JP2017085089A5 - - Google Patents

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Publication number
JP2017085089A5
JP2017085089A5 JP2016195343A JP2016195343A JP2017085089A5 JP 2017085089 A5 JP2017085089 A5 JP 2017085089A5 JP 2016195343 A JP2016195343 A JP 2016195343A JP 2016195343 A JP2016195343 A JP 2016195343A JP 2017085089 A5 JP2017085089 A5 JP 2017085089A5
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JP
Japan
Prior art keywords
electrostatic chuck
thermal
base plate
layer
processing chamber
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Application number
JP2016195343A
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English (en)
Japanese (ja)
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JP2017085089A (ja
JP6930826B2 (ja
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Priority claimed from US14/875,473 external-priority patent/US9805963B2/en
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Publication of JP2017085089A publication Critical patent/JP2017085089A/ja
Publication of JP2017085089A5 publication Critical patent/JP2017085089A5/ja
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Publication of JP6930826B2 publication Critical patent/JP6930826B2/ja
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JP2016195343A 2015-10-05 2016-10-03 熱閉塞体を備える静電チャック Active JP6930826B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/875,473 2015-10-05
US14/875,473 US9805963B2 (en) 2015-10-05 2015-10-05 Electrostatic chuck with thermal choke

Publications (3)

Publication Number Publication Date
JP2017085089A JP2017085089A (ja) 2017-05-18
JP2017085089A5 true JP2017085089A5 (enExample) 2019-11-14
JP6930826B2 JP6930826B2 (ja) 2021-09-01

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ID=58448019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016195343A Active JP6930826B2 (ja) 2015-10-05 2016-10-03 熱閉塞体を備える静電チャック

Country Status (4)

Country Link
US (1) US9805963B2 (enExample)
JP (1) JP6930826B2 (enExample)
KR (1) KR102648014B1 (enExample)
TW (1) TWI717394B (enExample)

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US11515130B2 (en) * 2018-03-05 2022-11-29 Applied Materials, Inc. Fast response pedestal assembly for selective preclean
CN110911332B (zh) * 2018-09-14 2022-11-25 北京北方华创微电子装备有限公司 静电卡盘
JP7002014B2 (ja) * 2018-10-30 2022-01-20 Toto株式会社 静電チャック
JP7441404B2 (ja) * 2019-03-05 2024-03-01 Toto株式会社 静電チャック、および処理装置
CN111668151B (zh) * 2019-03-05 2024-06-25 Toto株式会社 静电吸盘及处理装置
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CN112768331B (zh) * 2019-11-01 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其下电极组件、静电卡盘
JP7550551B2 (ja) * 2020-06-30 2024-09-13 京セラ株式会社 静電チャック
US20220301914A1 (en) * 2021-03-22 2022-09-22 Tokyo Electron Limited Electrostatic chuck for a plasma processing apparatus
JP7725614B2 (ja) * 2021-05-14 2025-08-19 アプライド マテリアルズ インコーポレイテッド 高速排熱能力を備えた高温サセプタ
US20230069317A1 (en) * 2021-08-25 2023-03-02 Applied Materials, Inc. Thermal choke plate
US11764094B2 (en) * 2022-02-18 2023-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
JP2023162983A (ja) * 2022-04-27 2023-11-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置

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