JP2017051885A - 塗布装置 - Google Patents

塗布装置 Download PDF

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Publication number
JP2017051885A
JP2017051885A JP2015175902A JP2015175902A JP2017051885A JP 2017051885 A JP2017051885 A JP 2017051885A JP 2015175902 A JP2015175902 A JP 2015175902A JP 2015175902 A JP2015175902 A JP 2015175902A JP 2017051885 A JP2017051885 A JP 2017051885A
Authority
JP
Japan
Prior art keywords
coating
suction
liquid
coating liquid
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015175902A
Other languages
English (en)
Japanese (ja)
Inventor
暁雄 鈴木
Akio Suzuki
暁雄 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2015175902A priority Critical patent/JP2017051885A/ja
Priority to TW105125649A priority patent/TW201718107A/zh
Priority to KR1020160104015A priority patent/KR20170029380A/ko
Priority to CN201610718005.7A priority patent/CN106493041A/zh
Publication of JP2017051885A publication Critical patent/JP2017051885A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B05C11/101—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
JP2015175902A 2015-09-07 2015-09-07 塗布装置 Pending JP2017051885A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015175902A JP2017051885A (ja) 2015-09-07 2015-09-07 塗布装置
TW105125649A TW201718107A (zh) 2015-09-07 2016-08-11 塗布裝置
KR1020160104015A KR20170029380A (ko) 2015-09-07 2016-08-17 도포 장치
CN201610718005.7A CN106493041A (zh) 2015-09-07 2016-08-24 涂布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015175902A JP2017051885A (ja) 2015-09-07 2015-09-07 塗布装置

Publications (1)

Publication Number Publication Date
JP2017051885A true JP2017051885A (ja) 2017-03-16

Family

ID=58291263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015175902A Pending JP2017051885A (ja) 2015-09-07 2015-09-07 塗布装置

Country Status (4)

Country Link
JP (1) JP2017051885A (ko)
KR (1) KR20170029380A (ko)
CN (1) CN106493041A (ko)
TW (1) TW201718107A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7135015B2 (ja) * 2020-02-03 2022-09-12 東レエンジニアリング株式会社 塗工装置および塗工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1176894A (ja) * 1997-09-11 1999-03-23 Dainippon Screen Mfg Co Ltd 塗布装置および塗布方法
JP2001179156A (ja) * 1999-12-22 2001-07-03 Hirano Tecseed Co Ltd 吐出型塗工装置
JP2004006762A (ja) * 2002-03-29 2004-01-08 Hoya Corp 塗布装置、その液面レベル管理方法及び管理装置、レジスト膜付基板の製造方法及びパターン形成方法、並びにフォトマスクの製造方法
JP2008161741A (ja) * 2006-12-27 2008-07-17 Chugai Ro Co Ltd 塗布装置及び塗布方法
WO2013080688A1 (ja) * 2011-12-01 2013-06-06 タツモ株式会社 塗布装置および塗布方法
WO2014142239A1 (ja) * 2013-03-14 2014-09-18 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
JP2015058370A (ja) * 2013-09-17 2015-03-30 東レエンジニアリング株式会社 塗布装置および塗布方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI253359B (en) * 2003-03-14 2006-04-21 Dainippon Screen Mfg Substrate processing device and liquid feeding device
JP4305918B2 (ja) 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
CN202224307U (zh) * 2011-08-30 2012-05-23 景晖精密企业有限公司 狭缝式涂布头的可间歇性供墨系统
JP2014180604A (ja) 2013-03-18 2014-09-29 Toray Ind Inc 間欠塗布装置および間欠塗布方法並びにディスプレイ用部材の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1176894A (ja) * 1997-09-11 1999-03-23 Dainippon Screen Mfg Co Ltd 塗布装置および塗布方法
JP2001179156A (ja) * 1999-12-22 2001-07-03 Hirano Tecseed Co Ltd 吐出型塗工装置
JP2004006762A (ja) * 2002-03-29 2004-01-08 Hoya Corp 塗布装置、その液面レベル管理方法及び管理装置、レジスト膜付基板の製造方法及びパターン形成方法、並びにフォトマスクの製造方法
JP2008161741A (ja) * 2006-12-27 2008-07-17 Chugai Ro Co Ltd 塗布装置及び塗布方法
WO2013080688A1 (ja) * 2011-12-01 2013-06-06 タツモ株式会社 塗布装置および塗布方法
WO2014142239A1 (ja) * 2013-03-14 2014-09-18 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
JP2015058370A (ja) * 2013-09-17 2015-03-30 東レエンジニアリング株式会社 塗布装置および塗布方法

Also Published As

Publication number Publication date
TW201718107A (zh) 2017-06-01
CN106493041A (zh) 2017-03-15
KR20170029380A (ko) 2017-03-15

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