. 5, the cleaning liquid supply unit 80 of the processing unit 16 further includes a cleaning liquid supply pipe 84c and a valve 85c. One end of the cleaning liquid supply pipe 84 c is connected to the cleaning liquid supply source 83, and a cleaning liquid discharge port 85 (hereinafter sometimes referred to as “discharge port 85”) is formed at the other end.

  In addition, as shown in FIGS. 4 and 5, the first peripheral wall portion 54 a includes a groove portion 58. Specifically, the groove portion 58 is formed on the inner peripheral side of the upper surface 54a1 of the first peripheral wall portion 54a, and is formed along the circumferential direction on the upper surface 54a1. More specifically, the groove portion 58 is formed to be annular in plan view. In addition, the position where the groove part 58 is formed on the upper surface 54a1 of the first peripheral wall part 54a can be appropriately changed. For example, the groove part 58 may be formed close to the outer peripheral side of the upper surface 54a1.

  A plurality of (for example, three) discharge ports 85 of the cleaning liquid supply pipe 84c described above are formed in, for example, the groove portion 58 in the upper surface 54a1 of the first peripheral wall portion 54a. Further, the discharge ports 85 are arranged at substantially equal intervals in the circumferential direction around the rotation center C of the holding unit 31. In addition, the number and arrangement position of the above-described discharge ports 85 are examples and are not limited.

  As shown in FIG. 5, the valve 85 c is provided in the cleaning liquid supply pipe 84 c and is controlled by the control device 4. Therefore, the control device 4 opens the valve 85c when performing the cleaning process on the upper surface 54a1 of the first peripheral wall portion 54a. Thereby, the cleaning liquid of the cleaning liquid supply source 83 is discharged from the discharge port 85 through the valve 85c and the cleaning liquid supply pipe 84c.

  The cleaning liquid supplied from the cleaning liquid supply unit 80, specifically, the cleaning liquid discharged from the discharge port 85 flows through the groove 58 and overflows from the groove 58. Then, the cleaning liquid overflowing from the groove portion 58 is supplied over the entire upper surface 54a1 of the first peripheral wall portion 54a, and the upper surface 54a1 is cleaned to remove foreign matters. In addition, the cleaning liquid that has cleaned the upper surface 54a1 then flows into the side surface 54a2 of the first peripheral wall 54a, the exhaust port 52b, and the like to clean and remove the adhered foreign matter.

  As described above, since the first peripheral wall portion 54a includes the groove portion 58 formed along the circumferential direction, the cleaning liquid can be supplied over a wide range of the upper surface 54a1 through the groove portion 58. Therefore, the upper surface 54a1 can be efficiently cleaned. Further, since the discharge port 85 is formed in the groove portion 58, the cleaning liquid can be reliably supplied to the groove portion 58 and allowed to flow.

  Further, as shown in FIG. 5, the cleaning process may be performed in a state where the first liquid receiving portion 55a is moved to the retracted position. That is, the cleaning liquid supply unit 80 may supply the cleaning liquid in a state where the first liquid receiving unit 55a is moved to the retracted position below the processing position.

  Thereby, since the lower surface 55a1 of the first liquid receiving portion 55a is close to the upper surface 54a1 of the first peripheral wall portion 54a, the cleaning liquid flowing through the upper surface 54a1 is also supplied to the lower surface 55a1 of the first liquid receiving portion 55a. Also, the foreign matter can be removed and cleaned.

  Further, the cleaning liquid supply unit 80 may change the flow rate of the cleaning liquid between when the upper surface 54a1 of the first peripheral wall 54a is cleaned and when the lower surface 55a1 of the first liquid receiving unit 55a is cleaned. For example, the cleaning liquid supply unit 80 increases the flow rate of the cleaning liquid when cleaning the lower surface 55a1 of the first liquid receiving unit 55a rather than the flow rate of the cleaning liquid when cleaning the upper surface 54a1 of the first peripheral wall portion 54a. Also good. As a result, the cleaning liquid can surely reach the lower surface 55a1 of the first liquid receiving portion 55a, and the lower surface 55a1 can be efficiently cleaned.

  In addition, the cleaning process may be performed in a state where the holding unit 31 and the first and second rotary cups 101 and 102 are rotated. That is, the cleaning liquid supply unit 80 may supply the cleaning liquid to the upper surface 54a1 of the first peripheral wall 54a in a state where the holding unit 31 and the like are rotated.

  As a result, a swirling flow is generated in the recovery cup 50 by the rotation of the holding portion 31 and the first and second rotating cups 101 and 102. The swirl flow acts on the cleaning liquid discharged from the discharge port 85, and causes the cleaning liquid to move in one direction along the circumferential direction on the upper surface 54a1 of the first peripheral wall portion 54a (clockwise direction (clockwise direction in FIG. 4)). And the flow rate of the cleaning liquid can be increased. Accordingly, the cleaning liquid spreads over a wider range on the upper surface 54a1, and thus the upper surface 54a1 can be efficiently cleaned.

  FIG. 6A is a schematic cross-sectional view taken along the line VI-VI in FIG. 4 and is a diagram illustrating a state of cleaning in a state where the first liquid receiving portion 55a is lowered. FIG. 6B is a diagram showing a state of cleaning in a state where the first liquid receiving portion 55a is raised. In the present embodiment, cleaning is performed both in the state where the first liquid receiving portion 55a is raised and in the lowered state, which will be described later.

  As shown in FIGS. 6A and 6B, the insertion hole 59 through which the first support member 56a is inserted is formed in the first peripheral wall portion 54a as described above. The insertion hole 59 has an opening 59a formed in the upper surface 54a1 of the first peripheral wall 54a.

  And the opening part 59a of the insertion hole 59 which concerns on this embodiment is formed so that it may overlap with at least one part of the groove part 58 in planar view, as shown in FIG. Thereby, in the cleaning liquid supply unit 80, the cleaning liquid is supplied from the groove 58 of the upper surface 54a1 of the first peripheral wall 54a to the insertion hole 59 through the opening 59a.

  As a result, as shown in FIGS. 6A and 6B, the outer periphery of the first support member 56a and the insertion hole 59 can be cleaned, and foreign matters attached to the outer periphery of the first support member 56a and the insertion hole 59 can be removed. Can do. The cleaning liquid flowing into the insertion hole 59 is discharged to the outside of the processing unit 16 through the drain pipe 92a and the valve 62b.

<4. Specific operation of substrate processing system>
Next, the contents of the substrate processing executed by the substrate processing system 1 according to the present embodiment will be described with reference to FIG.

  FIG. 7 is a flowchart showing a processing procedure of processing executed by the substrate processing system 1 according to the present embodiment. Each processing procedure shown in FIG. 7 is executed according to the control of the control unit 18 of the control device 4.

  As shown in FIG. 7, in the processing unit 16, first, a wafer W is carried in (step S1). In the carry-in process, the wafer W is held by the holding unit 31 after the wafer W is placed on the holding unit 31 by the substrate transfer device 17 (see FIG. 1).

  Subsequently, in the processing unit 16, the first chemical liquid process is performed (step S2). In the first chemical treatment, the control unit 18 first rotates the holding unit 31 by the driving unit 33 to rotate the wafer W. Subsequently, the control unit 18 opens the valve 60a for a predetermined time, and supplies SC1 from the nozzle 41 to the surface of the wafer W. Thereby, the surface of the wafer W is processed by SC1.

  Subsequently, in the processing unit 16, a first rinsing process is performed (step S3). In the first rinsing process, the controller 18 opens the valve 60d for a predetermined time and supplies DIW to the wafer W from the nozzle 41. Thereby, SC1 remaining on the wafer W is washed away by DIW.

  Next, in the processing unit 16, a second chemical liquid process is performed (step S4). In the second chemical treatment, the control unit 18 opens the valve 60b for a predetermined time and supplies BHF from the nozzle 41 to the surface of the wafer W. Thereby, the surface of the wafer W is processed by BHF.

  Subsequently, the processing unit 16 performs the second rinsing process (step S5). In the second rinsing process, the controller 18 opens the valve 60d for a predetermined time and supplies DIW to the surface of the wafer W from the nozzle 41. Thereby, the BHF remaining on the wafer W is washed away by DIW.

  Next, in the processing unit 16, a drying process is performed (step S6). In the drying process, the control unit 18 opens the valve 60c for a predetermined time and supplies IPA from the nozzle 41 to the surface of the wafer W. Thereby, DIW remaining on the surface of the wafer W is replaced with IPA having higher volatility than DIW. Thereafter, the IPA on the wafer W is shaken off to dry the wafer W.

  Subsequently, an unloading process is performed in the processing unit 16 (step S7). In the unloading process, the control unit 18 stops the rotation of the wafer W by the driving unit 33 and then unloads the wafer W from the processing unit 16 by the substrate transfer device 17 (see FIG. 1). When such unloading processing is completed, a series of substrate processing for one wafer W is completed.

  Next, in the processing unit 16, a cleaning process for cleaning the upper surface 54a1 of the first peripheral wall portion 54a is performed (step S8). This cleaning process does not need to be performed every time one wafer W is unloaded. In other words, the timing at which the cleaning process is executed can be arbitrarily set. For example, after the substrate processing for a plurality of wafers W is performed, the cleaning process may be performed once. Further, during the process of step S8, the above-described substrate holding mechanism 30 may be cleaned.

  The cleaning process of the first peripheral wall portion 54a will be described with reference to FIG. FIG. 8 is a flowchart illustrating an example of a processing procedure of the cleaning process for the first peripheral wall portion 54 a executed in the substrate processing system 1.

  The control unit 18 of the control device 4 raises the first support member 56a by the first elevating drive unit 56b and raises the first liquid receiving unit 55a (step S10, see FIG. 6B). Subsequently, the control unit 18 opens the valve 85c of the cleaning liquid supply unit 80, and supplies the cleaning liquid to the upper surface 54a1 of the first peripheral wall 54a (step S11).

  Subsequently, when a predetermined time elapses after supplying the cleaning liquid, the control unit 18 lowers the first support member 56a by the first elevating drive unit 56b and moves the first liquid receiving unit 55a to the retracted position (step) S12, see FIG. 6A).

  Thus, the lower surface 55a1 of the first liquid receiving part 55a can be cleaned by setting the first liquid receiving part 55a to the retracted position. Further, when the first liquid receiving portion 55a is moved up and down during the cleaning process, the first support member 56a moves in the insertion hole 59 filled with the cleaning liquid, and accordingly, on the outer periphery of the first support member 56a. The adhered foreign matter can be efficiently removed. In addition, you may make it repeat above-mentioned raising / lowering operation | movement of the 1st liquid receiving part 55a several times.

  Next, the control unit 18 closes the valve 85c of the cleaning liquid supply unit 80 and supplies the cleaning liquid to the upper surface 54a1 of the first peripheral wall 54a when a predetermined time has elapsed since the first liquid receiving unit 55a is lowered. Is stopped (step S13). Thereby, the cleaning process of the first peripheral wall portion 54a is completed.

  The control unit 18 may perform the cleaning process while the holding unit 31 and the first and second rotary cups 101 and 102 are rotated. As described above, by rotating the holding portion 31 and the like, a swirling flow is generated and the cleaning liquid spreads over a wide range on the upper surface 54a1.

  As described above, the processing unit 16 according to the first embodiment (corresponding to an example of “substrate processing apparatus”) corresponds to an example of the holding unit 31 and the processing fluid supply unit 40 (“processing liquid supply unit”). ), A recovery cup 50, and a cleaning liquid supply unit 80. The holding unit 31 holds the wafer W. The processing fluid supply unit 40 supplies a processing liquid to the wafer W.

  The first cup 50 a of the recovery cup 50 receives the bottom 53, a cylindrical first peripheral wall 54 a erected from the bottom 53, and the processing liquid scattered from the wafer W provided above the first peripheral wall 54 a. The first liquid receiving part 55a and the groove part 58 formed along the circumferential direction on the upper surface of the first peripheral wall part 54a are provided to surround the holding part 31. The cleaning liquid supply unit 80 supplies the cleaning liquid to the upper surface 54a1 of the first peripheral wall 54a. Thereby, the foreign material adhering to the upper surface 54a1 of the 1st surrounding wall part 54a can be removed.

<5. Modification>
Next, first to fourth modifications of the processing unit 16 according to the first embodiment will be described. In the processing unit 16 in the first modified example, the shape of the groove 58 formed in an annular shape in the first embodiment is changed.

  FIG. 9 is a schematic plan view when the first peripheral wall portion 54a in the first modification is viewed from above the Z-axis. As shown in FIG. 9, in the first modification, the groove portion 58 is divided into a plurality (three in the example of FIG. 9), and the divided groove portions 58 are arranged along the circumferential direction on the upper surface 54a1 of the first peripheral wall portion 54a. It is formed.

  Further, the above-described cleaning liquid discharge port 85 is formed in each of the divided grooves 58. The position where the discharge port 85 is formed is preferably, for example, in the vicinity of the upstream end of the groove 58 in the flow direction of the cleaning liquid. As a result, the cleaning liquid can flow from the end of the groove portion 58, and thus the cleaning liquid overflowing from the groove portion 58 while flowing through the groove portion 58 spreads over a wide area on the upper surface 54a1, and the upper surface 54a1 can be cleaned efficiently. In addition, the position where the discharge port 85 is formed in the groove portion 58 is not limited to the above.

  Next, a second modification will be described. In the processing unit 16 according to the second modification, the direction of the discharge port 85 of the cleaning liquid supply unit 80 is changed. FIG. 10 is an enlarged longitudinal sectional view showing the vicinity of the discharge port 85 of the cleaning liquid supply pipe 84c in the second modification.

  As shown in FIG. 10, in the second modification, a cleaning liquid supply path 84c1 through which the cleaning liquid supplied from the cleaning liquid supply pipe 84c flows is connected to the discharge port 85. The cleaning liquid supply path 84c1 is inclined along the circumferential direction of the first peripheral wall portion 54a (the left-right direction in FIG. 10), and is configured to incline the discharge direction of the discharge port 85 with respect to the Z-axis direction. In other words, the cleaning liquid supply path 84c1 is formed such that the discharge direction of the cleaning liquid from the discharge port 85 is directed in one direction along the circumferential direction on the upper surface 54a1 of the first peripheral wall portion 54a. The “one direction” here is the same direction as the direction of the force acting on the cleaning liquid by the swirling flow of the first and second rotating cups 101 and 102, that is, the clockwise direction in FIG.

  Accordingly, the cleaning liquid can flow in one direction along the circumferential direction on the upper surface 54a1 of the first peripheral wall portion 54a regardless of the presence or absence of the swirling flow. Can be washed well.

  Further, in the processing unit 16, the flow rate of the cleaning liquid discharged from the discharge port 85 of the cleaning liquid supply unit 80 may be changed according to the portion to be cleaned in the upper surface 54a1 of the first peripheral wall portion 54a.

  FIG. 11 is a diagram showing an example of the relationship between the distance from the discharge port 85 of the part to be cleaned and the flow rate of the cleaning liquid. As shown in FIG. 11, when the distance from the discharge port 85 to the cleaning site is relatively short, that is, for example, when the vicinity of the discharge port 85 is cleaned, the flow rate A of the cleaning liquid is set to a relatively low value. As a result, a relatively large amount of cleaning liquid is supplied in the vicinity of the discharge port 85, and the vicinity of the discharge port 85 can be efficiently cleaned.

  On the other hand, when the distance from the discharge port 85 to the cleaning site is relatively long, that is, when, for example, the vicinity of the first support member 56a that is relatively far from the discharge port 85 is cleaned, the flow rate B of the cleaning liquid is near the discharge port 85. The value is higher than that in the case of cleaning. Accordingly, a relatively large amount of cleaning liquid is supplied, for example, in the vicinity of the first support member 56a, and the vicinity of the first support member 56a can be efficiently cleaned.

  As described above, it is possible to perform local cleaning on the upper surface 54a1 by changing the flow rate of the cleaning liquid discharged from the discharge port 85 in accordance with the portion to be cleaned in the upper surface 54a1 of the first peripheral wall portion 54a. .

  In the example illustrated in FIG. 11, the flow rate of the cleaning liquid is continuously increased as the distance from the discharge port 85 to the cleaning site increases, but this is an example and is not limited. That is, for example, the method of increasing the flow rate of the cleaning liquid can be arbitrarily changed, for example, the flow rate of the cleaning liquid is increased stepwise (stepwise).

  Next, a third modification will be described. FIG. 12A is a schematic cross-sectional view showing the first peripheral wall portion 54a in the third modified example.

  As shown to FIG. 12A, the 1st surrounding wall part 54a in a 3rd modification is provided with the inclination part 54a3. The inclined portion 54a3 is formed on the upper surface 54a1, and is formed to have a downward slope toward the groove portion 58. Thereby, for example, even when the cleaning liquid A remains on the upper surface 54a1 after the cleaning process, the remaining cleaning liquid A flows into the cleaning liquid supply pipe 84c through the inclined portion 54a3.

  As described above, in the third modification, the inclined portion 54a3 is provided so that the remaining cleaning liquid A does not easily stop on the upper surface 54a1. Thereby, it can suppress that the density | concentration of a process liquid falls in the board | substrate process performed after a washing process.

  That is, for example, if the cleaning liquid A remains on the upper surface 54a1, the cleaning liquid A may be mixed into the processing liquid in the substrate processing after the cleaning processing, and the concentration of the processing liquid may decrease. However, in the third modified example, since the inclined portion 54a3 as described above is provided, a decrease in the concentration of the processing liquid can be suppressed.

  Next, a fourth modification will be described. In the third modification described above, the inclined portion 54a3 is formed so as to be inclined downward toward the groove portion 58, but the shape of the inclined portion is not limited to this. FIG. 12B is a schematic cross-sectional view showing the first peripheral wall portion 54a in the fourth modified example.

  As shown in FIG. 12B, the inclined portion 54a4 according to the fourth modified example is formed on the upper surface 54a1 of the first peripheral wall portion 54a and is formed to have a downward slope toward the side surface 54a2 of the first peripheral wall portion 54a. Is done.

  Thereby, for example, the cleaning liquid A remaining on the upper surface 54a1 after the cleaning process flows to the side surface 54a2 through the inclined portion 54a4 and is discharged. Accordingly, in the fourth modified example, similarly to the third modified example, by providing the inclined portion 54a4, the remaining cleaning liquid A can be hardly stopped on the upper surface 54a1, and thus in the substrate processing performed after the cleaning processing. , It can suppress that the density | concentration of a process liquid falls.

(Second Embodiment)
Next, the substrate processing system 1 according to the second embodiment will be described. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  In 2nd Embodiment, it was set as the structure which suppresses that a process liquid splashes to the rotation center C side in the back surface side of the holding part 31. FIG. Hereinafter, such a configuration will be described with reference to FIG.

  FIG. 13 is a schematic bottom view when the back surface 31a of the holding portion 31 is viewed from below the Z-axis. As shown in FIG. 13, the first fixing portion 110 that fixes the holding member 311 to the holding portion 31 and the support pins 312 (see FIG. 17) of the wafer W are fixed to the holding portion 31 on the back surface 31 a of the holding portion 31. And a second fixing part 120 is provided.

  A plurality (three in the example of FIG. 13) of the first fixing part 110 and the second fixing part 120 are provided. The first and second fixing portions 110 and 120 are arranged at substantially equal intervals in the circumferential direction around the rotation center C of the holding portion 31. Note that the numbers and arrangement positions of the first and second fixing portions 110 and 120 described above are examples and are not limited.

  FIG. 14A is a schematic bottom view showing the first fixing portion 110 in an enlarged manner, and FIG. 14B is a schematic bottom view showing the first fixing portion 210 according to the comparative example. FIG. 15 is a cross-sectional view taken along line XV-XV in FIG.

  As shown in FIG. 15, the holding member 311 is positioned so as to be inserted through the through hole 31 b of the holding unit 31, and holds the wafer W with the notch portion on the one end 311 a side. Further, the other end 311 b of the holding member 311 is exposed to the back surface 31 a side of the holding unit 31, and the other end 311 b is fixed by the first fixing unit 110.

  Before continuing description of the 1st fixing | fixed part 110, the 1st fixing | fixed part 210 which concerns on a comparative example is demonstrated using FIG. 14B. As shown in FIG. 14B, the first fixing portion 210 in the comparative example includes a main body portion 211 that partially sandwiches both side surfaces of the other end 311 b of the holding portion 31, and a screw that fastens and fixes the main body portion 211 to the holding portion 31. 212.

  The main body 211 is shaped such that the other end 311b protrudes toward the rotation center C (see FIG. 13) of the holding portion 31 at a position where the other end 311b of the holding portion 31 is sandwiched. Further, as the screw 212, a minus screw is used.

  When the first fixing unit 210 is configured as described above, for example, the processing liquid splashes toward the rotation center C of the holding unit 31, and foreign substances such as processing liquid crystals are present in the vicinity of the first fixing unit 210. There was a risk of adhesion.

  That is, when the holding portion 31 is rotated in the rotation direction D, the scattered processing liquid hits a portion protruding from the main body portion 211 as shown by a broken curve B1 in FIG. There was a case of liquid splashing towards.

  When the screw 212 is a minus screw, depending on the direction of the minus groove 212a, the processing liquid may splash through the minus groove 212a toward the rotation center C of the holding unit 31. The treatment liquid splashed as described above may dry on the back surface 31a of the holding unit 31 and adhere as foreign matter such as crystals.

  Therefore, the first fixing unit 110 according to the second embodiment is configured to be able to suppress the occurrence of liquid splash as described above. Specifically, as shown in FIG. 14A, the first fixing part 110 includes a main body part 111 and a screw 112.

  The main body 111 sandwiches both side surfaces of the other end 311 b of the holding unit 31 as a whole. That is, the other end 311b of the holding portion 31 is not projected at the position where the holding portion 31 of the main body 111 is sandwiched. Thereby, it can suppress that a process liquid hits the main-body part 111 and a liquid splashes.

  In the main body 111, an inclined guide portion 111 a for guiding the processing liquid to the outside of the holding unit 31 is formed on a side surface on which the scattered processing liquid is likely to hit, that is, a side surface on the rotation direction D side. Thereby, the scattered processing liquid flows to the outside of the holding part 31 by the inclined guide part 111a, and thus the liquid splashing of the processing liquid can be suppressed.

  Further, as the screw 112, a hexagonal screw is used. Thereby, it can suppress that a process liquid splashes through the groove | channel of the head of the screw | thread 112 to the rotation center C side by the side of the holding | maintenance part 31. FIG. The screw 112 is not limited to a hexagonal screw, and may be any type of screw as long as it does not have a groove in the head that allows the treatment liquid to flow.

  In addition, as shown by an imaginary line in FIG. 14A, the inclined guide part 111c may be formed on the side surface of the main body 111 opposite to the side surface on which the inclined guide part 111a is formed. Thereby, the scattered processing liquid flows to the outside of the holding part 31 by the inclined guide part 111c, and thus the splashing of the processing liquid can be further suppressed.

  Next, the second fixing portion 120 will be described with reference to FIGS. 16 and 17. 16 is a schematic bottom view showing the second fixing portion 120 in an enlarged manner, and FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG.

  As shown in FIG. 17, the support pins 312 of the wafer W are members that support the wafer W from the lower surface side. Specifically, the support pins 312 are positioned so as to be inserted through the through holes 31 c of the holding unit 31 and support the wafer W on the one end 312 a side. Further, the other end 312 b of the support pin 312 protrudes toward the back surface 31 a side of the holding portion 31, and the other end 312 b is fixed by the second fixing portion 120.

  In the 2nd fixing | fixed part 120 which concerns on 2nd Embodiment, it was set as the structure which can suppress generation | occurrence | production of the above liquid splashes. Specifically, as shown in FIG. 16, the second fixing portion 120 includes a main body portion 121 and a screw 122.

  The main body 121 has a quadrangular shape when viewed from below. Thereby, it can suppress that a process liquid contacts the main-body part 121 and splashes.

  Further, in the main body 121, an inclined guide part 121 a for guiding the processing liquid to the outside of the holding part 31 is formed on the side where the scattered processing liquid can easily hit, that is, the side on the rotation direction D side. Thereby, the scattered processing liquid flows to the outside of the holding part 31 by the inclined guide part 121a, and thus the liquid splashing of the processing liquid can be suppressed.

  In addition, a hexagonal screw is used as the screw 122. Thereby, it is possible to suppress liquid splashing toward the rotation center C side on the holding unit 31 side. The screw 122 is not limited to a hexagonal screw, like the screw 112.

  In addition, as shown by an imaginary line in FIG. 16, in the main body 121, the inclined guide part 121c may be formed on the side surface opposite to the side surface on which the inclined guide part 121a is formed. Thereby, the scattered processing liquid flows to the outside of the holding part 31 by the inclined guide part 121c, and thus the liquid splashing of the processing liquid can be further suppressed.

(Third embodiment)
Next, the cleaning liquid supply unit 80 of the processing unit 16 according to the third embodiment will be described. FIG. 18 is a schematic plan view of the first peripheral wall portion 54a in the third embodiment. As shown in FIG. 18, in the third embodiment, the discharge port 85 is an opening formed over a predetermined range on the bottom surface of the groove portion 58. The boundary between the discharge port 85 and the groove portion 58 includes the upper end edge 84d (see FIGS. 19 and 20 described later) of the inclined portion of the cleaning liquid supply path 84c1, but is not limited thereto. Further, the discharge port 85 is formed so that the opening area is larger than the area of the flow path of the cleaning liquid supply pipe 84c (see FIG. 20).

  Then, by providing the intermediate portion 400 between the discharge port 85 and the cleaning liquid supply pipe 84c, the water flow of the cleaning liquid from the cleaning liquid supply pipe 84c is weakened, and the discharge direction of the discharge port 85 is inclined, so that the cleaning liquid supply pipe 84c The flow path for the cleaning liquid is directed to the groove 58. In other words, the intermediate portion 400 functions as a buffer that weakens the water flow of the cleaning liquid supplied from the cleaning liquid supply pipe 84c to a water flow suitable for supplying the upper surface 54a1 and the groove 58, and a function that changes the direction of the flow path of the cleaning liquid. And was prepared.

  Hereinafter, a detailed configuration of the intermediate unit 400 will be described with reference to FIGS. 19 and 20. FIG. 19 is a schematic enlarged plan view in which the vicinity of the closed curve E1 indicated by the alternate long and short dash line in FIG. 18 is enlarged. 20 is a cross-sectional view taken along line XX-XX in FIG.

  As shown in FIGS. 19 and 20, the cleaning liquid supply unit 80 includes an intermediate unit 400, and the intermediate unit 400 includes a base 401 including a recess 402 and a flow path 403.

  The base 401 is formed in a columnar shape (an example of a columnar shape), but is not limited to this, and may be other shapes such as a prismatic shape. The recess 402 is formed on the side surface of the base 401 along the circumferential direction. In the example shown in FIGS. 19 and 20, the recess 402 is formed over the entire circumference of the side surface of the base 401, but is not limited thereto, and may be formed in a part of the side surface of the base 401.

  Further, a staying portion 404 is formed between the recess 402 and the first peripheral wall portion 54a. The staying portion 404 is a space formed by the concave portion 402 and the first peripheral wall portion 54a when the intermediate portion 400 is attached to the first peripheral wall portion 54a. In the staying portion 404, the cleaning liquid supplied from the cleaning liquid supply pipe 84c is temporarily retained as will be described later, so that the water flow of the cleaning liquid can be weakened and the cleaning liquid can be prevented from scattering. Further, in the staying portion 404, it becomes possible to increase the flow rate of the cleaning liquid due to the staying of the cleaning liquid, and the cleaning liquid can be spread over the entire groove portion 58 in a short time.

  The flow path 403 is formed inside the base 401, and the cleaning liquid supplied from the cleaning liquid supply pipe 84c flows. In the channel 403, an inflow port 403a is formed at one end, and an outflow port 403b is formed at the other end.

  The inflow port 403a is formed near the center of the lower surface of the base 401, and is connected to the cleaning liquid supply pipe 84c to allow the cleaning liquid to flow in. The outflow port 403b is formed in the recess 402, and allows the cleaning liquid flowing into the inflow port 403a to flow out. In other words, the outlet 403 b is formed on the side surface of the base 401. Thus, since the inlet 403a is formed on the lower surface of the base 401 and the outlet 403b is formed on the side surface of the base 401, the flow path 403 has a bent shape inside the base 401. Although it is formed in a letter shape, the shape and the like are not limited to this.

  As shown in FIG. 20, the intermediate part 400 configured as described above is attached to an attachment hole 86 formed in the first peripheral wall part 54a. At this time, the intermediate portion 400 is attached to the attachment hole 86 so that the axial direction of the columnar base portion 401 is along the Z-axis direction. Further, the intermediate portion 400 is positioned so that the inflow port 403a is connected to the cleaning liquid supply pipe 84c and the outflow port 403b faces the inclined portion of the cleaning liquid supply path 84c1 in a state of being attached to the mounting hole 86. .

  Next, the flow of the cleaning liquid will be described. As shown by the dashed arrows in FIG. 20, the cleaning liquid flows into the inlet 403a from the cleaning liquid supply pipe 84c, and then is discharged from the outlet 403b through the flow path 403. The At this time, since the cleaning liquid hits the upper end of the flow path 403 and then flows to the outlet 403b, the water force is appropriately weakened. Further, since the outlet 403b is formed in the recess 402, the cleaning liquid discharged from the outlet 403b hits the inclined portion of the cleaning liquid supply path 84c1 and rebounds, etc., and temporarily stays in the staying portion 404. Increased state.

  Then, the cleaning liquid whose flow rate has increased in the staying portion 404 flows from the inclined portion of the cleaning liquid supply path 84c1 toward the upper end edge 84d, and in a direction along the groove 58 from the discharge port 85 (left side in FIG. 20). It will be discharged. That is, the intermediate portion 400 inclines the discharge direction of the discharge port 85 with respect to the Z-axis direction, and discharges the cleaning liquid from the discharge port 85 in the direction along the groove portion 58.

  Thereby, in the third embodiment, as shown in FIG. 18, the cleaning liquid can flow in one direction along the circumferential direction on the upper surface 54a1 of the first peripheral wall portion 54a. In 54a1, it is possible to perform cleaning more efficiently by spreading over a wider range.

  Further, the opening area of the discharge port 85 is formed to be larger than the area of the flow path of the cleaning liquid supply pipe 84c. As a result, a relatively large amount of cleaning liquid can be supplied to the groove 58, and the cleaning liquid can be spread over the entire groove 58 in a short time. In addition, it is possible to prevent the cleaning liquid from being exposed to excessive water. In addition, although the above-mentioned intermediate part 400 is a different body from the 1st surrounding wall part 54a, you may be comprised integrally.

(Fourth embodiment)
Next, the cleaning liquid supply unit 80 of the processing unit 16 according to the fourth embodiment will be described. The intermediate part 400 according to the fourth embodiment is provided with a plurality of (for example, two) outlets 403b.

  FIG. 21 is a schematic plan view of the first peripheral wall portion 54a in the fourth embodiment. As shown in FIG. 21, in the fourth embodiment, the discharge port 85 is an opening formed so as to have a larger opening area in plan view than the discharge port 85 of the third embodiment.

  The cleaning liquid supply path 84c1 connected to the discharge port 85 includes a first cleaning liquid supply path 84c11 and a second cleaning liquid supply path 84c12, and is provided between the first cleaning liquid supply path 84c11 and the second cleaning liquid supply path 84c12. An intermediate part 400 is provided.

  22 is a schematic enlarged plan view in which the vicinity of the closed curve E2 indicated by the alternate long and short dash line in FIG. 21 is enlarged, and FIG. 23 is a sectional view taken along line XXIII-XXIII in FIG.

  In the example shown in FIG. 23, the first cleaning liquid supply path 84c11 includes a portion inclined to the Y axis negative direction side with respect to the Z axis direction, and the second cleaning liquid supply path 84c12 is on the Y axis positive direction side with respect to the Z axis direction. It has a part which inclines to. That is, the first cleaning liquid supply path 84c11 and the second cleaning liquid supply path 84c12 are formed to be substantially bilaterally symmetric. In addition, it is an illustration to the last and it does not limit that it is set as the inclination direction and substantially left-right symmetric shape of the above-mentioned 1st and cleaning liquid supply paths 84c11 and 84c12. Further, the boundary between the discharge port 85 and the groove portion 58 includes the upper edge 84d1 of the inclined portion of the first cleaning liquid supply path 84c11 and the upper edge 84d2 of the inclined portion of the second cleaning liquid supply path 84c12, but is not limited thereto. It is not something.

  The intermediate portion 400 of the cleaning liquid supply unit 80 includes a plurality (for example, two) of cleaning liquid outlets 403b1 and 403b2 having different opening directions. Here, one outlet 403b1 may be referred to as "first outlet 403b1" and the other outlet 403b2 may be referred to as "second outlet 403b2."

  In detail, in the intermediate part 400, the flow path 403 is branched in the middle, and in the branched flow path 403, a first outlet 403b1 is formed at one end on the downstream side, and a second outlet 403b2 is formed at the other end. For example, the opening direction of the first outlet 403b1 is the left direction in FIG. 23, and the opening direction of the second outlet 403b2 is the right direction in FIG. That is, the first and second outlets 403b1 and 403b2 may be formed at positions facing each other.

  In other words, the first and second outlets 403b1 and 403b2 may be opened so as to have a left-right symmetric shape or a substantially left-right symmetric shape in a cross-sectional view along the circumferential direction of the first peripheral wall portion 54a. In such a case, the flow path 403 is formed inside the base 401 in, for example, a T shape in a sectional view. In addition, the shape and number of the flow path 403 and the first and second outlets 403b1 and 403b2 described above are examples and are not limited.

  The intermediate portion 400 is attached to the attachment hole 86, and the second outlet 403b2 is inclined to the second cleaning liquid supply path 84c12 so that the first outlet 403b1 is directed to the inclined portion of the first cleaning liquid supply path 84c11. It is positioned so as to face the part.

  By configuring the intermediate part 400 and the first and second cleaning liquid supply paths 84c11, 84c12 as described above, the cleaning liquid is discharged from the intermediate part 400 in two directions. That is, as indicated by the dashed arrow, the cleaning liquid discharged from the first outlet 403b1 through the flow path 403 flows from the inclined portion of the first cleaning liquid supply path 84c11 toward the upper end edge 84d1, and then the discharge port. From 85, the ink is discharged in the direction along the groove 58 (the left side in FIG. 23).

  On the other hand, the cleaning liquid discharged from the second outlet 403b2 through the flow path 403 flows from the inclined portion of the second cleaning liquid supply path 84c12 toward the upper end edge 84d2 as shown by the one-dot chain arrow, and is discharged. The ink is discharged from the outlet 85 in the direction along the groove 58 (the right direction in FIG. 23).

  Therefore, in the fourth embodiment, as shown in FIG. 21, the discharge port 85 can discharge the cleaning liquid toward the insertion holes 59 adjacent to both sides in plan view. The upper surface 54a1 between the holes 59 can be cleaned quickly and efficiently.

  Although illustration is omitted, in the intermediate portion 400, for example, a cleaning liquid outlet is formed on the upper surface of the base 401, and the cleaning liquid is allowed to flow out of the outlet, thereby cleaning the upper surface of the base 401. Good.

<6. Other examples of cleaning treatment>
Next, another example of the cleaning process will be described. Although the cleaning process has been described above with reference to FIG. 8, the present invention is not limited to this. FIG. 24 is a flowchart illustrating another example of the cleaning process. Note that the processing of FIG. 24 is performed by, for example, the processing unit 16 according to the fourth embodiment, but is not limited thereto.

  As shown in FIG. 24, the controller 18 of the controller 4 supplies the cleaning liquid after the first liquid receiver 55a is lowered and moved to the retracted position by the first elevating drive unit 56b (step S20). Thereby, for example, the vicinity of the discharge port 85 and the intermediate portion 400 can be cleaned.

  Subsequently, the control unit 18 raises the first liquid receiving unit 55a and moves it to the processing position, and then supplies the cleaning liquid while rotating the holding unit 31 counterclockwise by the driving unit 33 (step S21). . As described above, since the swirling flow is generated by rotating the holding unit 31, the cleaning liquid can be spread over a wide range from the discharge port 85 through the groove 58 to be cleaned.

  Next, the control unit 18 lowers the first liquid receiving unit 55a and moves it to the retracted position, and then supplies the cleaning liquid while rotating the holding unit 31 counterclockwise (step S22). Thereby, the lower surface 55a1 of the 1st liquid receiving part 55a and the upper surface 54a1 of the 1st surrounding wall part 54a are washable. Note that the control unit 18 may repeat the processes in steps S20 to S22 described above a predetermined number of times.

  Next, the control unit 18 raises the first liquid receiving unit 55a and moves it to the processing position, and then supplies the cleaning liquid while rotating the holding unit 31 counterclockwise (step S23).

  Next, the control unit 18 supplies the cleaning liquid while rotating the holding unit 31 clockwise with the first liquid receiving unit 55a raised (step S24). Thus, in the present embodiment, after supplying the cleaning liquid in a state where the holding unit 31 is rotated counterclockwise (an example of a predetermined direction), the holding unit 31 rotates clockwise (opposite to the predetermined direction). The cleaning liquid is supplied in a state rotated in one example of the direction of

  Thereby, as shown in FIG. 21, for example, when the holding unit 31 rotates counterclockwise, a large amount of cleaning liquid is supplied in the direction of the arrow of the alternate long and short dash line, and it is possible to intensively clean the supplied portion. . On the other hand, when the holding part 31 rotates clockwise, a large amount of the cleaning liquid is supplied in the direction of the broken arrow, and it is possible to intensively clean the supplied part. That is, the upper surface 54a1 of the first peripheral wall portion 54a can be more efficiently cleaned by switching the rotation direction of the holding portion 31 during the cleaning process.

  24, the controller 18 lowers the first liquid receiver 55a and moves it to the retracted position, and then supplies the cleaning liquid while rotating the holder 31 clockwise (step). S25). Note that the control unit 18 may repeat the processes in steps S24 and S25 described above a predetermined number of times.

  Next, the control unit 18 raises the first liquid receiving unit 55a and moves it to the processing position, and then supplies the cleaning liquid while rotating the holding unit 31 clockwise (step S26).

  Next, the outer peripheral side of the first liquid receiving portion 55a is cleaned. Specifically, the control unit 18 lowers the first liquid receiving unit 55a and moves it to the retracted position, and raises the second liquid receiving unit 55b and moves it to the processing position (see FIG. 3). Thereby, the 1st liquid receiving part 55a and the 2nd liquid receiving part 55b space apart.

  Then, the control unit 18 moves the nozzle 41 of the processing fluid supply unit 40 to the vicinity of the first liquid receiving unit 55a, and then discharges DIW as a cleaning liquid. As a result, the cleaning liquid is supplied to the outer peripheral side of the first liquid receiving unit 55a from the gap between the first liquid receiving unit 55a and the second liquid receiving unit 55b, and thus the outer peripheral side of the first liquid receiving unit 55a. Is cleaned (step S27).

  Note that the cleaning of the inner periphery side of the first liquid receiving portion 55a is performed in the second chemical liquid processing shown in step S4 in FIG. 7, for example, and thus is not performed in the main cleaning processing, but the first liquid receiving portion You may make it carry out before and after washing | cleaning of the outer peripheral side of 55a. When cleaning the inner peripheral side of the first liquid receiving part 55a, for example, the second chemical solution may be supplied to the inner peripheral side of the first liquid receiving part 55a for several seconds to wash away crystals and the like. At this time, since the second chemical liquid that has washed away the first liquid receiving portion 55a may contain crystals, it flows into the drainage line without entering the recovery line, and after that, a predetermined time has passed and the crystals are contained. When it is no longer possible, the recovery line may be switched to the recovery line to start recovery.

  When the lower surface 55a1 of the first liquid receiving part 55a, the upper surface 54a1 of the first peripheral wall part 54a, and the outer peripheral side of the first liquid receiving part 55a are cleaned, the cleaning liquid containing, for example, BHF crystals is discharged into the second drain. It will flow into the liquid groove 501b (see FIG. 3). Since the second drainage groove 501b is a drainage groove for the alkaline processing liquid, the cleaning liquid containing BHF crystals as the acid processing liquid passes through the drainage pipe 91b from the second drainage groove 501b. It is not preferable to flow into the liquid line.

  Therefore, in this embodiment, when the cleaning liquid containing BHF crystals flows into the second drain groove 501b, the illustration is omitted, but the valve 62b is switched, and the flowing cleaning liquid is passed through the cleaning liquid drain line. It is made to flow to a certain second drainage pipe 91a2. Thereby, it is possible to prevent the cleaning liquid containing BHF crystals and the like from flowing downstream of the valve 62b and into the drain line of the alkaline processing liquid.

  If explanation of Drawing 24 is continued, control part 18 will perform dry processing next (Step S28). Specifically, the control unit 18 stops the supply of the cleaning liquid and rotates the holding unit 31 clockwise to generate a swirling flow, thereby drying the first peripheral wall portion 54a and the first liquid receiving portion 55a. When the drying process is completed, a series of cleaning processes is completed.

  In the above-described embodiment, the cleaning liquid is supplied from the discharge port 85 of the cleaning liquid supply pipe 84c to the upper surface 54a1 of the first peripheral wall portion 54a. However, the present invention is not limited to this. That is, for example, a cleaning liquid supply nozzle may be disposed at a position facing the upper surface 54a1, and the cleaning liquid may be supplied from the supply nozzle to the upper surface 54a1.

  In the above description, the cleaning liquid supply unit 80 cleans the upper surface 54a1 of the first peripheral wall 54a. However, the present invention is not limited to this. That is, instead of or in addition to cleaning the upper surface 54a1, the cleaning liquid supply unit 80 may be configured to clean the upper surface 54b1 of the second peripheral wall portion 54b.

  In the processing unit 16, the acid-based processing liquid is recovered and reused through the first drain pipe 91a1, but the present invention is not limited to this, and the acid-based processing liquid is reused. The structure which does not do may be sufficient. In the above description, the first elevating drive unit 56b and the second elevating drive unit 57b are separated from each other. However, the present invention is not limited to this. For example, the first and second elevating drive units 56b and 57b are made common. Also good.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

DESCRIPTION OF SYMBOLS 1 Substrate processing system 4 Control apparatus 16 Processing unit 18 Control part 30 Substrate holding mechanism 31 Holding part 40 Processing fluid supply part 50 Recovery cup 50a 1st cup 50b 2nd cup 50c 3rd cup 53 Bottom part 54a 1st surrounding wall part 55a 1st Liquid receiving portion 56 First elevating mechanism 56a First support member 59 Insertion hole 70 Processing fluid supply source 101 First rotating cup 102 Second rotating cup

Claims (16)

A holding unit for holding the substrate;
A processing liquid supply unit for supplying a processing liquid to the substrate;
A bottom portion, a cylindrical peripheral wall portion erected from the bottom portion, a liquid receiving portion that is provided above the peripheral wall portion and receives a processing liquid scattered from the substrate, and a top surface of the peripheral wall portion along the circumferential direction. A cup having a formed groove portion and surrounding the holding portion;
A substrate processing apparatus comprising: a cleaning liquid supply unit that supplies a cleaning liquid to an upper surface of the peripheral wall. The cup
A support member that supports the liquid receiver and raises and lowers the liquid receiver relative to the peripheral wall portion;
The support member is inserted in the peripheral wall portion, and an insertion hole having an opening on the upper surface of the peripheral wall portion,
The opening is
The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is formed so as to overlap with at least a part of the groove in a plan view. The cleaning liquid supply unit
The substrate processing apparatus according to claim 1, further comprising a cleaning liquid discharge port formed in the groove. The cleaning liquid supply unit
A cleaning liquid supply path connected to the cleaning liquid discharge port;
The cleaning liquid supply path is
The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus is inclined along a circumferential direction of the peripheral wall portion. The cleaning liquid supply unit
A cleaning liquid supply pipe connected to the cleaning liquid supply source
The substrate processing apparatus according to claim 3, wherein a water flow of the cleaning liquid from the cleaning liquid supply pipe is weakened between the cleaning liquid supply pipe and the cleaning liquid discharge port. The cleaning liquid discharge port is
The substrate processing apparatus according to claim 5, wherein an opening area is larger than an area of a flow path of the cleaning liquid supply pipe. The cleaning liquid supply unit
An intermediate portion provided between the cleaning liquid supply pipe and the cleaning liquid discharge port;
The intermediate part is
A base formed in a columnar shape;
A recess formed in a side surface of the base portion along the circumferential direction;
An inlet formed in the base and connected to the cleaning liquid supply pipe;
An outlet that is formed in the recess and allows the cleaning liquid flowing into the inlet to flow out,
The substrate processing apparatus according to claim 5, wherein the intermediate portion weakens the water flow of the cleaning liquid from the cleaning liquid supply pipe. The peripheral wall portion is
The substrate processing apparatus according to claim 1, further comprising an inclined portion formed on the upper surface and having a downward gradient toward the groove portion. The peripheral wall portion is
The substrate processing apparatus according to claim 1, further comprising an inclined portion formed on the upper surface and having a downward gradient toward the side surface. A control unit for controlling the cleaning liquid supply unit and the liquid receiving unit;
The controller is
The substrate processing apparatus according to claim 1, wherein the cleaning liquid is supplied from the cleaning liquid supply unit in a state where the liquid receiving unit is moved to a retracted position below the processing position. The cleaning liquid supply unit
The substrate processing apparatus according to claim 1, wherein the flow rate of the cleaning liquid is changed when the upper surface of the peripheral wall portion is cleaned and when the lower surface of the liquid receiving portion is cleaned. A control unit for controlling the cleaning liquid supply unit and the holding unit;
The controller is
The substrate processing apparatus according to claim 1, wherein a cleaning liquid is supplied from the cleaning liquid supply unit in a state where the holding unit is rotated. The cleaning liquid supply unit
Equipped with multiple cleaning liquid outlets with different opening directions,
The controller is
After supplying the cleaning liquid from the plurality of outlets of the cleaning liquid supply unit in a state where the holding unit is rotated in a predetermined direction, the cleaning liquid is supplied in a state where the holding unit is rotated in a direction opposite to the predetermined direction. The substrate processing apparatus according to claim 12, wherein a cleaning liquid is supplied from the plurality of outlets of a section. A substrate holding step for holding the substrate;
A treatment liquid supply step of supplying a treatment liquid to the substrate;
A bottom portion, a cylindrical peripheral wall portion erected from the bottom portion, a liquid receiving portion that is provided above the peripheral wall portion and receives a processing liquid scattered from the substrate, and a top surface of the peripheral wall portion along the circumferential direction. And a cleaning liquid supply step of supplying a cleaning liquid to the upper surface of the peripheral wall portion in a cup surrounding the holding portion for holding the substrate. The cleaning liquid supply step includes
After supplying the cleaning liquid in a state where the liquid receiving part is moved to a retracted position below the processing position, the cleaning liquid is moved in a state where the liquid receiving part is moved to the processing position and the holding part is rotated in a predetermined direction. The substrate processing method according to claim 14, wherein the substrate processing method is supplied. The cleaning liquid supply step includes
Furthermore, after supplying the cleaning liquid in a state where the holding unit is rotated in a direction opposite to a predetermined direction while keeping the liquid receiving unit at the processing position, the holding unit is rotated in the opposite direction and the holding unit is rotated in the opposite direction. The substrate processing method according to claim 15, wherein the cleaning liquid is supplied in a state where the liquid receiving portion is moved to the retracted position.

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