JP2016538727A - コンパクトな光電子モジュール - Google Patents
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Abstract
Description
本開示は、特に光近接センサモジュール、周囲光センサーとフラッシュモジュールなどの光電子モジュールに関する。
スマートフォンまたはその他のデバイスは、時々、光モジュール、センサーまたはカメラなどの小型化された光電子モジュールを含む。より一般的には、様々な光電子モジュールは、小型電子機器の幅広い範囲、とりわけ、バイオデバイス、移動ロボット、監視カメラ、ビデオカメラ、ラップトップコンピュータ、タブレットコンピュータなどに組み込まれてもよい。たとえば、光学式近接センサーは、物体の位置または場所を検出するために、携帯電話または他の携帯デバイスに設けられることができる。同様に、周囲光センサーは、たとえばディスプレイの明るさを調整するために、モバイルデバイスの周囲の光の状態を検出するために設けられることができる。フラッシュモジュールなどの発光モジュールもまた、設けられることができる。しかし、空間は、多くの場合、そのようなデバイスにおいて貴重である。したがって、可能な限り小さくかつコンパクトに光電子モジュールを作ることが望ましい。光近接センサーと周辺光センサーなどの小さな光電子モジュールを設計する際に発生する可能性があるその他の問題は、チャンネル間の光学的クロストークとモジュールによる迷光の検出とに関連する。遮光パッケージはまた、発光モジュールの光の漏れを避けることが望ましい。
非常に少ない光学的クロストークまたは迷光の検出を有しながら、いくつかの実装では、高さが低下されることができるコンパクトな光電子モジュールを説明する。
図1に示すように、モジュール20は、プリント回路基板(PCB)または他の支持基板24上に搭載される第1および第2の光電子デバイス22A、22Bを含む。図示の例では、第1の光電子デバイス22Aは、LED、IRLED、OLED、IRレーザーまたはVCSEL等の発光要素を含む。第2の光電子デバイス22Bは、発光デバイスによって光放射された1つまたは複数の波長の光(たとえば、赤外線)を検出するように構成されたフォトダイオード、CCDまたは他の光センサーとして光検出要素を含む。図示のモジュール20は、発光用に1つと光検出のための1つの2つのチャンネルを有するが、ここに記載される遮光パッケージング技術はまた、周囲光センサまたは発光モジュールのような単一のチャンネルモジュールのために使用されることもできる。
Claims (26)
- 光チャンネルを有する光電子モジュールであって、前記モジュールは、
特定の1つまたは複数の波長の光を放射または検出するように構成される光電子デバイスが取り付けられる支持体と、
前記光電子デバイス上の光透過部分を含むカバーとを備え、前記光透過部分は実質的に前記1つまたは複数の波長に対して非透過である前記カバーのセクションによって横方向に囲まれ、前記カバーは150μm以下の厚みを有し、前記モジュールはさらに、
前記光透過部分の表面上の受動光学要素と、
前記カバーから前記支持体を分離するスペーサーとを備える、光電子モジュール。 - 前記支持体と前記カバーと前記スペーサーとを合わせた高さは、750μm以下である、請求項1に記載の光電子モジュール。
- 前記カバーの前記非透過のセクションは、少なくとも片面に非透過材料のコーティングを有するPCB、ポリマーまたはセラミック層で構成される、請求項1または請求項2に記載の光電子モジュール。
- 前記コーティングの前記非透過材料は、金属またはポリマーである、請求項1から3のいずれか1項に記載の光電子モジュール。
- 前記PCB、ポリマーまたはセラミック層の両面上に非透過材料コーティングを含む、請求項1から4のいずれか1項に記載の光電子モジュール。
- 前記コーティングの前記厚みは、20μm以下である、請求項3から請求項5のいずれか1項に記載の光電子モジュール。
- 前記コーティングの前記厚みは、1μm以下である、請求項3から請求項5のいずれか1項に記載の光電子モジュール。
- 前記カバーの前記非透過のセクションは、PCB、ポリマーまたはセラミック材料の第1のおよび第2の層の間に挟まれる非透過材料で構成される、請求項1または請求項2に記載の光電子モジュール。
- 光電子デバイスは、赤外光を光放射するか、赤外光を検出するように操作可能である、請求項1から8のいずれか1項に記載の光電子モジュール。
- 発光または検出チャンネルを有する光電子モジュールであって、前記モジュールは、
発光または光検出要素が取り付けられる支持体と、
前記発光または光検出要素上の光透過部分を含むカバーとを備え、前記光透過部分は、前記発光または光検出要素によって光放射されるか検出可能である1つまたは複数の光の波長に対して実質的に非透過である前記カバーのセクションによって横方向に囲まれ、前記カバーの前記非透過のセクションは、非透過材料のコーティングを有するPCB、ポリマーまたはセラミック層で構成され、前記モジュールはさらに、
前記光透過部分の表面上のレンズと、
前記支持体を前記カバーから分離するスペーサーとを備える、光電子モジュール。 - 前記コーティングの前記非透過材料は、金属またはポリマーである、請求項10に記載の光電子モジュール。
- 前記モジュールの高さは、750μm以下である、請求項10または請求項11に記載の光電子モジュール。
- 複数の光電子モジュールを製造するためのウェハレベルの製造方法であって、前記方法は、
各々が特定の1つまたは複数の波長の光を放射または検出するように構成される複数の光電子デバイスが取り付けられる支持ウェハを提供することと、
前記1つまたは複数の波長に対して実質的に非透過であるセクションによって横方向に囲まれた光透過部分を含む光学ウェハを提供することとを備え、前記透過部分の各々はそれぞれ受動光学要素をその表面上に含み、前記非透過セクションは150μm以下の厚みを有し、前記方法はさらに、
ウェハスタックを形成するために前記支持体を前記光学ウェハにスペーサーを用いて取り付けることとを含む、方法。 - 各々が発光チャンネルおよび光検出チャンネルを含む複数の光電子モジュールへと前記ウェハスタックを分離することをさらに含む、請求項13に記載の方法。
- 前記支持体ウェハ、前記光学ウェハおよび前記スペーサーを合わせた高さは、750μm以下である、請求項13または請求項14に記載の方法。
- 前記光学ウェハの前記非透過セクションは、少なくとも片面に非透過材料のコーティングを有するPCB、ポリマーまたはセラミック層から構成される、請求項13から請求項15のいずれか1項に記載の方法。
- 前記コーティングの前記非透過材料は、金属またはポリマーである、請求項16に記載の方法。
- 前記PCB、ポリマーまたはセラミック層の両面は、非透過材料のコーティングを含む、請求項16または請求項17に記載の方法。
- 前記コーティングの前記厚みは20μm以下である、請求項16から請求項18のいずれか1項に記載の方法。
- 前記コーティングの前記厚みは、1μm以下である、請求項16から請求項18のいずれか1項に記載の方法。
- 前記光学ウェハの前記非透過セクションは、PCB、ポリマーまたはセラミック材料の第1のおよび第2の層の間に挟まれた非透過金属またはポリマー材料で構成される、請求項13に記載の方法。
- 発光チャンネルおよび光検出チャンネルを有する光電子モジュールであって、前記モジュールは、
発光要素および光検出要素が取り付けられる支持体と、
前記発光デバイス上の第1の光透過部分および前記光検出デバイス上の第2の光透過部分を含むカバーとを備え、前記光透過部分は、前記発光デバイスによって光放射され、前記光検出デバイスによって検出可能である1つまたは複数の波長の光に対して実質的に非透過である前記カバーのセクションによって横方向に囲まれ、前記カバーの前記非透過のセクションは、非透過材料のコーティングを有するPCB、ポリマーまたはセラミック層で構成され、前記モジュールはさらに、
前記第1の光透過部分の表面上のレンズおよび前記第2の光透過部分の表面上のレンズと、
前記支持体を前記カバーから分離するスペーサーとを備える、光電子モジュール。 - 前記カバーは150μm以下の厚みを有し、前記コーティングは、20μm以下の厚みを有する、請求項22に記載の光電子モジュール。
- 前記コーティングは、金属またはポリマーを備える、請求項22から請求項23のいずれか1項に記載の光電子モジュール。
- 前記モジュールは、750μm以下の高さを有する、請求項22から請求項24のいずれか1項に記載の光電子モジュール。
- 前記コーティングは、銅、クロム、ポリメチルメタクリレート、フェノールホルムアルデヒド樹脂、およびエポキシ樹脂ベースのフォトレジストからなるグループから選択される材料で構成される、請求項22から請求項25のいずれか1項に記載の光電子モジュール。
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