JP2017072587A5 - - Google Patents

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Publication number
JP2017072587A5
JP2017072587A5 JP2016187349A JP2016187349A JP2017072587A5 JP 2017072587 A5 JP2017072587 A5 JP 2017072587A5 JP 2016187349 A JP2016187349 A JP 2016187349A JP 2016187349 A JP2016187349 A JP 2016187349A JP 2017072587 A5 JP2017072587 A5 JP 2017072587A5
Authority
JP
Japan
Prior art keywords
sensing
binding
sensing device
molecular bond
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016187349A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017072587A (ja
Filing date
Publication date
Priority claimed from US12/951,330 external-priority patent/US8261618B2/en
Application filed filed Critical
Publication of JP2017072587A publication Critical patent/JP2017072587A/ja
Publication of JP2017072587A5 publication Critical patent/JP2017072587A5/ja
Pending legal-status Critical Current

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JP2016187349A 2010-11-22 2016-09-26 結合要素を備える感知装置 Pending JP2017072587A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/951,330 US8261618B2 (en) 2010-11-22 2010-11-22 Device for measuring properties of working fluids
US12/951,330 2010-11-22

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013540111A Division JP2013543136A (ja) 2010-11-22 2011-11-22 結合要素を備える感知装置

Publications (2)

Publication Number Publication Date
JP2017072587A JP2017072587A (ja) 2017-04-13
JP2017072587A5 true JP2017072587A5 (enExample) 2017-06-22

Family

ID=45401158

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013540111A Pending JP2013543136A (ja) 2010-11-22 2011-11-22 結合要素を備える感知装置
JP2016187349A Pending JP2017072587A (ja) 2010-11-22 2016-09-26 結合要素を備える感知装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2013540111A Pending JP2013543136A (ja) 2010-11-22 2011-11-22 結合要素を備える感知装置

Country Status (6)

Country Link
US (1) US8261618B2 (enExample)
EP (1) EP2643672B1 (enExample)
JP (2) JP2013543136A (enExample)
KR (1) KR101356297B1 (enExample)
CN (1) CN103314284B (enExample)
WO (1) WO2012071409A1 (enExample)

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US9589686B2 (en) 2006-11-16 2017-03-07 General Electric Company Apparatus for detecting contaminants in a liquid and a system for use thereof
US9536122B2 (en) 2014-11-04 2017-01-03 General Electric Company Disposable multivariable sensing devices having radio frequency based sensors
US10914698B2 (en) 2006-11-16 2021-02-09 General Electric Company Sensing method and system
US9658178B2 (en) 2012-09-28 2017-05-23 General Electric Company Sensor systems for measuring an interface level in a multi-phase fluid composition
US9538657B2 (en) 2012-06-29 2017-01-03 General Electric Company Resonant sensor and an associated sensing method
US8542023B2 (en) 2010-11-09 2013-09-24 General Electric Company Highly selective chemical and biological sensors
AU2013305814B2 (en) 2012-08-22 2017-04-13 Ge Global Sourcing Llc Wireless system and method for measuring an operative condition of a machine
US10598650B2 (en) 2012-08-22 2020-03-24 General Electric Company System and method for measuring an operative condition of a machine
US9027410B2 (en) * 2012-09-14 2015-05-12 Sensata Technologies, Inc. Hermetically glass sealed pressure sensor
US10684268B2 (en) 2012-09-28 2020-06-16 Bl Technologies, Inc. Sensor systems for measuring an interface level in a multi-phase fluid composition
WO2016134114A1 (en) 2015-02-18 2016-08-25 Ti Group Automotive Systems, Llc Level sensor
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DE102017223177A1 (de) 2017-12-19 2019-06-19 Conti Temic Microelectronic Gmbh Druckmesseinheit und Anschlussbaueinheit für ein Kraftfahrzeug-Getriebe.
KR102261637B1 (ko) * 2020-01-14 2021-06-07 주식회사 현대케피코 압력센서 체결구조
FR3119834B1 (fr) * 2021-02-17 2025-02-14 Cent Rech Archit Indu Nautiques Systeme generateur de portance et bateau muni d’un tel systeme

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JPS6117925A (ja) * 1984-07-05 1986-01-25 Hitachi Ltd 圧力センサ
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JPH0355874Y2 (enExample) * 1986-02-27 1991-12-13
JPS64432A (en) * 1987-06-23 1989-01-05 Hitachi Ltd Semiconductor pressure transducer
US5186055A (en) * 1991-06-03 1993-02-16 Eaton Corporation Hermetic mounting system for a pressure transducer
US5663109A (en) 1992-10-19 1997-09-02 Quantum Materials, Inc. Low temperature glass paste with high metal to glass ratio
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