JP2017092384A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- 229910002601 GaN Inorganic materials 0.000 description 11
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- 150000004767 nitrides Chemical class 0.000 description 9
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
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- 229910052785 arsenic Inorganic materials 0.000 description 3
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- 229910052715 tantalum Inorganic materials 0.000 description 2
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- 238000009713 electroplating Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】端部を含む上面に活性領域を備えたウェーハに対して、その下面から前記上面の端部における前記活性領域にかけて連続して延在する金属層を形成する第1工程と、前記ウェーハ上の半導体チップとなる第1領域の一部と、スクライブラインとなる第2領域の少なくとも一部を含む領域に、不活性領域によって区画された活性領域を形成する第2工程と、前記第1及び第2工程の後、プラズマエッチングによって、前記ウェーハ上に設けられた絶縁膜に開口を形成する第3工程と、を有し、前記端部における前記活性領域は、前記第2領域における前記活性領域と電気的に接続されている半導体装置の製造方法。
【選択図】図1
Description
(2)前記金属層は、前記ウェーハの下面に対して原料を照射する、蒸着法またはスパッタリング法を実施することにより、前記ウェーハの下面から前記上面の活性領域に連続して延在して形成されることが好ましい。
(3)前記ウェーハの下面における前記金属層は、前記第3工程におけるプラズマエッチングにおいて、接地電位に接続されることが好ましい。チャージが金属層に流れるため、チャージアップに起因するダメージは抑制される。
(4)前記開口は、ゲート電極を形成するためのゲート窓であることが好ましい。これにより、ゲート電極の設けられる領域のダメージを抑制し、リーク電流を低減することができる。
(5)前記第2領域における活性領域は、前記スクライブラインの幅方向の中央部に位置し、前記第2領域における不活性領域は前記スクライブラインの幅方向の端部に位置し、前記第2領域の活性領域よりも大きな幅で前記スクライブラインにおける前記ウェーハを切断する工程を有することが好ましい。ウェーハを切断することにより、第2領域の活性領域は除去され、半導体チップの端部は不活性領域となる。このため、半導体チップのショートが抑制される。
12、12a、12b、12c 活性領域
14 不活性領域
16 第1領域
18 第2領域
19 端部
20 プラズマエッチング装置
22 チャンバー
24 ステージ
25 高周波電源
26 キャパシタ
28 コイル
30 金属層
32 基板
34 チャネル層
36 電子供給層
38 キャップ層
40、46、52 レジスト
42 オーミック電極
44、50 絶縁膜
44a、44b、46a、46b、50a、50b、51、52a、52b、
53、55 開口部
48 ゲート電極
54 配線層
60 半導体チップ
Claims (5)
- 端部を含む上面に活性領域を備えたウェーハに対して、その下面から前記上面の端部における前記活性領域にかけて連続して延在する金属層を形成する第1工程と、
前記ウェーハ上の半導体チップとなる第1領域の一部と、スクライブラインとなる第2領域の少なくとも一部を含む領域に、不活性領域によって区画された活性領域を形成する第2工程と、
前記第1及び第2工程の後、プラズマエッチングによって、前記ウェーハ上に設けられた絶縁膜に開口を形成する第3工程と、を有し、
前記端部における前記活性領域は、前記第2領域における前記活性領域と電気的に接続されている半導体装置の製造方法。 - 前記金属層は、前記ウェーハの下面に対して原料を照射する、蒸着法またはスパッタリング法を実施することにより、前記ウェーハの下面から前記上面の活性領域に連続して延在して形成される請求項1に記載の半導体装置の製造方法。
- 前記ウェーハの下面における前記金属層は、前記第3工程におけるプラズマエッチングにおいて、接地電位に接続される、請求項1または2に記載の半導体装置の製造方法。
- 前記開口は、ゲート電極を形成するためのゲート窓である請求項1〜3のいずれか一項に記載の半導体装置の製造方法。
- 前記第2領域における活性領域は、前記スクライブラインの幅方向の中央部に位置し、前記第2領域における不活性領域は前記スクライブラインの幅方向の端部に位置し、
前記第2領域の活性領域よりも大きな幅で前記スクライブラインにおける前記ウェーハを切断する工程を有する請求項1〜4のいずれか一項に記載の半導体装置の製造方法。
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