JP2017080823A - Cylindrical bellows cover - Google Patents

Cylindrical bellows cover Download PDF

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JP2017080823A
JP2017080823A JP2015208729A JP2015208729A JP2017080823A JP 2017080823 A JP2017080823 A JP 2017080823A JP 2015208729 A JP2015208729 A JP 2015208729A JP 2015208729 A JP2015208729 A JP 2015208729A JP 2017080823 A JP2017080823 A JP 2017080823A
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Prior art keywords
ring
cylindrical bellows
polishing
bellows cover
rings
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JP6570964B2 (en
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敏文 松山
Toshifumi Matsuyama
敏文 松山
純 諏訪野
Jun Suwano
純 諏訪野
藤澤　晋一
Shinichi Fujisawa
晋一 藤澤
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2015208729A priority Critical patent/JP6570964B2/en
Priority to TW105131077A priority patent/TWI694897B/en
Priority to KR1020160134916A priority patent/KR102436344B1/en
Priority to CN201610912550.XA priority patent/CN106976017B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber

Abstract

PROBLEM TO BE SOLVED: To prevent breakage of a cylindrical bellows cover due to a telescopic state of a ring.SOLUTION: A cylindrical bellows cover (91), which deforms following movement of processing means, comprises: plural rings (96); a cylindrical bellows cloth (97) which connects the plural rings in parallel; plural projections (98) which project outwards from each crest part of the bellows cloth; and a wire member (101) which passes a hole (99) formed on each projection. The cylindrical bellows cover is so configured that it is prevented that plural reinforcement rings becomes a telescopic state in such a manner that movement of each projection is guided by the wire member.SELECTED DRAWING: Figure 3

Description

本発明は、加工領域をカバーすると共に研磨パッドの移動に追従して変形する筒状蛇腹カバーに関する。   The present invention relates to a cylindrical bellows cover that covers a machining area and deforms following the movement of a polishing pad.

研磨装置は、チャックテーブルにウエーハを保持して、研磨パッドをウエーハに押し付けて研磨加工を実施している。研磨加工では、水平回転した研磨パッドがウエーハに押し付けられた状態で、研磨パッドがウエーハの表面に対して平行に水平移動（左右方向に移動）される。研磨終了後には研磨パッドがウエーハから離間されて原点位置まで移動する。つまり、研磨加工時には研磨パッドがウエーハに上方から押し当てられて水平移動しながら研磨され、研磨終了時には研磨パッドが上昇された後に水平移動によって原点位置に戻される。   The polishing apparatus holds a wafer on a chuck table and presses a polishing pad against the wafer to perform polishing. In the polishing process, the polishing pad is horizontally moved (moved in the left-right direction) in parallel with the surface of the wafer while the horizontally rotated polishing pad is pressed against the wafer. After polishing, the polishing pad is moved away from the wafer and moved to the origin position. That is, at the time of polishing, the polishing pad is pressed against the wafer from above and polished while moving horizontally, and at the end of polishing, the polishing pad is lifted and then returned to the original position by horizontal movement.

また、研磨装置では、研磨加工が所定回数繰り返されたときには研磨パッドの研磨面を整形するためにドレッシングが実施される。このため、チャックテーブルの近くには、研磨パッドの研磨面を整形するドレッシングユニットが設けられている。ドレッシング時にはドレッシングユニットの上方まで研磨パッドが水平移動され、水平回転した研磨パッドが下降されてドレッシングユニットに接触した状態で、研磨パッドがドレッシングユニットに対して水平移動される。このように、研磨パッドは昇降方向及び水平方向に移動されている。   In the polishing apparatus, dressing is performed to shape the polishing surface of the polishing pad when the polishing process is repeated a predetermined number of times. For this reason, a dressing unit for shaping the polishing surface of the polishing pad is provided near the chuck table. During dressing, the polishing pad is horizontally moved to above the dressing unit, and the polishing pad is horizontally moved with respect to the dressing unit in a state where the horizontally rotated polishing pad is lowered and is in contact with the dressing unit. Thus, the polishing pad is moved in the up and down direction and the horizontal direction.

この種の研磨装置には、研磨パッドの昇降移動及び水平移動に追従して変形する筒状蛇腹カバーが設けられている（例えば、特許文献１参照）。筒状蛇腹カバーは、複数のリングを筒状の蛇腹布によって平行に連結し、駆動機構によって研磨パッドが動作する動作領域をカバーしている。筒状蛇腹カバーは、複数のリングが接近して蛇腹布が畳まれることで研磨パッドの下降移動に追従し、複数のリングが離間して蛇腹布が広げられることで研磨パッドの上昇移動に追従する。また、複数のリングが横移動して蛇腹布が斜めになることで、研磨パッドの水平移動に追従する。   This type of polishing apparatus is provided with a cylindrical bellows cover that deforms following the up-and-down movement and horizontal movement of the polishing pad (see, for example, Patent Document 1). The cylindrical bellows cover connects a plurality of rings in parallel by a cylindrical bellows cloth, and covers an operation region in which the polishing pad operates by a driving mechanism. The cylindrical bellows cover follows the lowering movement of the polishing pad as the plurality of rings approach and the bellows cloth is folded, and the polishing pad moves up as the plurality of rings are separated and the bellows cloth is spread. Follow. Further, the plurality of rings move laterally and the bellows cloth becomes slanted to follow the horizontal movement of the polishing pad.

特許第４４６４１１３号公報Japanese Patent No. 4464113

ところで、特許文献１に記載の筒状蛇腹カバーでは、研磨パッドの下降移動時に上下方向に並んだ複数のリングが入れ子状態になる場合がある。すなわち、複数のリングは上から下に向かってリング径が大きくなるように形成されており、研磨パッドの下降移動時に上側のリングが下側のリングの内側に入り込むことがある。この入れ子状態のままで、研磨パッドの上昇移動や水平移動に筒状蛇腹カバーが追従されると、複数のリングが擦れあったり、引っ掛ったりして筒状蛇腹カバーが破損し易くなるという問題があった。   Incidentally, in the cylindrical bellows cover described in Patent Document 1, a plurality of rings arranged in the vertical direction may be nested when the polishing pad is moved downward. That is, the plurality of rings are formed so that the ring diameter increases from top to bottom, and the upper ring may enter the inside of the lower ring when the polishing pad moves downward. If the cylindrical bellows cover follows the rising or horizontal movement of the polishing pad in this nested state, there is a problem that the cylindrical bellows cover is likely to be damaged by rubbing or catching multiple rings. was there.

本発明はかかる点に鑑みてなされたものであり、リングの入れ子状態に起因した破損を防止することができる筒状蛇腹カバーを提供することを目的とする。   This invention is made | formed in view of this point, and it aims at providing the cylindrical bellows cover which can prevent the damage resulting from the nesting state of a ring.

本発明の筒状蛇腹カバーは、上下左右方向に動作する駆動機構の動作領域をカバーする筒状蛇腹カバーであって、円リング状の上リングと、長円リング状の下リングと、上下に配置される該上リングと該下リングとを連結しかつ上下に段階的に該上リングの円形部分から該下リングの長円形部分に至る複数の山部を有する山谷形状で形成された筒状の蛇腹布と、該上リングと該下リングと平行で該蛇腹布の該複数の山部の内部に配設される該蛇腹布を補強する補強リングと、を備え、該蛇腹布の複数の該山部には、各山部の外側に突出し孔を有する突出部と、複数の該突出部の該孔が摺動可能に複数の該孔内に挿入され複数の該山部の該補強リングの上下順序を維持するワイヤー部材と、を備えた補強リング上下順序維持部を備え、各複数の山部の該補強リングの上下順序を維持しつつ上下左右方向に動作する該駆動機構の動作領域をカバーする。   The cylindrical bellows cover of the present invention is a cylindrical bellows cover that covers the operating area of a drive mechanism that operates in the vertical and horizontal directions, and includes a circular ring-shaped upper ring, an oval ring-shaped lower ring, A cylindrical shape that connects the upper ring and the lower ring to be arranged, and has a plurality of peak portions that gradually go up and down from the circular portion of the upper ring to the oval portion of the lower ring. And a reinforcing ring for reinforcing the bellows cloth disposed inside the plurality of peak portions of the bellows cloth in parallel with the upper ring and the lower ring, and a plurality of bellows cloths The peak portion includes a protruding portion protruding outward from each peak portion, and a plurality of the protruding portions of the plurality of protruding portions slidably inserted into the plurality of holes, and the reinforcing rings of the plurality of peak portions. A wire member that maintains the vertical order of the Covering the operation area of the drive mechanism which operates in the vertical and horizontal directions while keeping the overlaying order of the reinforcing ring parts.

この構成によれば、複数の補強リングが配設された蛇腹布の各山部に突出部が設けられており、各突出部の孔にワイヤー部材が通されている。駆動機構の下方向の動作時には、ワイヤー部材によって各突出部を介して複数の補強リングの移動がガイドされる。また、各突出部にワイヤー部材が通されているため、複数の補強リングが上下順序を維持した状態でワイヤー部材に沿って移動される。よって、複数の補強リングが入れ子状態になることがなく、複数の補強リングが離間された状態で駆動機構が動作するため、筒状蛇腹カバーの破損を防止することができる。   According to this structure, the protrusion part is provided in each peak part of the bellows cloth by which the some reinforcement ring was arrange | positioned, and the wire member is let to pass through the hole of each protrusion part. During the downward operation of the drive mechanism, the movement of the plurality of reinforcing rings is guided by the wire members through the protrusions. Moreover, since the wire member is passed through each protrusion, the plurality of reinforcing rings are moved along the wire member in a state where the vertical order is maintained. Therefore, the plurality of reinforcing rings are not nested, and the drive mechanism operates in a state where the plurality of reinforcing rings are separated from each other, so that the cylindrical bellows cover can be prevented from being damaged.

本発明によれば、複数の補強リングの上下順序が維持された状態で、複数の補強リングがワイヤー部材に沿って移動するため、複数の補強リングが入れ子状態になることがなく、筒状蛇腹カバーの破損を防止することができる。   According to the present invention, since the plurality of reinforcing rings move along the wire member in a state where the vertical order of the plurality of reinforcing rings is maintained, the plurality of reinforcing rings are not nested, and the cylindrical bellows Damage to the cover can be prevented.

本実施の形態の研削研磨装置の斜視図である。It is a perspective view of the grinding-polishing apparatus of this Embodiment. 一般的な筒状蛇腹カバーの変形状態を示す図である。It is a figure which shows the deformation | transformation state of a general cylindrical bellows cover. 本実施の形態の筒状蛇腹カバーの模式図である。It is a schematic diagram of the cylindrical bellows cover of this Embodiment. 本実施の形態の筒状蛇腹カバーの変形動作の説明図である。It is explanatory drawing of the deformation | transformation operation | movement of the cylindrical bellows cover of this Embodiment. 本実施の形態の研磨手段による研磨動作の説明図である。It is explanatory drawing of the grinding | polishing operation | movement by the grinding | polishing means of this Embodiment.

以下、添付図面を参照して、本実施の形態の筒状蛇腹カバーを備えた研削研磨装置について説明する。図１は、本実施の形態の研削研磨装置の斜視図である。なお、筒状蛇腹カバーは、上下左右に動かされる加工手段を備えた加工装置に適用可能であり、図１に示す研削研磨装置に限定されない。なお、図１においては、説明の便宜上、筒状蛇腹カバーのワイヤー部材等については記載を省略している。   Hereinafter, a grinding and polishing apparatus provided with a cylindrical bellows cover according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of the grinding and polishing apparatus of the present embodiment. The cylindrical bellows cover can be applied to a processing apparatus provided with a processing means that is moved up and down, left and right, and is not limited to the grinding and polishing apparatus shown in FIG. In addition, in FIG. 1, description is abbreviate | omitted about the wire member of a cylindrical bellows cover, etc. for convenience of explanation.

図１に示すように、研削研磨装置１は、フルオートタイプの加工装置であり、ウエーハＷに対して搬入処理、粗研削加工、仕上げ研削加工、研磨加工、洗浄処理、搬出処理からなる一連の作業を全自動で実施するように構成されている。ウエーハＷは、略円板状に形成されており、カセットＣに収容された状態で研削研磨装置１に搬入される。なお、ウエーハＷは、研削対象及び研磨対象になる板状のワークであればよく、シリコン、ガリウムヒ素等の半導体基板でもよいし、セラミック、ガラス、サファイア等の無機材料基板でもよいし、さらに半導体製品のパッケージ基板等でもよい。   As shown in FIG. 1, the grinding and polishing apparatus 1 is a full-auto type processing apparatus, and includes a series of processing including carry-in processing, rough grinding processing, finish grinding processing, polishing processing, cleaning processing, and carry-out processing with respect to the wafer W. The work is configured to be performed fully automatically. The wafer W is formed in a substantially disc shape and is carried into the grinding and polishing apparatus 1 while being accommodated in the cassette C. The wafer W may be a plate-like workpiece to be ground and polished, and may be a semiconductor substrate such as silicon or gallium arsenide, an inorganic material substrate such as ceramic, glass or sapphire, or a semiconductor. It may be a package substrate of a product.

研削研磨装置１の基台１１の前側には、複数のウエーハＷが収容された一対のカセットＣが載置されている。一対のカセットＣの後方には、カセットＣに対してウエーハＷを出し入れするカセットロボット１６が設けられている。カセットロボット１６の両斜め後方には、加工前のウエーハＷを位置決めする位置決め機構２１と、加工済みのウエーハＷを洗浄する洗浄機構２６とが設けられている。位置決め機構２１と洗浄機構２６の間には、加工前のウエーハＷをチャックテーブル４２に搬入する搬入手段３１と、チャックテーブル４２から加工済みのウエーハＷを搬出する搬出手段３６とが設けられている。   A pair of cassettes C in which a plurality of wafers W are accommodated are placed on the front side of the base 11 of the grinding and polishing apparatus 1. Behind the pair of cassettes C, a cassette robot 16 for taking wafers W in and out of the cassettes C is provided. A positioning mechanism 21 that positions the unprocessed wafer W and a cleaning mechanism 26 that cleans the processed wafer W are provided on both diagonally rear sides of the cassette robot 16. Between the positioning mechanism 21 and the cleaning mechanism 26, a loading means 31 for loading the unprocessed wafer W into the chuck table 42 and a loading means 36 for unloading the processed wafer W from the chuck table 42 are provided. .

カセットロボット１６は、多節リンクからなるロボットアーム１７の先端にハンド部１８を設けて構成されている。カセットロボット１６では、カセットＣから位置決め機構２１に加工前のウエーハＷが搬送される他、洗浄機構２６からカセットＣに加工済みのウエーハＷが搬送される。位置決め機構２１は、仮置きテーブル２２の周囲に、仮置きテーブル２２の中心に対して進退可能な複数の位置決めピン２３を配置して構成される。位置決め機構２１では、仮置きテーブル２２上に載置されたウエーハＷの外周縁に複数の位置決めピン２３が突き当てられることで、ウエーハＷの中心が仮置きテーブル２２の中心に位置決めされる。   The cassette robot 16 is configured by providing a hand portion 18 at the tip of a robot arm 17 composed of a multi-node link. In the cassette robot 16, the unprocessed wafer W is transferred from the cassette C to the positioning mechanism 21, and the processed wafer W is transferred from the cleaning mechanism 26 to the cassette C. The positioning mechanism 21 is configured by arranging a plurality of positioning pins 23 that can move forward and backward with respect to the center of the temporary table 22 around the temporary table 22. In the positioning mechanism 21, the center of the wafer W is positioned at the center of the temporary placement table 22 by a plurality of positioning pins 23 being abutted against the outer peripheral edge of the wafer W placed on the temporary placement table 22.

搬入手段３１は、基台１１上で旋回可能な搬入アーム３２の先端に搬入パッド３３を設けて構成される。搬入手段３１では、搬入パッド３３によって仮置きテーブル２２からウエーハＷが持ち上げられ、搬入アーム３２によって搬入パッド３３が旋回されることでチャックテーブル４２にウエーハＷが搬入される。搬出手段３６は、基台１１上で旋回可能な搬出アーム３７の先端に搬出パッド３８を設けて構成される。搬出手段３６では、搬出パッド３８によってチャックテーブル４２からウエーハＷが持ち上げられ、搬出アーム３７によって搬出パッド３８が旋回されることでチャックテーブル４２からウエーハＷが搬出される。   The carry-in means 31 is configured by providing a carry-in pad 33 at the tip of a carry-in arm 32 that can turn on the base 11. In the carry-in means 31, the wafer W is lifted from the temporary placement table 22 by the carry-in pad 33, and the carry-in pad 33 is turned by the carry-in arm 32, so that the wafer W is carried into the chuck table 42. The carry-out means 36 is configured by providing a carry-out pad 38 at the tip of a carry-out arm 37 that can turn on the base 11. In the unloading means 36, the wafer W is lifted from the chuck table 42 by the unloading pad 38, and the unloading pad 38 is turned by the unloading arm 37, whereby the wafer W is unloaded from the chuck table 42.

洗浄機構２６は、スピンナーテーブル２７に向けて洗浄水及び乾燥エアーを噴射する各種ノズル（不図示）を設けて構成される。洗浄機構２６では、ウエーハＷを保持したスピンナーテーブル２７が基台１１内に降下され、基台１１内で洗浄水が噴射されてウエーハＷがスピンナー洗浄された後、乾燥エアーが吹き付けられてウエーハＷが乾燥される。搬入手段３１及び搬出手段３６の後方には、４つのチャックテーブル４２が周方向に均等間隔で、回転可能に配置されたターンテーブル４１が設けられている。各チャックテーブル４２の上面には、ウエーハＷを保持する保持面４３が形成されている。   The cleaning mechanism 26 is configured by providing various nozzles (not shown) that spray cleaning water and dry air toward the spinner table 27. In the cleaning mechanism 26, the spinner table 27 holding the wafer W is lowered into the base 11, and cleaning water is sprayed in the base 11 to clean the wafer W, and then dry air is blown to blow the wafer W. Is dried. Behind the carry-in means 31 and the carry-out means 36 is provided a turntable 41 in which four chuck tables 42 are rotatably arranged at equal intervals in the circumferential direction. A holding surface 43 for holding the wafer W is formed on the upper surface of each chuck table 42.

ターンテーブル４１が９０度間隔で間欠回転することで、ウエーハＷが搬入及び搬出される搬入出位置、粗研削手段４６に対峙する粗研削位置、仕上げ研削手段５１に対峙する仕上げ研削位置、研磨手段５６に対峙する研磨位置に順に位置付けられる。粗研削位置では、粗研削手段４６によってウエーハＷが所定の厚みまで粗研削される。仕上げ研削位置では、仕上げ研削手段５１によってウエーハＷが仕上げ厚みまで仕上げ研削される。研磨位置では、研磨手段５６によってウエーハＷが研磨される。ターンテーブル４１の周囲には、コラム１２、１３、１４が立設されている。   When the turntable 41 rotates intermittently at intervals of 90 degrees, a loading / unloading position where the wafer W is loaded and unloaded, a rough grinding position facing the rough grinding means 46, a finish grinding position facing the finish grinding means 51, and a polishing means The polishing position facing 56 is sequentially positioned. At the rough grinding position, the wafer W is roughly ground to a predetermined thickness by the rough grinding means 46. At the finish grinding position, the finish grinding means 51 finish-grinds the wafer W to the finish thickness. At the polishing position, the wafer W is polished by the polishing means 56. Around the turntable 41, columns 12, 13, and 14 are erected.

コラム１２には、粗研削手段４６を上下動させる駆動機構６１が設けられている。駆動機構６１は、コラム１２の前面に配置されたＺ軸方向に平行な一対のガイドレール６２と、一対のガイドレール６２にスライド可能に設置されたモータ駆動のＺ軸スライダ６３とを有している。Ｚ軸スライダ６３の前面には、ハウジング６４を介して粗研削手段４６が支持されている。Ｚ軸スライダ６３の背面側にはボールネジ６５が螺合されており、ボールネジ６５の一端には駆動モータ６６が連結されている。駆動モータ６６によってボールネジ６５が回転駆動され、粗研削手段４６がガイドレール６２に沿ってＺ軸方向に移動される。   The column 12 is provided with a drive mechanism 61 that moves the rough grinding means 46 up and down. The drive mechanism 61 includes a pair of guide rails 62 arranged in front of the column 12 and parallel to the Z-axis direction, and a motor-driven Z-axis slider 63 slidably installed on the pair of guide rails 62. Yes. A rough grinding means 46 is supported on the front surface of the Z-axis slider 63 via a housing 64. A ball screw 65 is screwed onto the back side of the Z-axis slider 63, and a drive motor 66 is connected to one end of the ball screw 65. The ball screw 65 is rotationally driven by the drive motor 66, and the rough grinding means 46 is moved along the guide rail 62 in the Z-axis direction.

同様に、コラム１３には、仕上げ研削手段５１を上下動させる駆動機構７１が設けられている。駆動機構７１は、コラム１３の前面に配置されたＺ軸方向に平行な一対のガイドレール７２と、一対のガイドレール７２にスライド可能に設置されたモータ駆動のＺ軸スライダ７３とを有している。Ｚ軸スライダ７３の前面には、ハウジング７４を介して仕上げ研削手段５１が支持されている。Ｚ軸スライダ７３の背面側にはボールネジ７５が螺合されており、ボールネジ７５の一端には駆動モータ７６が連結されている。駆動モータ７６によってボールネジ７５が回転駆動され、仕上げ研削手段５１がガイドレール７２に沿ってＺ軸方向に移動される。   Similarly, the column 13 is provided with a drive mechanism 71 for moving the finish grinding means 51 up and down. The drive mechanism 71 includes a pair of guide rails 72 arranged in front of the column 13 and parallel to the Z-axis direction, and a motor-driven Z-axis slider 73 slidably installed on the pair of guide rails 72. Yes. A finish grinding means 51 is supported on the front surface of the Z-axis slider 73 via a housing 74. A ball screw 75 is screwed to the back side of the Z-axis slider 73, and a drive motor 76 is connected to one end of the ball screw 75. The ball screw 75 is rotationally driven by the drive motor 76, and the finish grinding means 51 is moved along the guide rail 72 in the Z-axis direction.

粗研削手段４６のスピンドル４７の下端にはマウント４８が設けられ、マウント４８の下面に複数の粗研削砥石５０が環状に配設された粗研削用の研削ホイール４９が装着される。粗研削砥石５０は、例えば、ダイヤモンド砥粒をメタルボンドやレジンボンド等の結合剤で固めたダイヤモンド砥石で構成される。また、仕上げ研削手段５１のスピンドル５２の下端にはマウント５３が設けられ、マウント５３の下面に複数の仕上げ研削砥石５５が環状に配設された仕上げ研削用の研削ホイール５４が装着される。仕上げ研削砥石５５は、粗研削砥石５０よりも粒径が細かい砥粒で構成される。   A mount 48 is provided at the lower end of the spindle 47 of the rough grinding means 46, and a rough grinding wheel 49 in which a plurality of rough grinding wheels 50 are annularly arranged is mounted on the lower surface of the mount 48. The rough grinding wheel 50 is composed of, for example, a diamond grinding stone in which diamond abrasive grains are hardened with a binder such as a metal bond or a resin bond. Further, a mount 53 is provided at the lower end of the spindle 52 of the finish grinding means 51, and a finish grinding grinding wheel 54 in which a plurality of finish grinding wheels 55 are annularly arranged is mounted on the lower surface of the mount 53. The finish grinding wheel 55 is composed of abrasive grains having a smaller particle diameter than the coarse grinding wheel 50.

コラム１４には、研磨手段５６をウエーハＷに対して所定の研磨位置に位置付ける駆動機構８１が設けられている。駆動機構８１は、コラム１４の前面に配置されたＹ軸方向に平行な一対のガイドレール８２と、一対のガイドレール８２にスライド可能に設置されたモータ駆動のＹ軸スライダ８３とを有している。また、駆動機構８１は、Ｙ軸スライダ８３の前面に配置されたＺ軸方向に平行な一対のガイドレール８４と、一対のガイドレール８４にスライド可能に設置されたモータ駆動のＺ軸スライダ８５とを有している。Ｚ軸スライダ８５の前面には、ハウジング８６を介して研磨手段５６が支持されている。   The column 14 is provided with a drive mechanism 81 that positions the polishing means 56 at a predetermined polishing position with respect to the wafer W. The drive mechanism 81 includes a pair of guide rails 82 arranged in front of the column 14 and parallel to the Y-axis direction, and a motor-driven Y-axis slider 83 slidably installed on the pair of guide rails 82. Yes. The drive mechanism 81 includes a pair of guide rails 84 arranged in front of the Y-axis slider 83 and parallel to the Z-axis direction, and a motor-driven Z-axis slider 85 slidably installed on the pair of guide rails 84. have. A polishing means 56 is supported on the front surface of the Z-axis slider 85 via a housing 86.

Ｙ軸スライダ８３、Ｚ軸スライダ８５の背面側にはボールネジ（不図示）が螺合されており、ボールネジの一端には駆動モータ８７、８８が連結されている。駆動モータ８７、８８によってボールネジが回転駆動され、研磨手段５６がガイドレール８２、８４に沿ってＹ軸方向及びＺ軸方向に移動される。スピンドルハウジングには、スピンドル９３の上下左右方向の動作に追従する筒状蛇腹カバー９１が設けられている。筒状蛇腹カバー９１の下端は、研磨位置のチャックテーブル４２を覆うケース９２に接続されている。筒状蛇腹カバー９１及びケース９２によって研磨加工の加工領域がカバーされている。   A ball screw (not shown) is screwed to the back side of the Y-axis slider 83 and the Z-axis slider 85, and drive motors 87 and 88 are connected to one end of the ball screw. The ball screw is rotationally driven by the drive motors 87 and 88, and the polishing means 56 is moved along the guide rails 82 and 84 in the Y-axis direction and the Z-axis direction. The spindle housing is provided with a cylindrical bellows cover 91 that follows the vertical and horizontal movements of the spindle 93. The lower end of the cylindrical bellows cover 91 is connected to a case 92 that covers the chuck table 42 at the polishing position. A processing region for polishing is covered by the cylindrical bellows cover 91 and the case 92.

ケース９２は、直方体の箱状に形成されており、ケース９２の側面はターンテーブル４１の回転時にチャックテーブル４２が干渉しないように部分的に切り欠かれている。ケース９２の天面は、Ｙ軸方向を長軸とした長穴状に開口されている。ケース９２の長穴状の開口によって研磨手段５６のＹ軸方向の動作が許容される。筒状蛇腹カバー９１及びケース９２の内側では、スピンドル９３の下端にマウント９４（図５参照）が設けられ、マウント９４の下面に発泡材や繊維質等で形成された研磨パッド９５（図５参照）が装着されている。研磨パッド９５によるウエーハＷの研磨により、ウエーハＷに残された研削ダメージが除去される。   The case 92 is formed in a rectangular parallelepiped box shape, and the side surface of the case 92 is partially cut away so that the chuck table 42 does not interfere when the turntable 41 rotates. The top surface of the case 92 is opened in a long hole shape with the Y axis direction as the long axis. The movement of the polishing means 56 in the Y-axis direction is allowed by the elongated hole-like opening of the case 92. Inside the cylindrical bellows cover 91 and the case 92, a mount 94 (see FIG. 5) is provided at the lower end of the spindle 93, and a polishing pad 95 (see FIG. 5) formed of a foam material, fiber, or the like on the lower surface of the mount 94. ) Is installed. The grinding damage left on the wafer W is removed by polishing the wafer W with the polishing pad 95.

このような研削研磨装置１では、カセットＣ内からウエーハＷが位置決め機構２１に搬送されて、位置決め機構２１でウエーハＷがセンタリングされる。次に、チャックテーブル４２上にウエーハＷが搬入され、ターンテーブル４１の回転によってウエーハＷが粗研削位置、仕上げ研削位置、研磨位置の順に位置付けられる。粗研削位置ではウエーハＷが粗研削加工され、仕上げ研削位置ではウエーハＷが仕上げ研削加工され、研磨位置ではウエーハＷが研磨加工される。そして、洗浄機構２６でウエーハＷが洗浄され、洗浄機構２６からカセットＣへウエーハＷが搬出される。   In such a grinding and polishing apparatus 1, the wafer W is conveyed from the cassette C to the positioning mechanism 21, and the wafer W is centered by the positioning mechanism 21. Next, the wafer W is loaded onto the chuck table 42, and the wafer W is positioned in the order of the rough grinding position, the finish grinding position, and the polishing position by the rotation of the turntable 41. The wafer W is roughly ground at the rough grinding position, the wafer W is finish ground at the finish grinding position, and the wafer W is ground at the polishing position. Then, the wafer W is cleaned by the cleaning mechanism 26, and the wafer W is carried out from the cleaning mechanism 26 to the cassette C.

ところで、筒状蛇腹カバー９１は、加工手段としての研磨手段５６の上下左右方向（Ｚ軸方向及びＹ軸方向）の動作に追従して変形可能に形成されている。研磨手段５６の下方向の移動時には、筒状蛇腹カバー９１が蛇腹を畳むように変形し、研磨手段５６の上方向の移動時には筒状蛇腹カバー９１が蛇腹を伸ばすように変形する。また、研磨手段５６の左右方向の移動時には筒状蛇腹カバー９１が蛇腹を横にずらすように変形する。研磨手段５６が下方向に移動して蛇腹が畳まれた状態で、研磨手段５６が左右方向に動かされたときには筒状蛇腹カバー９１が破損する場合がある。   By the way, the cylindrical bellows cover 91 is formed so as to be deformable following the operation in the vertical and horizontal directions (Z-axis direction and Y-axis direction) of the polishing means 56 as the processing means. When the polishing means 56 moves downward, the cylindrical bellows cover 91 is deformed so as to fold the bellows, and when the polishing means 56 moves upward, the cylindrical bellows cover 91 is deformed so as to extend the bellows. Further, when the polishing means 56 moves in the left-right direction, the cylindrical bellows cover 91 is deformed so as to shift the bellows sideways. When the polishing means 56 moves downward and the bellows is folded, the cylindrical bellows cover 91 may be damaged when the polishing means 56 is moved in the left-right direction.

例えば、図２Ａに示すように、一般的な筒状蛇腹カバー１１０は、複数のリング１１１が筒状の蛇腹布１１２で平行に連結されている。上下方向に並んだ複数のリング１１１は、上側から下側に向かってリング径が大きくなるように形成されている。このため、図２Ｂに示すように、研磨手段５６（図１参照）の下方向の動作時に一部（上から２段目）のリング１１１が大きく下方に移動して下側（上から３段目）のリング１１１の内側に入り込んで、入れ子状態になる場合がある。リング１１１が入れ子状態になったまま、研磨手段５６が上方向や左右方向に動かされると、リング１１１同士が引っ掛ったり、擦れ合ったりして筒状蛇腹カバー１１０が破損し易くなる。   For example, as shown in FIG. 2A, a general cylindrical bellows cover 110 has a plurality of rings 111 connected in parallel by a cylindrical bellows cloth 112. The plurality of rings 111 arranged in the vertical direction are formed so that the ring diameter increases from the upper side to the lower side. For this reason, as shown in FIG. 2B, during the downward operation of the polishing means 56 (see FIG. 1), a part (second stage from the top) of the ring 111 moves greatly downward and the lower side (three stages from the top). There is a case where it enters the inside of the ring 111 of the eye) and becomes nested. If the polishing means 56 is moved in the upward direction or the left-right direction while the ring 111 is in the nested state, the cylindrical bellows cover 110 is easily damaged due to the rings 111 being caught or rubbed with each other.

そこで、本実施の形態では、リングが入れ子状態のままで筒状蛇腹カバー９１が研磨手段５６に追従したときに、筒状蛇腹カバー９１が破損する点に着目して、上下に並んだ複数のリングの上下順序（上下間隔）を維持するようにしている。これにより、筒状蛇腹カバー９１が収縮しても、上下のリングが入れ子状態になることがないため、リング同士が引っ掛ったり、擦れ合ったりすることがなく筒状蛇腹カバー９１が破損することがない。   Therefore, in the present embodiment, paying attention to the fact that the cylindrical bellows cover 91 is damaged when the cylindrical bellows cover 91 follows the polishing means 56 while the ring is in a nested state, a plurality of the bellows cover 91 arranged vertically The upper and lower order of the rings (up and down intervals) is maintained. Thereby, even if the cylindrical bellows cover 91 contracts, the upper and lower rings are not nested, and the cylindrical bellows cover 91 is damaged without the rings being caught or rubbed with each other. There is no.

以下、図３を参照して、本実施の形態の筒状蛇腹カバーについて詳細に説明する。図３は、本実施の形態の筒状蛇腹カバーの模式図である。なお、図３Ａは筒状蛇腹カバーの上面模式図であり、図３Ｂは筒状蛇腹カバーの側面模式図である。   Hereinafter, the cylindrical bellows cover of the present embodiment will be described in detail with reference to FIG. FIG. 3 is a schematic diagram of the cylindrical bellows cover of the present embodiment. 3A is a schematic top view of the cylindrical bellows cover, and FIG. 3B is a schematic side view of the cylindrical bellows cover.

図３Ａ及び図３Ｂに示すように、筒状蛇腹カバー９１は、上下左右方向に動作する駆動機構８１（図１参照）の動作領域をカバーし、研磨手段５６（図１参照）の動作に追従して変形するように構成されている。なお、駆動機構８１の動作領域とは、研磨手段５６を上下左右に動作する領域である。筒状蛇腹カバー９１は、円リング状の上リング９６ａと長円リング状の下リング９６ｂとを筒状の蛇腹布９７で連結している。蛇腹布９７は、上リング９６ａの円形部分から下リング９６ｂの長円形部分に至る範囲で、上下に段階的な複数の山部９７ａを有する山谷形状で形成されている。   As shown in FIGS. 3A and 3B, the cylindrical bellows cover 91 covers the operation region of the drive mechanism 81 (see FIG. 1) that operates in the vertical and horizontal directions and follows the operation of the polishing means 56 (see FIG. 1). And are configured to be deformed. Note that the operation area of the drive mechanism 81 is an area in which the polishing means 56 is moved vertically and horizontally. The cylindrical bellows cover 91 connects a circular ring-shaped upper ring 96 a and an oval ring-shaped lower ring 96 b with a cylindrical bellows cloth 97. The bellows cloth 97 is formed in a mountain-valley shape having a plurality of stepped peak portions 97a up and down in a range from the circular portion of the upper ring 96a to the oval portion of the lower ring 96b.

蛇腹布９７の複数の山部９７ａの内部には、上リング９６ａと下リング９６ｂに平行な複数の補強リング９６ｃが配設されている。蛇腹布９７は各山部９７ａに補強リング９６ｃが配設されることで補強されると共に、補強リング９６ｃによって上リング９６ａと下リング９６ｂの間に蛇腹形状（山谷形状）が作られている。このように蛇腹布９７には、複数のリング９６によって山部９７ａが作られ、上下に隣り合うリング９６間の弛みによって谷部９７ｂが作られている。これら複数のリング９６は、上側から下側に向かってリング径が大きくなるように並んでおり、互いに平行になるように蛇腹布９７に配設されている。   A plurality of reinforcing rings 96 c parallel to the upper ring 96 a and the lower ring 96 b are disposed inside the plurality of peak portions 97 a of the bellows cloth 97. The bellows cloth 97 is reinforced by providing a reinforcing ring 96c at each peak portion 97a, and a bellows shape (mountain valley shape) is formed between the upper ring 96a and the lower ring 96b by the reinforcing ring 96c. As described above, the bellows cloth 97 is formed with a mountain portion 97 a by a plurality of rings 96, and a valley portion 97 b is formed by slack between the rings 96 adjacent to each other in the vertical direction. The plurality of rings 96 are arranged so that the ring diameter increases from the upper side to the lower side, and are arranged on the bellows cloth 97 so as to be parallel to each other.

上リング９６ａは、円形リング状の金属板であり、スピンドル９３（図１参照）のハウジングに固定されている。下リング９６ｂは、長円リング状の金属板であり、長軸を左右方向（Ｙ軸方向）に向けた状態で、長穴を有するケース９２（図１参照）の天面に固定されている。複数の補強リング９６ｃは、長円リング状の金属ワイヤーであり、長軸を左右方向に向けた状態で蛇腹布９７に配設されている。なお、複数のリング９６は、金属以外の材質で形成されてもよく、例えば、可撓性樹脂等で形成されてもよい。また、各リング９６は、板状に形成されてもよいし、ワイヤー状に形成されてもよい。   The upper ring 96a is a circular ring-shaped metal plate, and is fixed to the housing of the spindle 93 (see FIG. 1). The lower ring 96b is an oval ring-shaped metal plate, and is fixed to the top surface of a case 92 (see FIG. 1) having a long hole with the long axis oriented in the left-right direction (Y-axis direction). . The plurality of reinforcing rings 96c are oval ring-shaped metal wires, and are arranged on the bellows cloth 97 with the long axis directed in the left-right direction. The plurality of rings 96 may be formed of a material other than metal, for example, may be formed of a flexible resin or the like. Each ring 96 may be formed in a plate shape or a wire shape.

蛇腹布９７は、樹脂系シートで略円錐台筒状に形成されており、小径の上端に上リング９６ａが固定され、大径の下端に下リング９６ｂが固定されている。蛇腹布９７の上端と下端の間には複数の補強リング９６ｃが等間隔に配設されており、補強リング９６ｃ及び上リング９６ａで形成された各山部９７ａには山部９７ａから外側に突出したシート状の突出部９８が設けられている。各突出部９８には孔９９が形成されており、各突出部９８の各孔９９内にはワイヤー部材１０１が挿入されている。各孔９９の周りはグロメット等の金具で補強された金属縁となっており、ワイヤー部材１０１に対して孔９９が摺動可能になっている。   The bellows cloth 97 is made of a resin sheet and is formed in a substantially truncated cone shape. The upper ring 96a is fixed to the upper end of the small diameter, and the lower ring 96b is fixed to the lower end of the large diameter. A plurality of reinforcing rings 96c are arranged at equal intervals between the upper end and the lower end of the bellows cloth 97, and each peak portion 97a formed by the reinforcing ring 96c and the upper ring 96a protrudes outward from the peak portion 97a. The sheet-like protrusion 98 is provided. A hole 99 is formed in each protrusion 98, and a wire member 101 is inserted into each hole 99 of each protrusion 98. Around each hole 99 is a metal edge reinforced with a metal fitting such as a grommet, and the hole 99 is slidable with respect to the wire member 101.

ワイヤー部材１０１は、可撓性樹脂で形成され、摺動可能な表面を有する線状部材であり、例えばスリップチューブで構成されている。ワイヤー部材１０１は突出部９８を介して補強リング９６ｃに連結されているが、補強リング９６ｃの移動によって部分的に変形しない程度の剛性を有している。よって、ワイヤー部材１０１は複数の補強リング９６ｃのガイドとして機能し、補強リング９６ｃの移動方向や移動量を規制している。なお、ワイヤー部材１０１は、複数の補強リング９６ｃをガイド可能であれば、樹脂以外の材質で形成されてもよい。   The wire member 101 is a linear member that is formed of a flexible resin and has a slidable surface, and is made of, for example, a slip tube. The wire member 101 is connected to the reinforcing ring 96c through the protruding portion 98, but has a rigidity that does not partially deform due to the movement of the reinforcing ring 96c. Therefore, the wire member 101 functions as a guide for the plurality of reinforcing rings 96c, and regulates the moving direction and moving amount of the reinforcing ring 96c. The wire member 101 may be formed of a material other than resin as long as it can guide the plurality of reinforcing rings 96c.

各突出部９８は、各山部９７ａに対して筒状蛇腹カバー９１の左右方向に延びる中心線Ｃを挟んで対称となる２箇所に設けられている。ワイヤー部材１０１は、各山部９７ａの中心線Ｃを境にした一方側の各突出部９８の孔９９に上側から通されると共に、他方側の各突出部９８の孔９９に上側から通された環状に形成されている。ワイヤー部材１０１が各突出部９８に通されることで、筒状蛇腹カバー９１が駆動機構８１によって上下左右方向（Ｚ軸方向及びＹ軸方向）に動作されても、上面視においては複数の補強リング９６ｃの中心が中心線Ｃ上に位置付けられる。   Each projecting portion 98 is provided at two locations that are symmetrical with respect to each mountain portion 97a with a center line C extending in the left-right direction of the cylindrical bellows cover 91 interposed therebetween. The wire member 101 is passed from the upper side through the hole 99 of each projecting portion 98 on the one side with the center line C of each peak portion 97a as a boundary, and is passed from the upper side to the hole 99 of each projecting portion 98 on the other side. It is formed in an annular shape. By passing the wire member 101 through each protrusion 98, even when the cylindrical bellows cover 91 is moved in the vertical and horizontal directions (Z-axis direction and Y-axis direction) by the drive mechanism 81, a plurality of reinforcements are seen in the top view. The center of the ring 96c is positioned on the center line C.

また、ワイヤー部材１０１は、筒状蛇腹カバー９１を側方から見たときに斜め方向に延在している。ワイヤー部材１０１が部分的に変形することがないため、複数の補強リング９６ｃが突出部９８を介してワイヤー部材１０１に沿って一様にガイドされる。一部の補強リング９６ｃだけが真下に大きく移動することがないため、複数の補強リング９６ｃが入れ子状態になることがなく、複数の補強リング９６ｃの上下順序が維持される。このように、複数の突出部９８とワイヤー部材１０１とによって補強リング９６ｃの上下順序を維持する補強リング上下順序維持部が構成されている。   The wire member 101 extends in an oblique direction when the cylindrical bellows cover 91 is viewed from the side. Since the wire member 101 is not partially deformed, the plurality of reinforcing rings 96 c are uniformly guided along the wire member 101 via the protrusions 98. Since only some of the reinforcing rings 96c do not move greatly directly below, the plurality of reinforcing rings 96c are not nested, and the vertical order of the plurality of reinforcing rings 96c is maintained. As described above, the plurality of protrusions 98 and the wire member 101 constitute a reinforcing ring up / down order maintaining unit that maintains the up / down order of the reinforcing ring 96c.

図４を参照して、筒状蛇腹カバーの変形動作について説明する。図４は、本実施の形態の筒状蛇腹カバーの変形動作の説明図である。   The deformation | transformation operation | movement of a cylindrical bellows cover is demonstrated with reference to FIG. FIG. 4 is an explanatory view of the deformation operation of the cylindrical bellows cover of the present embodiment.

図４Ａに示すように、筒状蛇腹カバー９１が駆動機構８１（図１参照）によって持ち上げられた状態で、下リング９６ｂの真上に上リング９６ａが位置付けられている。この状態では、複数のリング９６の中心が上下方向の中心線上に位置しており、上下方向に隣り合うリング９６が離間して蛇腹布９７が広げられている。ワイヤー部材１０１が複数の突出部９８の孔９９（図３参照）に摺動可能に差し込まれており、筒状蛇腹カバー９１の外面に沿って斜めに延在している。このとき、ワイヤー部材１０１が各リング９６の移動のガイドとして機能しており、複数のリング９６がワイヤー部材１０１に沿って順番に並んでいる。   As shown in FIG. 4A, the upper ring 96a is positioned directly above the lower ring 96b in a state where the cylindrical bellows cover 91 is lifted by the drive mechanism 81 (see FIG. 1). In this state, the centers of the plurality of rings 96 are positioned on the center line in the vertical direction, and the bellows cloth 97 is spread by separating the rings 96 adjacent in the vertical direction. The wire member 101 is slidably inserted into holes 99 (see FIG. 3) of the plurality of projecting portions 98, and extends obliquely along the outer surface of the cylindrical bellows cover 91. At this time, the wire member 101 functions as a guide for movement of each ring 96, and a plurality of rings 96 are arranged in order along the wire member 101.

図４Ｂに示すように、この状態から上リング９６ａが真下に降ろされると、上下方向で隣り合うリング９６同士が接近して蛇腹布９７が畳まれる。また、筒状蛇腹カバー９１の収縮に伴ってワイヤー部材１０１が倒れると共に、ワイヤー部材１０１に沿って複数の突出部９８が斜め下方に摺動する。このとき、ワイヤー部材１０１が部分的に変形することがないため、一部の補強リング９６ｃだけが大きく真下に移動することがない。すなわち、ワイヤー部材１０１の傾きに応じて複数の突出部９８が一様に斜め下方に移動するため、複数の補強リング９６ｃが入れ子状態になることがない。   As shown in FIG. 4B, when the upper ring 96a is lowered directly from this state, the rings 96 adjacent in the vertical direction approach each other and the bellows cloth 97 is folded. Further, as the cylindrical bellows cover 91 contracts, the wire member 101 falls down, and the plurality of protrusions 98 slide obliquely downward along the wire member 101. At this time, since the wire member 101 is not partially deformed, only some of the reinforcing rings 96c do not move greatly downward. That is, since the plurality of projecting portions 98 uniformly move obliquely downward according to the inclination of the wire member 101, the plurality of reinforcing rings 96c are not nested.

このように、複数の突出部９８とワイヤー部材１０１とによって複数の補強リング９６ｃの上下順序が維持され、上下に対向した上側の補強リング９６ｃが下側の補強リング９６ｃの内側に入り込んで入れ子状態になることがない。なお、一部の補強リング９６ｃが下方に移動する際には、突出部９８が、その突出部９８の下側に位置する補強リング９６ｃに当たることでも、補強リング９６ｃの入れ子状態が防止される。そして、図４Ｃに示すように、蛇腹布９７が畳まれた状態で左右に移動されても、複数のリング９６の上下順序が維持されているため、筒状蛇腹カバー９１が破損することがない。   Thus, the vertical order of the plurality of reinforcing rings 96c is maintained by the plurality of protrusions 98 and the wire member 101, and the upper reinforcing ring 96c facing the upper and lower sides enters the inner side of the lower reinforcing ring 96c and is nested. Never become. In addition, when some of the reinforcing rings 96c move downward, the protruding portion 98 also hits the reinforcing ring 96c located below the protruding portion 98, thereby preventing the reinforcing ring 96c from being nested. As shown in FIG. 4C, even if the bellows cloth 97 is folded and moved to the left and right, the vertical order of the plurality of rings 96 is maintained, so that the cylindrical bellows cover 91 is not damaged. .

ここで、図５を参照して、研磨手段による研磨動作について簡単に説明する。図５は、本実施の形態の研磨手段による研磨動作の説明図である。   Here, with reference to FIG. 5, the grinding | polishing operation | movement by a grinding | polishing means is demonstrated easily. FIG. 5 is an explanatory diagram of the polishing operation by the polishing means of the present embodiment.

図５Ａに示すように、チャックテーブル４２上のウエーハＷがターンテーブル４１（図１参照）の間欠回転によって、ケース９２内の研磨位置に位置付けられている。研磨位置では、研磨手段５６がチャックテーブル４２の上方に位置付けられ、ウエーハＷから研磨パッド９５が離間されている。また、研磨手段５６によって筒状蛇腹カバー９１が上方に引き上げられており、複数のリング９６が離間して蛇腹布９７が上下方向で広げられている。また、複数の突出部９８の孔９９（図３参照）にワイヤー部材１０１が通されており、ワイヤー部材１０１の延在方向に複数の突出部９８が略等間隔で並んでいる。   As shown in FIG. 5A, the wafer W on the chuck table 42 is positioned at the polishing position in the case 92 by intermittent rotation of the turntable 41 (see FIG. 1). At the polishing position, the polishing means 56 is positioned above the chuck table 42, and the polishing pad 95 is separated from the wafer W. Further, the cylindrical bellows cover 91 is pulled upward by the polishing means 56, the plurality of rings 96 are separated, and the bellows cloth 97 is spread in the vertical direction. Further, the wire member 101 is passed through the holes 99 (see FIG. 3) of the plurality of protrusions 98, and the plurality of protrusions 98 are arranged at substantially equal intervals in the extending direction of the wire member 101.

図５Ｂに示すように、研磨パッド９５が回転された状態で、研磨手段５６が下方向に移動されると、研磨パッド９５の研磨面がウエーハＷの被研磨面に接触される。また、研磨手段５６の下方向の移動に追従して筒状蛇腹カバー９１が縮められ、複数のリング９６が接近して蛇腹布９７が上下方向で畳まれる。このとき、複数の突出部９８がワイヤー部材１０１にガイドされながら斜め下方に摺動するため、補強リング９６ｃが入れ子状態になることがない。この研磨パッド９５とウエーハＷが回転接触している状態で、研磨手段５６が右方向に移動され始める。   As shown in FIG. 5B, when the polishing means 56 is moved downward with the polishing pad 95 rotated, the polishing surface of the polishing pad 95 comes into contact with the surface to be polished of the wafer W. In addition, the cylindrical bellows cover 91 is contracted following the downward movement of the polishing means 56, the plurality of rings 96 approach and the bellows cloth 97 is folded up and down. At this time, the plurality of protrusions 98 slide obliquely downward while being guided by the wire member 101, so that the reinforcing ring 96c is not nested. In a state where the polishing pad 95 and the wafer W are in rotational contact, the polishing means 56 starts to move rightward.

図５Ｃに示すように、研磨手段５６の右方向の移動時には、複数の突出部９８がワイヤー部材１０１にガイドされながら斜めに摺動して、筒状蛇腹カバー９１が研磨手段５６の移動に追従する。複数の補強リング９６ｃが入れ子状態になっていないため、補強リング９６ｃ同士が上下に間隔を空けた状態で移動されている。このため、補強リング９６ｃ同士が擦れ合ったり、引っ掛ったりすることがなく、筒状蛇腹カバー９１が破損することがない。また、ウエーハＷに対する研磨終了後は、研磨手段５６が上方向に移動された後、左右方向に移動されて初期状態に戻される。   As shown in FIG. 5C, when the polishing means 56 moves in the right direction, the plurality of protrusions 98 slide obliquely while being guided by the wire member 101, and the cylindrical bellows cover 91 follows the movement of the polishing means 56. To do. Since the plurality of reinforcing rings 96c are not nested, the reinforcing rings 96c are moved in a state of being vertically spaced from each other. For this reason, the reinforcing rings 96c are not rubbed or caught, and the cylindrical bellows cover 91 is not damaged. Further, after the polishing of the wafer W is completed, the polishing means 56 is moved upward and then moved in the left-right direction to return to the initial state.

以上のように、本実施の形態の筒状蛇腹カバー９１によれば、複数の補強リング９６ｃが配設された蛇腹布９７に突出部９８が設けられており、各突出部９８の孔９９にワイヤー部材１０１が通されている。駆動機構８１の下方向の動作時には、ワイヤー部材１０１によって各突出部９８を介して複数の補強リング９６ｃの移動がガイドされる。また、各突出部９８にワイヤー部材１０１が通されているため、複数の補強リング９６ｃが上下順序を維持した状態でワイヤー部材１０１に沿って移動される。よって、複数の補強リング９６ｃが入れ子状態になることがなく、複数の補強リング９６ｃが離間された状態で駆動機構８１が動作するため、筒状蛇腹カバー９１の破損を防止することができる。   As described above, according to the cylindrical bellows cover 91 of the present embodiment, the protrusions 98 are provided on the bellows cloth 97 provided with the plurality of reinforcing rings 96 c, and the holes 99 of the protrusions 98 are provided in the holes 99. The wire member 101 is passed. During the downward operation of the drive mechanism 81, the movement of the plurality of reinforcing rings 96 c is guided by the wire member 101 via the protrusions 98. Moreover, since the wire member 101 is passed through each protrusion 98, the plurality of reinforcing rings 96c are moved along the wire member 101 in a state where the vertical order is maintained. Therefore, the plurality of reinforcing rings 96c are not nested, and the drive mechanism 81 operates in a state where the plurality of reinforcing rings 96c are separated from each other, so that the cylindrical bellows cover 91 can be prevented from being damaged.

なお、本発明は上記実施の形態に限定されず、種々変更して実施することが可能である。上記実施の形態において、添付図面に図示されている大きさや形状などについては、これに限定されず、本発明の効果を発揮する範囲内で適宜変更することが可能である。その他、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施することが可能である。   In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

例えば、上記した実施の形態においては、研削研磨装置１に筒状蛇腹カバー９１を設ける構成にしたが、研磨専用の研磨装置に筒状蛇腹カバー９１が設けられてもよい。また、筒状蛇腹カバー９１は、加工手段の動作領域のカバーが必要な加工装置に設けられてもよい。   For example, in the above-described embodiment, the cylindrical bellows cover 91 is provided in the grinding and polishing apparatus 1, but the cylindrical bellows cover 91 may be provided in a polishing apparatus dedicated to polishing. Further, the cylindrical bellows cover 91 may be provided in a processing apparatus that requires a cover of the operation area of the processing means.

また、上記した実施の形態においては、補強リング９６ｃが長円リング状に形成される構成にしたが、補強リング９６ｃが円形リング状に形成されていてもよい。   In the above-described embodiment, the reinforcing ring 96c is formed in an oval ring shape, but the reinforcing ring 96c may be formed in a circular ring shape.

また、上記した実施の形態においては、突出部９８が蛇腹布９７の各山部９７ａからシート状に突出する構成にしたが、突出部９８にワイヤー部材１０１が通る孔９９が形成されていれば、突出部９８の形状は特に限定されない。   Further, in the above-described embodiment, the projecting portion 98 is configured to project from each mountain portion 97a of the bellows cloth 97 in a sheet shape, but if the hole 99 through which the wire member 101 passes is formed in the projecting portion 98. The shape of the protrusion 98 is not particularly limited.

また、上記した実施の形態においては、各突出部９８が各山部９７ａに対して２箇所ずつ設けられる構成にしたが、突出部９８は各山部９７ａに対して１箇所ずつ設けられてもよいし、３箇所以上設けられてもよい。なお、各山部９７ａに対して各突出部９８が１箇所ずつ設けられる場合には、筒状蛇腹カバー９１の左右方向に延びる中心線Ｃ上に設けられることが好ましい。   Further, in the above-described embodiment, each protruding portion 98 is provided at two places for each peak portion 97a. However, the protruding portion 98 may be provided at one location for each peak portion 97a. Alternatively, three or more locations may be provided. In addition, when each protrusion part 98 is provided in one place with respect to each peak part 97a, it is preferable to be provided on the centerline C extended in the left-right direction of the cylindrical bellows cover 91.

また、上記した実施の形態においては、ワイヤー部材１０１は、スリップチューブ等の中空の線状部材で形成される構成にしたが、中実の線状部材で形成されてもよい。   In the above-described embodiment, the wire member 101 is formed of a hollow linear member such as a slip tube, but may be formed of a solid linear member.

以上説明したように、本発明は、リングの入れ子状態に起因した筒状蛇腹カバーの破損を防止することができるという効果を有し、特に、研磨パッドの移動に追従して変形する筒状蛇腹カバーに有用である。   As described above, the present invention has an effect of preventing the cylindrical bellows cover from being damaged due to the nesting state of the ring, and in particular, the cylindrical bellows deformed following the movement of the polishing pad. Useful for covers.

８１ 駆動機構
９１ 筒状蛇腹カバー
９６ａ 上リング
９６ｂ 下リング
９６ｃ 補強リング
９７ 蛇腹布
９７ａ 山部
９８ 突出部
９９ 孔
１０１ ワイヤー部材 81 Drive mechanism 91 Cylindrical bellows cover 96a Upper ring 96b Lower ring 96c Reinforcement ring 97 Bellows cloth 97a Mountain part 98 Projection part 99 Hole 101 Wire member

Claims (1)

上下左右方向に動作する駆動機構の動作領域をカバーする筒状蛇腹カバーであって、
円リング状の上リングと、長円リング状の下リングと、上下に配置される該上リングと該下リングとを連結しかつ上下に段階的に該上リングの円形部分から該下リングの長円形部分に至る複数の山部を有する山谷形状で形成された筒状の蛇腹布と、該上リングと該下リングと平行で該蛇腹布の該複数の山部の内部に配設される該蛇腹布を補強する補強リングと、を備え、
該蛇腹布の複数の該山部には、各山部の外側に突出し孔を有する突出部と、複数の該突出部の該孔が摺動可能に複数の該孔内に挿入され複数の該山部の該補強リングの上下順序を維持するワイヤー部材と、を備えた補強リング上下順序維持部を備え、
各複数の山部の該補強リングの上下順序を維持しつつ上下左右方向に動作する該駆動機構の動作領域をカバーする筒状蛇腹カバー。 A cylindrical bellows cover that covers the operating area of the drive mechanism that operates in the vertical and horizontal directions,
An upper ring in the shape of a circular ring, a lower ring in the shape of an oval ring, and the upper ring and the lower ring that are arranged above and below are connected to each other and the upper ring is gradually moved upward and downward from the circular portion of the upper ring. A cylindrical bellows cloth formed in a mountain-valley shape having a plurality of ridges reaching an oval portion, and disposed inside the plurality of ridges of the bellows cloth in parallel with the upper ring and the lower ring. A reinforcing ring for reinforcing the bellows cloth,
The plurality of ridges of the bellows cloth are provided with protrusions protruding outward from the ridges, and the holes of the plurality of protrusions are slidably inserted into the plurality of holes. A wire member for maintaining the vertical order of the reinforcing ring of the mountain part, and a reinforcing ring vertical order maintaining part comprising:
A cylindrical bellows cover that covers an operation region of the drive mechanism that operates in the vertical and horizontal directions while maintaining the vertical order of the reinforcing rings of the plurality of peak portions.
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