CN103314284B - 包括键合元件的感测装置 - Google Patents
包括键合元件的感测装置 Download PDFInfo
- Publication number
- CN103314284B CN103314284B CN201180065666.XA CN201180065666A CN103314284B CN 103314284 B CN103314284 B CN 103314284B CN 201180065666 A CN201180065666 A CN 201180065666A CN 103314284 B CN103314284 B CN 103314284B
- Authority
- CN
- China
- Prior art keywords
- sensing device
- absolute pressure
- bonding
- sensing apparatus
- pressure sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/0038—Fluidic connecting means being part of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2888—Lubricating oil characteristics, e.g. deterioration
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/951,330 US8261618B2 (en) | 2010-11-22 | 2010-11-22 | Device for measuring properties of working fluids |
| US12/951330 | 2010-11-22 | ||
| US12/951,330 | 2010-11-22 | ||
| PCT/US2011/061836 WO2012071409A1 (en) | 2010-11-22 | 2011-11-22 | Sensing device comprising a bonding element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103314284A CN103314284A (zh) | 2013-09-18 |
| CN103314284B true CN103314284B (zh) | 2015-04-22 |
Family
ID=45401158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180065666.XA Expired - Fee Related CN103314284B (zh) | 2010-11-22 | 2011-11-22 | 包括键合元件的感测装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8261618B2 (enExample) |
| EP (1) | EP2643672B1 (enExample) |
| JP (2) | JP2013543136A (enExample) |
| KR (1) | KR101356297B1 (enExample) |
| CN (1) | CN103314284B (enExample) |
| WO (1) | WO2012071409A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9589686B2 (en) | 2006-11-16 | 2017-03-07 | General Electric Company | Apparatus for detecting contaminants in a liquid and a system for use thereof |
| US9538657B2 (en) | 2012-06-29 | 2017-01-03 | General Electric Company | Resonant sensor and an associated sensing method |
| US10914698B2 (en) | 2006-11-16 | 2021-02-09 | General Electric Company | Sensing method and system |
| US9658178B2 (en) | 2012-09-28 | 2017-05-23 | General Electric Company | Sensor systems for measuring an interface level in a multi-phase fluid composition |
| US9536122B2 (en) | 2014-11-04 | 2017-01-03 | General Electric Company | Disposable multivariable sensing devices having radio frequency based sensors |
| US8542023B2 (en) | 2010-11-09 | 2013-09-24 | General Electric Company | Highly selective chemical and biological sensors |
| US10598650B2 (en) | 2012-08-22 | 2020-03-24 | General Electric Company | System and method for measuring an operative condition of a machine |
| US9746452B2 (en) | 2012-08-22 | 2017-08-29 | General Electric Company | Wireless system and method for measuring an operative condition of a machine |
| US9027410B2 (en) * | 2012-09-14 | 2015-05-12 | Sensata Technologies, Inc. | Hermetically glass sealed pressure sensor |
| US10684268B2 (en) | 2012-09-28 | 2020-06-16 | Bl Technologies, Inc. | Sensor systems for measuring an interface level in a multi-phase fluid composition |
| CN107407589B (zh) | 2015-02-18 | 2020-04-28 | Ti集团车辆系统有限责任公司 | 液位传送器和用于承载液体的装置 |
| WO2017095611A1 (en) * | 2015-12-01 | 2017-06-08 | Maxim Integrated Products, Inc. | Systems and methods for logging data in harsh environments |
| DE102017223177A1 (de) | 2017-12-19 | 2019-06-19 | Conti Temic Microelectronic Gmbh | Druckmesseinheit und Anschlussbaueinheit für ein Kraftfahrzeug-Getriebe. |
| KR102261637B1 (ko) * | 2020-01-14 | 2021-06-07 | 주식회사 현대케피코 | 압력센서 체결구조 |
| FR3119834B1 (fr) * | 2021-02-17 | 2025-02-14 | Cent Rech Archit Indu Nautiques | Systeme generateur de portance et bateau muni d’un tel systeme |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0167144A2 (en) * | 1984-07-05 | 1986-01-08 | Hitachi, Ltd. | A pressure sensor and a method of arranging a pressure sensor |
| US5454270A (en) * | 1994-06-06 | 1995-10-03 | Motorola, Inc. | Hermetically sealed pressure sensor and method thereof |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS553623A (en) * | 1978-06-22 | 1980-01-11 | Nissan Motor Co Ltd | Semiconductor pressure sensor |
| US4310357A (en) | 1980-05-14 | 1982-01-12 | Nippon Electric Glass Company, Limited | Low temperature sealing glass |
| US4743302A (en) | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
| JPH0355874Y2 (enExample) * | 1986-02-27 | 1991-12-13 | ||
| JPS64432A (en) * | 1987-06-23 | 1989-01-05 | Hitachi Ltd | Semiconductor pressure transducer |
| US5186055A (en) * | 1991-06-03 | 1993-02-16 | Eaton Corporation | Hermetic mounting system for a pressure transducer |
| US5663109A (en) | 1992-10-19 | 1997-09-02 | Quantum Materials, Inc. | Low temperature glass paste with high metal to glass ratio |
| US5334558A (en) | 1992-10-19 | 1994-08-02 | Diemat, Inc. | Low temperature glass with improved thermal stress properties and method of use |
| SE516716C2 (sv) * | 1994-04-14 | 2002-02-19 | Mks Instr | Tryckgivare för mätning av trycket hos en fluid |
| JP2809385B2 (ja) * | 1994-11-29 | 1998-10-08 | 信越ポリマー株式会社 | 半導体素子接続用配線基板および半導体素子接続構造 |
| US7109842B1 (en) * | 1998-12-07 | 2006-09-19 | Honeywell International Inc. | Robust fluid flow and property microsensor made of optimal material |
| JP2001106545A (ja) | 1999-07-30 | 2001-04-17 | Hoya Corp | ガラス基板、半導体センサの製造方法および半導体センサ |
| US6401545B1 (en) * | 2000-01-25 | 2002-06-11 | Motorola, Inc. | Micro electro-mechanical system sensor with selective encapsulation and method therefor |
| JP2001272295A (ja) * | 2000-03-27 | 2001-10-05 | Tadahiro Kato | 圧力測定センサ |
| US20040043479A1 (en) * | 2000-12-11 | 2004-03-04 | Briscoe Cynthia G. | Multilayerd microfluidic devices for analyte reactions |
| JP3728623B2 (ja) * | 2001-03-02 | 2005-12-21 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
| JP2004071698A (ja) * | 2002-08-02 | 2004-03-04 | Hitachi Metals Ltd | 半導体パッケージ |
| JP3914245B2 (ja) | 2003-06-27 | 2007-05-16 | ヤマト電子株式会社 | 封着加工用無鉛ガラス材とこれを用いた封着加工物及び封着加工方法 |
| US7126255B2 (en) * | 2004-04-05 | 2006-10-24 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive film-type device |
| JP4393312B2 (ja) * | 2004-08-27 | 2010-01-06 | 富士通株式会社 | 半導体装置 |
| US7141447B2 (en) * | 2004-10-07 | 2006-11-28 | Mks Instruments, Inc. | Method of forming a seal between a housing and a diaphragm of a capacitance sensor |
| TWM264652U (en) * | 2004-10-21 | 2005-05-11 | Chipmos Technologies Inc | Structure of image sensor package |
| JP2006147839A (ja) * | 2004-11-19 | 2006-06-08 | Ngk Insulators Ltd | 圧電/電歪デバイス |
| JP4963159B2 (ja) * | 2004-11-19 | 2012-06-27 | 日本碍子株式会社 | 圧電/電歪デバイス |
| JP4983176B2 (ja) | 2006-09-14 | 2012-07-25 | セイコーエプソン株式会社 | 圧力センサの製造方法 |
| US8069732B2 (en) * | 2007-11-06 | 2011-12-06 | Kulite Semiconductor Products, Inc. | Ultra-miniature multi-hole probes having high frequency, high temperature responses |
| TW200949106A (en) | 2008-05-20 | 2009-12-01 | Tatung Co | Lead-free sealing material |
-
2010
- 2010-11-22 US US12/951,330 patent/US8261618B2/en active Active
-
2011
- 2011-11-22 KR KR1020137013017A patent/KR101356297B1/ko not_active Expired - Fee Related
- 2011-11-22 JP JP2013540111A patent/JP2013543136A/ja active Pending
- 2011-11-22 CN CN201180065666.XA patent/CN103314284B/zh not_active Expired - Fee Related
- 2011-11-22 EP EP11799903.7A patent/EP2643672B1/en active Active
- 2011-11-22 WO PCT/US2011/061836 patent/WO2012071409A1/en not_active Ceased
-
2016
- 2016-09-26 JP JP2016187349A patent/JP2017072587A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0167144A2 (en) * | 1984-07-05 | 1986-01-08 | Hitachi, Ltd. | A pressure sensor and a method of arranging a pressure sensor |
| US5454270A (en) * | 1994-06-06 | 1995-10-03 | Motorola, Inc. | Hermetically sealed pressure sensor and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101356297B1 (ko) | 2014-01-28 |
| KR20130072262A (ko) | 2013-07-01 |
| US8261618B2 (en) | 2012-09-11 |
| EP2643672B1 (en) | 2019-10-30 |
| CN103314284A (zh) | 2013-09-18 |
| JP2013543136A (ja) | 2013-11-28 |
| WO2012071409A1 (en) | 2012-05-31 |
| US20120125115A1 (en) | 2012-05-24 |
| EP2643672A1 (en) | 2013-10-02 |
| JP2017072587A (ja) | 2017-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103314284B (zh) | 包括键合元件的感测装置 | |
| EP2474819B1 (en) | Media isolated pressure sensor | |
| CN109696268B (zh) | 压力传感器组件 | |
| CN101900625B (zh) | 基于微电子封装工艺的湿/湿差动压力感测器设计 | |
| US8276460B2 (en) | Packaging for chip-on-board pressure sensor | |
| KR101236678B1 (ko) | 압력 센서 장치 | |
| US7861595B2 (en) | Pressure sensing device for harsh environments | |
| US8499642B2 (en) | Hermetically sealed pressure sensing device | |
| CN107110729B (zh) | 压力测量装置 | |
| EP2562524A1 (en) | Package structure for silicon pressure sensor | |
| WO2007079454A2 (en) | Pressure sensor with silicon frit bonded cap | |
| EP2708866A1 (en) | Hermetically Glass Sealed Pressure Sensor | |
| CN109211458B (zh) | 压力传感器组件 | |
| EP2388566A1 (en) | Modular pressure sensor | |
| CN102334019A (zh) | 具有半导体压力测量换能器的压力传感器 | |
| JP6807486B2 (ja) | 圧力センサ構成およびその製造方法 | |
| US11146893B2 (en) | Sensor system, sensor arrangement, and assembly method using solder for sealing | |
| EP3748324B1 (en) | Pressure sensor assemblies with protective pressure feature | |
| CN111751044A (zh) | 压力传感器和制造压力传感器的方法 | |
| CN210243053U (zh) | 基于倒装焊芯片的压力传感器芯体和压力传感器 | |
| EP3614116B1 (en) | Pressure sensors and methods of making pressure sensors | |
| US20250264367A1 (en) | Laminate substrate-based differential pressure sensor package combining air cavity channel substrate, overmold, and lid with two chimneys | |
| EP4521086A1 (en) | Low stress packaging for environmental sensors | |
| CN117606665A (zh) | 充油压力传感器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20171122 |