JP2016534344A5 - - Google Patents

Download PDF

Info

Publication number
JP2016534344A5
JP2016534344A5 JP2016535373A JP2016535373A JP2016534344A5 JP 2016534344 A5 JP2016534344 A5 JP 2016534344A5 JP 2016535373 A JP2016535373 A JP 2016535373A JP 2016535373 A JP2016535373 A JP 2016535373A JP 2016534344 A5 JP2016534344 A5 JP 2016534344A5
Authority
JP
Japan
Prior art keywords
frequency
signal
sample
specific
phase shift
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016535373A
Other languages
English (en)
Japanese (ja)
Other versions
JP6616302B2 (ja
JP2016534344A (ja
Filing date
Publication date
Priority claimed from EP13181506.0A external-priority patent/EP2840387A1/en
Application filed filed Critical
Publication of JP2016534344A publication Critical patent/JP2016534344A/ja
Publication of JP2016534344A5 publication Critical patent/JP2016534344A5/ja
Application granted granted Critical
Publication of JP6616302B2 publication Critical patent/JP6616302B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016535373A 2013-08-23 2014-05-30 ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム Active JP6616302B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13181506.0A EP2840387A1 (en) 2013-08-23 2013-08-23 Lock-in thermography method and system for hot spot localization
EP13181506.0 2013-08-23
PCT/EP2014/061232 WO2015024679A1 (en) 2013-08-23 2014-05-30 Lock-in thermography method and system for hot spot localization

Publications (3)

Publication Number Publication Date
JP2016534344A JP2016534344A (ja) 2016-11-04
JP2016534344A5 true JP2016534344A5 (OSRAM) 2017-08-17
JP6616302B2 JP6616302B2 (ja) 2019-12-04

Family

ID=49000875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016535373A Active JP6616302B2 (ja) 2013-08-23 2014-05-30 ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム

Country Status (7)

Country Link
US (1) US20160202126A1 (OSRAM)
EP (1) EP2840387A1 (OSRAM)
JP (1) JP6616302B2 (OSRAM)
DE (1) DE112014003881T5 (OSRAM)
SG (1) SG11201600524YA (OSRAM)
TW (1) TWI563251B (OSRAM)
WO (1) WO2015024679A1 (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014218136B4 (de) * 2014-09-10 2019-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermographische Untersuchungseinrichtung sowie Verfahren zur zerstörungsfreien Untersuchung einer oberflächennahen Struktur an einem Prüfobjekt
CN104776918B (zh) * 2015-03-30 2018-06-08 中国人民解放军第二炮兵工程大学 一种相位提取方法
CN104916120B (zh) * 2015-06-12 2018-11-06 深圳市共进电子股份有限公司 一种智能红外发射设备的自动化生产测试系统及方法
EP3282249A1 (de) 2016-08-09 2018-02-14 Saint-Gobain Glass France Verfahren und vorrichtung zur detektion von gasen in kunststoffschichten durch lock-in-infrarotthermographie
JP2018096776A (ja) * 2016-12-12 2018-06-21 国立研究開発法人産業技術総合研究所 導電材料の内部構造、電流分布、抵抗分布を可視化する装置と方法
JP2019193417A (ja) * 2018-04-24 2019-10-31 学校法人日本大学 領域抽出装置
US10607104B1 (en) * 2019-01-31 2020-03-31 Raytheon Company System and method for detecting daytime solar glint using multi-band mid-wave infrared imagery
JP7554052B2 (ja) * 2020-01-31 2024-09-19 浜松ホトニクス株式会社 半導体故障解析装置
CN111665403B (zh) * 2020-04-29 2022-12-23 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) 层叠型电子元件的失效点定位方法、装置和系统
CN115552261A (zh) 2020-05-26 2022-12-30 浜松光子学株式会社 半导体器件检查方法及半导体器件检查装置
EP4148437B1 (en) * 2020-05-26 2025-12-03 Hamamatsu Photonics K.K. Semiconductor device inspection method and semiconductor device inspection device
CN111898333B (zh) * 2020-06-24 2021-12-10 北京智芯仿真科技有限公司 集成电路频率响应频率点提取与响应曲线计算方法及装置
ES2932781A1 (es) * 2021-07-19 2023-01-25 Consejo Superior Investigacion Metodo para la medida cuantitativa de temperatura
US20250076231A1 (en) * 2022-03-15 2025-03-06 Nippon Telegraph And Telephone Corporation Monitoring device
CN114858285A (zh) * 2022-04-02 2022-08-05 电子科技大学 一种线性调频红外无损检测系统
CN115541653A (zh) * 2022-12-02 2022-12-30 山东大学 一种3d系统级封装器件的缺陷定位方法及系统
CN117538378B (zh) * 2023-11-24 2024-06-28 山东大学 一种基于方波热源的锁相热成像缺陷快速检测方法
CN119290952A (zh) * 2024-08-29 2025-01-10 北京微电子技术研究所 一种叠层封装半导体器件缺陷检测与定位方法、系统
CN119827576B (zh) * 2024-11-25 2025-10-17 江苏大学 一种基于调频式红外热成像检测复合材料内部缺陷深度的方法
CN120992693A (zh) * 2025-10-22 2025-11-21 天津滨海雷克斯激光科技发展有限公司 一种基于脉冲激光的熔覆层表面及深层瑕疵检测方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4792683A (en) * 1987-01-16 1988-12-20 Hughes Aircraft Company Thermal technique for simultaneous testing of circuit board solder joints
JP2758488B2 (ja) * 1990-07-25 1998-05-28 周次 仲田 電子部品の接合部検査装置
DE19837889C1 (de) * 1998-08-20 2000-12-21 Siemens Ag Thermowellen-Meßverfahren
US6394646B1 (en) * 1999-04-16 2002-05-28 General Electric Company Method and apparatus for quantitative nondestructive evaluation of metal airfoils using high resolution transient thermography
US7709794B2 (en) * 2008-02-05 2010-05-04 Kla-Tencor Corporation Defect detection using time delay lock-in thermography (LIT) and dark field LIT
US8742347B2 (en) * 2010-06-08 2014-06-03 Dcg Systems, Inc. Three-dimensional hot spot localization
TWI460422B (zh) * 2010-10-22 2014-11-11 Dcg Systems Inc 從裝置一側作鎖相熱雷射激發並從另一側取得鎖相熱發散影像

Similar Documents

Publication Publication Date Title
JP2016534344A5 (OSRAM)
JP6616302B2 (ja) ホットスポット位置特定のためのロックインサーモグラフィ方法およびシステム
EP2952884B1 (en) Method for examination of a sample by means of the lock-in thermography
Chatterjee et al. A comparison of the pulsed, lock-in and frequency modulated thermography nondestructive evaluation techniques
Tuli et al. Defect detection by pulse compression in frequency modulated thermal wave imaging
WO2015027210A1 (en) Lit method and system for determining material layer parameters of a sample
JP2017176341A5 (OSRAM)
Lin et al. Fourier analysis on transient imaging with a multifrequency time-of-flight camera
Ghadermazi et al. Delamination detection in glass–epoxy composites using step-phase thermography (SPT)
KR101290137B1 (ko) 열화상을 이용한 결함 검출 장치 및 검출 방법
JP2016534347A (ja) Litでホットスポットを解像するための方法およびシステム
Olafsson et al. Lock-in thermography using miniature infra-red cameras and integrated actuators for defect identification in composite materials
CN103901073A (zh) 一种基于移相调频的光热成像检测方法
JP2014136012A5 (ja) 被検体情報取得装置、表示制御方法、およびプログラム
Suresh et al. Subsurface detail fusion for anomaly detection in non-stationary thermal wave imaging
JP6865927B2 (ja) 検査装置、検査方法、検査プログラム、記憶媒体、および検査システム
Chatterjee et al. Image enhancement in transient lock-in thermography through time series reconstruction and spatial slope correction
JP2014158548A5 (ja) 被検体情報取得装置および画像生成方法
Rajic et al. An investigation of noise performance in optical lock-in thermography
Chatterjee et al. A novel pulse compression algorithm for frequency modulated active thermography using band-pass filter
KR101528200B1 (ko) 3차원 열영상 측정 장치 및 방법
JP6568691B2 (ja) 探傷対象物の内部欠陥を検出する探傷システム、及び探傷方法
CA3022092A1 (en) Sample holder and lock-in thermography system
JP2014032160A (ja) 探傷方法及び探傷装置
RU2013139427A (ru) Способ оценки различия теплофизических параметров видимой поверхности изотропного объекта с учетом фона