JP2017095790A5 - - Google Patents

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Publication number
JP2017095790A5
JP2017095790A5 JP2015232446A JP2015232446A JP2017095790A5 JP 2017095790 A5 JP2017095790 A5 JP 2017095790A5 JP 2015232446 A JP2015232446 A JP 2015232446A JP 2015232446 A JP2015232446 A JP 2015232446A JP 2017095790 A5 JP2017095790 A5 JP 2017095790A5
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JP
Japan
Prior art keywords
sputtering target
vol
oxide
metal
50vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015232446A
Other languages
English (en)
Japanese (ja)
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JP2017095790A (ja
JP6504605B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2015232446A external-priority patent/JP6504605B2/ja
Priority to JP2015232446A priority Critical patent/JP6504605B2/ja
Priority to SG11201804080RA priority patent/SG11201804080RA/en
Priority to PCT/JP2016/083777 priority patent/WO2017090481A1/ja
Priority to CN201680069144.XA priority patent/CN108291294B/zh
Priority to US15/779,012 priority patent/US11072851B2/en
Priority to MYPI2018701946A priority patent/MY187547A/en
Priority to TW105138105A priority patent/TWI642798B/zh
Publication of JP2017095790A publication Critical patent/JP2017095790A/ja
Publication of JP2017095790A5 publication Critical patent/JP2017095790A5/ja
Publication of JP6504605B2 publication Critical patent/JP6504605B2/ja
Application granted granted Critical
Priority to US17/319,375 priority patent/US20210269911A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015232446A 2015-11-27 2015-11-27 スパッタリングターゲット Active JP6504605B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2015232446A JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット
SG11201804080RA SG11201804080RA (en) 2015-11-27 2016-11-15 Sputtering target
PCT/JP2016/083777 WO2017090481A1 (ja) 2015-11-27 2016-11-15 スパッタリングターゲット
CN201680069144.XA CN108291294B (zh) 2015-11-27 2016-11-15 溅射靶
US15/779,012 US11072851B2 (en) 2015-11-27 2016-11-15 Sputtering target
MYPI2018701946A MY187547A (en) 2015-11-27 2016-11-15 Sputtering target
TW105138105A TWI642798B (zh) 2015-11-27 2016-11-21 濺鍍靶
US17/319,375 US20210269911A1 (en) 2015-11-27 2021-05-13 Sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015232446A JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット

Publications (3)

Publication Number Publication Date
JP2017095790A JP2017095790A (ja) 2017-06-01
JP2017095790A5 true JP2017095790A5 (cg-RX-API-DMAC7.html) 2018-11-01
JP6504605B2 JP6504605B2 (ja) 2019-04-24

Family

ID=58764151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015232446A Active JP6504605B2 (ja) 2015-11-27 2015-11-27 スパッタリングターゲット

Country Status (7)

Country Link
US (2) US11072851B2 (cg-RX-API-DMAC7.html)
JP (1) JP6504605B2 (cg-RX-API-DMAC7.html)
CN (1) CN108291294B (cg-RX-API-DMAC7.html)
MY (1) MY187547A (cg-RX-API-DMAC7.html)
SG (1) SG11201804080RA (cg-RX-API-DMAC7.html)
TW (1) TWI642798B (cg-RX-API-DMAC7.html)
WO (1) WO2017090481A1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット
TWI679291B (zh) * 2017-09-21 2019-12-11 日商Ｊｘ金屬股份有限公司 濺鍍靶、積層膜之製造方法、積層膜及磁記錄媒體
TWI702294B (zh) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 磁氣記錄媒體用濺鍍靶
US20220383901A1 (en) * 2019-11-01 2022-12-01 Tanaka Kikinzoku Kogyo K.K. Sputtering target for heat-assisted magnetic recording medium

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060289294A1 (en) 2005-06-24 2006-12-28 Heraeus, Inc. Enhanced oxygen non-stoichiometry compensation for thin films
JP5204460B2 (ja) * 2007-10-24 2013-06-05 三井金属鉱業株式会社 磁気記録膜用スパッタリングターゲットおよびその製造方法
WO2010074171A1 (ja) * 2008-12-26 2010-07-01 三井金属鉱業株式会社 スパッタリングターゲットおよび膜の形成方法
JP2012117147A (ja) * 2010-11-12 2012-06-21 Jx Nippon Mining & Metals Corp コバルト酸化物が残留したスパッタリングターゲット
MY169053A (en) * 2012-02-22 2019-02-11 Jx Nippon Mining & Metals Corp Magnetic material sputtering target and manufacturing method for same
CN112695273A (zh) * 2012-09-18 2021-04-23 捷客斯金属株式会社 溅射靶
JP5878242B2 (ja) * 2013-04-30 2016-03-08 Ｊｘ金属株式会社 焼結体、同焼結体からなる磁気記録膜形成用スパッタリングターゲット
JP6073194B2 (ja) * 2013-07-03 2017-02-01 昭和電工株式会社 磁気記録媒体、磁気記憶装置
JP6416497B2 (ja) 2014-05-02 2018-10-31 田中貴金属工業株式会社 スパッタリングターゲットおよびその製造方法
JP6504605B2 (ja) * 2015-11-27 2019-04-24 田中貴金属工業株式会社 スパッタリングターゲット

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