JP2013543136A - 結合要素を備える感知装置 - Google Patents
結合要素を備える感知装置 Download PDFInfo
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- JP2013543136A JP2013543136A JP2013540111A JP2013540111A JP2013543136A JP 2013543136 A JP2013543136 A JP 2013543136A JP 2013540111 A JP2013540111 A JP 2013540111A JP 2013540111 A JP2013540111 A JP 2013540111A JP 2013543136 A JP2013543136 A JP 2013543136A
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- JP
- Japan
- Prior art keywords
- sensing device
- sensing
- coupling
- cavity
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 117
- 238000010168 coupling process Methods 0.000 title claims abstract description 117
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 117
- 239000012530 fluid Substances 0.000 claims abstract description 101
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011521 glass Substances 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000002210 silicon-based material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 70
- 239000000446 fuel Substances 0.000 abstract description 18
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- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 32
- 230000007246 mechanism Effects 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 13
- 230000000452 restraining effect Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
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- 229920000647 polyepoxide Polymers 0.000 description 5
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- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000005297 pyrex Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009530 blood pressure measurement Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004855 amber Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- -1 borosilicate Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 239000003000 extruded plastic Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2888—Lubricating oil characteristics, e.g. deterioration
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/951,330 US8261618B2 (en) | 2010-11-22 | 2010-11-22 | Device for measuring properties of working fluids |
| US12/951,330 | 2010-11-22 | ||
| PCT/US2011/061836 WO2012071409A1 (en) | 2010-11-22 | 2011-11-22 | Sensing device comprising a bonding element |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016187349A Division JP2017072587A (ja) | 2010-11-22 | 2016-09-26 | 結合要素を備える感知装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2013543136A true JP2013543136A (ja) | 2013-11-28 |
Family
ID=45401158
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013540111A Pending JP2013543136A (ja) | 2010-11-22 | 2011-11-22 | 結合要素を備える感知装置 |
| JP2016187349A Pending JP2017072587A (ja) | 2010-11-22 | 2016-09-26 | 結合要素を備える感知装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016187349A Pending JP2017072587A (ja) | 2010-11-22 | 2016-09-26 | 結合要素を備える感知装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8261618B2 (enExample) |
| EP (1) | EP2643672B1 (enExample) |
| JP (2) | JP2013543136A (enExample) |
| KR (1) | KR101356297B1 (enExample) |
| CN (1) | CN103314284B (enExample) |
| WO (1) | WO2012071409A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11598674B2 (en) * | 2015-12-01 | 2023-03-07 | Maxim Integrated Products, Inc. | Systems and methods for logging data in harsh environments |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9589686B2 (en) | 2006-11-16 | 2017-03-07 | General Electric Company | Apparatus for detecting contaminants in a liquid and a system for use thereof |
| US9536122B2 (en) | 2014-11-04 | 2017-01-03 | General Electric Company | Disposable multivariable sensing devices having radio frequency based sensors |
| US10914698B2 (en) | 2006-11-16 | 2021-02-09 | General Electric Company | Sensing method and system |
| US9658178B2 (en) | 2012-09-28 | 2017-05-23 | General Electric Company | Sensor systems for measuring an interface level in a multi-phase fluid composition |
| US9538657B2 (en) | 2012-06-29 | 2017-01-03 | General Electric Company | Resonant sensor and an associated sensing method |
| US8542023B2 (en) | 2010-11-09 | 2013-09-24 | General Electric Company | Highly selective chemical and biological sensors |
| AU2013305814B2 (en) | 2012-08-22 | 2017-04-13 | Ge Global Sourcing Llc | Wireless system and method for measuring an operative condition of a machine |
| US10598650B2 (en) | 2012-08-22 | 2020-03-24 | General Electric Company | System and method for measuring an operative condition of a machine |
| US9027410B2 (en) * | 2012-09-14 | 2015-05-12 | Sensata Technologies, Inc. | Hermetically glass sealed pressure sensor |
| US10684268B2 (en) | 2012-09-28 | 2020-06-16 | Bl Technologies, Inc. | Sensor systems for measuring an interface level in a multi-phase fluid composition |
| WO2016134114A1 (en) | 2015-02-18 | 2016-08-25 | Ti Group Automotive Systems, Llc | Level sensor |
| DE102017223177A1 (de) | 2017-12-19 | 2019-06-19 | Conti Temic Microelectronic Gmbh | Druckmesseinheit und Anschlussbaueinheit für ein Kraftfahrzeug-Getriebe. |
| KR102261637B1 (ko) * | 2020-01-14 | 2021-06-07 | 주식회사 현대케피코 | 압력센서 체결구조 |
| FR3119834B1 (fr) * | 2021-02-17 | 2025-02-14 | Cent Rech Archit Indu Nautiques | Systeme generateur de portance et bateau muni d’un tel systeme |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553623A (en) * | 1978-06-22 | 1980-01-11 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
| JPS62140427U (enExample) * | 1986-02-27 | 1987-09-04 | ||
| JPS64432A (en) * | 1987-06-23 | 1989-01-05 | Hitachi Ltd | Semiconductor pressure transducer |
| JPH10500206A (ja) * | 1994-04-14 | 1998-01-06 | セカツプ・アー・ベー | 圧力センサの取付け |
| JP2001272295A (ja) * | 2000-03-27 | 2001-10-05 | Tadahiro Kato | 圧力測定センサ |
| JP2001272294A (ja) * | 2000-01-25 | 2001-10-05 | Motorola Inc | 選択封止付き超小型電気機械式システム・センサおよびそのための方法 |
| JP2008516230A (ja) * | 2004-10-07 | 2008-05-15 | エム ケー エス インストルメンツ インコーポレーテッド | 静電容量センサのハウジングとダイヤフラムとの間にシールを形成する方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4310357A (en) | 1980-05-14 | 1982-01-12 | Nippon Electric Glass Company, Limited | Low temperature sealing glass |
| JPS6117925A (ja) * | 1984-07-05 | 1986-01-25 | Hitachi Ltd | 圧力センサ |
| US4743302A (en) | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
| US5186055A (en) * | 1991-06-03 | 1993-02-16 | Eaton Corporation | Hermetic mounting system for a pressure transducer |
| US5663109A (en) | 1992-10-19 | 1997-09-02 | Quantum Materials, Inc. | Low temperature glass paste with high metal to glass ratio |
| US5334558A (en) | 1992-10-19 | 1994-08-02 | Diemat, Inc. | Low temperature glass with improved thermal stress properties and method of use |
| US5454270A (en) * | 1994-06-06 | 1995-10-03 | Motorola, Inc. | Hermetically sealed pressure sensor and method thereof |
| JP2809385B2 (ja) * | 1994-11-29 | 1998-10-08 | 信越ポリマー株式会社 | 半導体素子接続用配線基板および半導体素子接続構造 |
| US7109842B1 (en) * | 1998-12-07 | 2006-09-19 | Honeywell International Inc. | Robust fluid flow and property microsensor made of optimal material |
| JP2001106545A (ja) | 1999-07-30 | 2001-04-17 | Hoya Corp | ガラス基板、半導体センサの製造方法および半導体センサ |
| US20040043479A1 (en) * | 2000-12-11 | 2004-03-04 | Briscoe Cynthia G. | Multilayerd microfluidic devices for analyte reactions |
| JP3728623B2 (ja) * | 2001-03-02 | 2005-12-21 | 日本碍子株式会社 | 圧電／電歪膜型素子 |
| JP2004071698A (ja) * | 2002-08-02 | 2004-03-04 | Hitachi Metals Ltd | 半導体パッケージ |
| EP1642871B1 (en) | 2003-06-27 | 2010-12-01 | Yamato Electronic Co., Ltd. | Lead-free glass material for use in sealing and, sealed article and method for sealing using the same |
| US7126255B2 (en) * | 2004-04-05 | 2006-10-24 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive film-type device |
| JP4393312B2 (ja) * | 2004-08-27 | 2010-01-06 | 富士通株式会社 | 半導体装置 |
| TWM264652U (en) * | 2004-10-21 | 2005-05-11 | Chipmos Technologies Inc | Structure of image sensor package |
| JP2006147839A (ja) * | 2004-11-19 | 2006-06-08 | Ngk Insulators Ltd | 圧電／電歪デバイス |
| JP4963159B2 (ja) * | 2004-11-19 | 2012-06-27 | 日本碍子株式会社 | 圧電／電歪デバイス |
| JP4983176B2 (ja) | 2006-09-14 | 2012-07-25 | セイコーエプソン株式会社 | 圧力センサの製造方法 |
| US8069732B2 (en) * | 2007-11-06 | 2011-12-06 | Kulite Semiconductor Products, Inc. | Ultra-miniature multi-hole probes having high frequency, high temperature responses |
| TW200949106A (en) | 2008-05-20 | 2009-12-01 | Tatung Co | Lead-free sealing material |
-
2010
- 2010-11-22 US US12/951,330 patent/US8261618B2/en active Active
-
2011
- 2011-11-22 JP JP2013540111A patent/JP2013543136A/ja active Pending
- 2011-11-22 CN CN201180065666.XA patent/CN103314284B/zh not_active Expired - Fee Related
- 2011-11-22 WO PCT/US2011/061836 patent/WO2012071409A1/en not_active Ceased
- 2011-11-22 KR KR1020137013017A patent/KR101356297B1/ko not_active Expired - Fee Related
- 2011-11-22 EP EP11799903.7A patent/EP2643672B1/en active Active
-
2016
- 2016-09-26 JP JP2016187349A patent/JP2017072587A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553623A (en) * | 1978-06-22 | 1980-01-11 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
| JPS62140427U (enExample) * | 1986-02-27 | 1987-09-04 | ||
| JPS64432A (en) * | 1987-06-23 | 1989-01-05 | Hitachi Ltd | Semiconductor pressure transducer |
| JPH10500206A (ja) * | 1994-04-14 | 1998-01-06 | セカツプ・アー・ベー | 圧力センサの取付け |
| JP2001272294A (ja) * | 2000-01-25 | 2001-10-05 | Motorola Inc | 選択封止付き超小型電気機械式システム・センサおよびそのための方法 |
| JP2001272295A (ja) * | 2000-03-27 | 2001-10-05 | Tadahiro Kato | 圧力測定センサ |
| JP2008516230A (ja) * | 2004-10-07 | 2008-05-15 | エム ケー エス インストルメンツ インコーポレーテッド | 静電容量センサのハウジングとダイヤフラムとの間にシールを形成する方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11598674B2 (en) * | 2015-12-01 | 2023-03-07 | Maxim Integrated Products, Inc. | Systems and methods for logging data in harsh environments |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103314284A (zh) | 2013-09-18 |
| WO2012071409A1 (en) | 2012-05-31 |
| US8261618B2 (en) | 2012-09-11 |
| KR101356297B1 (ko) | 2014-01-28 |
| EP2643672B1 (en) | 2019-10-30 |
| KR20130072262A (ko) | 2013-07-01 |
| JP2017072587A (ja) | 2017-04-13 |
| EP2643672A1 (en) | 2013-10-02 |
| CN103314284B (zh) | 2015-04-22 |
| US20120125115A1 (en) | 2012-05-24 |
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