JP2017095694A5 - - Google Patents

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Publication number
JP2017095694A5
JP2017095694A5 JP2016216701A JP2016216701A JP2017095694A5 JP 2017095694 A5 JP2017095694 A5 JP 2017095694A5 JP 2016216701 A JP2016216701 A JP 2016216701A JP 2016216701 A JP2016216701 A JP 2016216701A JP 2017095694 A5 JP2017095694 A5 JP 2017095694A5
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JP
Japan
Prior art keywords
thermoplastic polymer
mixture
metal particles
composite
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016216701A
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English (en)
Japanese (ja)
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JP2017095694A (ja
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Publication date
Priority claimed from US14/948,070 external-priority patent/US10229769B2/en
Application filed filed Critical
Publication of JP2017095694A publication Critical patent/JP2017095694A/ja
Publication of JP2017095694A5 publication Critical patent/JP2017095694A5/ja
Pending legal-status Critical Current

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JP2016216701A 2015-11-20 2016-11-04 高導電性コンポジットのための3相の不混和性ポリマー−金属ブレンド Pending JP2017095694A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/948,070 2015-11-20
US14/948,070 US10229769B2 (en) 2015-11-20 2015-11-20 Three phase immiscible polymer-metal blends for high conductivty composites

Publications (2)

Publication Number Publication Date
JP2017095694A JP2017095694A (ja) 2017-06-01
JP2017095694A5 true JP2017095694A5 (enExample) 2019-12-05

Family

ID=58693918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016216701A Pending JP2017095694A (ja) 2015-11-20 2016-11-04 高導電性コンポジットのための3相の不混和性ポリマー−金属ブレンド

Country Status (4)

Country Link
US (2) US10229769B2 (enExample)
JP (1) JP2017095694A (enExample)
CA (1) CA2947277C (enExample)
DE (1) DE102016221915B4 (enExample)

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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
EP3351594B1 (en) * 2015-09-29 2021-09-01 Kyoraku Co., Ltd. Molded resin strand
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111107975A (zh) * 2017-09-22 2020-05-05 柯尼卡美能达株式会社 树脂组合物、以及使用了该组合物的立体造型物的制造方法、立体造型物以及用于把持对象物的配件、以及使用该配件的工业用机器人
WO2019086927A1 (en) * 2017-10-30 2019-05-09 Khalifa University of Science and Technology A method to fabricate glassy-metal polymer composites
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US10828838B2 (en) * 2018-09-06 2020-11-10 Xerox Corporation 3D printing support structures incorporating sacrificial materials
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
CN110060816B (zh) * 2019-04-23 2021-04-20 西北工业大学深圳研究院 局域原位电聚合3d打印导电聚合物的方法
US11267080B2 (en) 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
EP3812129A1 (en) * 2019-10-25 2021-04-28 Henkel AG & Co. KGaA 3d-printed materials with improved mechanical properties
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US12521937B2 (en) 2021-03-23 2026-01-13 Xerox Corporation Piezoelectric composite filaments and use thereof in additive manufacturing

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US6331586B1 (en) * 1998-02-12 2001-12-18 Cabot Corporation Conductive polymer blends with finely divided conductive material selectively localized in continuous polymer phase or continuous interface
US6284832B1 (en) * 1998-10-23 2001-09-04 Pirelli Cables And Systems, Llc Crosslinked conducting polymer composite materials and method of making same
US6524522B2 (en) * 2001-03-07 2003-02-25 Advanced Ceramics Research, Inc. Method for preparation of metallic foam products and products made
US20060084742A1 (en) * 2004-10-15 2006-04-20 Hatsuo Ishida Composite material and a method for producing the composite material by controlling distribution of a filler therein
CA2766859A1 (en) * 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
CN103289315B (zh) * 2012-02-29 2017-02-15 深圳光启创新技术有限公司 复合材料、基于复合材料的介质基板及其制造方法
JP5720725B2 (ja) * 2013-07-01 2015-05-20 株式会社オートネットワーク技術研究所 プロテクタの製造方法、プロテクタ、およびプロテクタ付きワイヤーハーネス
MX384018B (es) * 2013-08-09 2025-03-14 Kimberly Clark Co Material polimerico para impresion tridimensional.

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