JP2016526292A - Apparatus and method for coating a substrate - Google Patents
Apparatus and method for coating a substrate Download PDFInfo
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- JP2016526292A JP2016526292A JP2016514308A JP2016514308A JP2016526292A JP 2016526292 A JP2016526292 A JP 2016526292A JP 2016514308 A JP2016514308 A JP 2016514308A JP 2016514308 A JP2016514308 A JP 2016514308A JP 2016526292 A JP2016526292 A JP 2016526292A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/002—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour incorporating means for heating or cooling, e.g. the material to be sprayed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
- B05D3/048—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas for cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0486—Operating the coating or treatment in a controlled atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0426—Cooling with air
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本発明は、少なくとも１つのコーティング成分と、少なくとも１つの溶剤とを有するコーティング材料によって、基板（９）の表面（９ｏ）をコーティングする装置であって、特に周囲環境よりも低圧になるように調整可能な、圧力が印加されるチャンバ（７）と、前記基板（９）を収容面（１２）の上に収容するための収容装置（８）と、前記基板（９）をコーティングするためのスプレーノズル（１１）とを備える装置において、前記装置は、前記収容装置（８）の前記収容面（１２）の上に収容された前記基板（９）の少なくとも前記表面（９ｏ）を冷却するための冷却手段を有することを特徴とする装置に関する。本発明はさらに、対応する方法に関する。The present invention is an apparatus for coating a surface (9o) of a substrate (9) with a coating material having at least one coating component and at least one solvent, and is particularly adapted to be at a lower pressure than the surrounding environment Possible pressure-applied chamber (7), receiving device (8) for receiving said substrate (9) on receiving surface (12), spray for coating said substrate (9) In the device comprising a nozzle (11), the device is for cooling at least the surface (9o) of the substrate (9) housed on the housing surface (12) of the housing device (8). The present invention relates to an apparatus having cooling means. The invention further relates to a corresponding method.
Description
本発明は、請求項１に記載された基板の表面をコーティングする方法と、請求項８に記載された対応する方法とに関する。
The invention relates to a method for coating the surface of a substrate as claimed in
スプレー塗布装置においてウェハをコーティングする場合には、今日では非常に面積が大きくなった例えば直径３００ｍｍのウェハの上に、コーティング、特にレジストを均一に被着させるという課題が存在する。パターニング済みの基板を均一にコーティングすることは、特に困難であることが判明している。 In the case of coating a wafer in a spray coating apparatus, there is a problem of uniformly depositing a coating, particularly a resist, on a wafer having a very large area, for example, 300 mm in diameter. It has proven particularly difficult to uniformly coat a patterned substrate.
従って、本発明の基礎となる課題は、均一なコーティングが実現される、基板をコーティングする装置及び方法を提供することである。 Accordingly, the problem underlying the present invention is to provide an apparatus and method for coating a substrate in which a uniform coating is achieved.
この課題は、請求項１及び８に記載の特徴によって解決される。本発明の有利な実施形態は、従属請求項に記載されている。明細書、特許請求の範囲、及び／又は図面に示された複数の特徴のうちの少なくとも２つからなる全ての組み合わせも、本発明の範囲に含まれる。数値範囲が記載されている場合には、記載された範囲内にある値も制限値として開示すべきであり、また、任意の組み合わせで特許請求すべきである。
This problem is solved by the features of
本発明は、パターニング済みの表面にできるだけ均一にスプレー塗布された層を堆積させることができる装置及び方法を開示する。この均一性は、一般的には全てのパラメータ、すなわち膜厚や化学組成等に関連しているが、以下ではこの均一性を、とりわけ膜厚に関連するものとする。本発明の１つの発見は、コーティング成分、特にレジストは、溶剤による希釈が必要であるが故に、比較的“流動性が高い”ということにある。溶剤は、粘性のコーティング成分を噴霧するために使用される。この溶剤は、遅くとも蒸発する際に、多かれ少なかれ粗面を生じさせる可能性がある。本発明は、この発見を利用して、スプレー塗布においてできるだけ均一な表面を形成するために、コーティング材料の相転移を特に圧力制御及び／又は温度制御によって所期のように適用する。 The present invention discloses an apparatus and method that can deposit a sprayed layer as uniformly as possible on a patterned surface. This uniformity is generally related to all parameters, i.e. film thickness, chemical composition, etc., but in the following, this uniformity is particularly related to film thickness. One discovery of the present invention is that coating components, particularly resists, are relatively “highly fluid” because they require dilution with a solvent. Solvents are used to spray viscous coating components. This solvent can cause more or less rough surfaces when it evaporates at the latest. The present invention takes advantage of this discovery to apply the phase transition of the coating material as desired, in particular by pressure control and / or temperature control, in order to form as uniform a surface as possible in spray application.
使用される溶剤は、一般的にはレジストごとに異なり、一般的には有機溶剤である。本発明における好ましい溶剤は、
・ＰＧＭＥＡ
・ジエチルエーテル
・イソプロパノール
・ヘキサフルオロエタン
・メシチレン
・エタノール
・プロパノール
・アセトン
・水
である。
The solvent used is generally different for each resist and is generally an organic solvent. Preferred solvents in the present invention are
・ PGMEA
Diethyl ether, isopropanol, hexafluoroethane, mesitylene, ethanol, propanol, acetone, water.
本発明の利点は、スプレー塗布によって均一な、好ましくは平滑な表面を形成することができる簡単で穏やかな低コストかつ効果的な方法が提供されることである。 An advantage of the present invention is that it provides a simple, gentle, low cost and effective method that can form a uniform, preferably smooth, surface by spray application.
相は、化学的特性及び物理的特性がほぼ同じである均一な領域として理解され、相境界によって他の相から隔離されている。 A phase is understood as a uniform region where the chemical and physical properties are approximately the same and is separated from the other phases by phase boundaries.
成分は、熱力学的な考察において物理的及び化学的にこれ以上分割できない単位であるとして理解される。成分の例は、周期律表の元素、又は、水、エタン、プロパン、ブタン、ジエチルエーテルのような分子、又は、タンパク質のような高分子とされうる。従って、以下で考察される溶剤と、溶剤中に溶解した物質、本発明によれば特にレジストとを、成分であるとみなすことができる。 Ingredients are understood as units that cannot be further divided physically and chemically in thermodynamic considerations. Examples of components can be elements of the periodic table, or molecules such as water, ethane, propane, butane, diethyl ether, or macromolecules such as proteins. Therefore, the solvent discussed below and the substance dissolved in the solvent, in particular the resist according to the invention, can be regarded as components.
相図は、複数の異なるパラメータ、特に熱力学的パラメータの関数として、特に圧力と温度の関数として、各相の存在領域を表したものであると理解される。 The phase diagram is understood to represent the region of existence of each phase as a function of several different parameters, in particular thermodynamic parameters, in particular as a function of pressure and temperature.
単一成分系の各相の存在領域を、圧力・温度図に示す。図１は、適度な温度及び適度な圧力の場合における、本発明による任意の溶剤の単一成分系の圧力・温度相図を記号によって示す。 The existence region of each phase of the single component system is shown in the pressure / temperature diagram. FIG. 1 symbolically shows the pressure-temperature phase diagram of a single component system of any solvent according to the present invention at moderate temperature and moderate pressure.
以下で考察される各系、すなわち溶剤と、溶剤中に溶解した物質の、極端な低温、極端な高温、及び、極端な高圧の場合における挙動は、本発明では考慮されない。従って、圧力・温度相図は、特に三重点Ｔを中心にして示される。固相（ｓ：英語のsolid）と、液相（ｌ：英語のliquid）と、気相（ｇ：英語のgaseous）の３つの相領域は、圧力・温度特性曲線によって互いに離隔される。曲線１は、固相の相存在領域を気相の相存在領域から分離するいわゆる昇華曲線又は再昇華曲線である。曲線２は、液相と気相とが互いに平衡状態にある全ての圧力・温度の組み合わせの集合を表した蒸発曲線又は凝縮曲線である。曲線３は、融解曲線又は凝固曲線である。各曲線上では常に２つの相が熱力学的な平衡状態にある。
The behavior of each system discussed below, namely the solvent and the substance dissolved in the solvent, at extremely low temperatures, extremely high temperatures, and extremely high pressures is not considered in the present invention. Therefore, the pressure / temperature phase diagram is shown with the triple point T as the center. The three phase regions of the solid phase (s: English solid), the liquid phase (l: English liquid), and the gas phase (g: English gasaseous) are separated from each other by a pressure / temperature characteristic curve.
幾つかの物質の三重点に関して、以下の典型的な温度値及び圧力値を開示する：
・ジエチルエーテル（１５６．９３Ｋ）
・アセトン（１７８．８６Ｋ）
・イソプロパノール（１８４．９６Ｋ）
・ヘキサフルオロエタン（１７３．０８Ｋ，２６．６０ｋＰａ）
・水（２７３．１６Ｋ，０．６１１７ｋＰａ）。
For the triple points of some materials, the following typical temperature and pressure values are disclosed:
・ Diethyl ether (156.93K)
Acetone (178.86K)
Isopropanol (184.96K)
・ Hexafluoroethane (173.08K, 26.60kPa)
-Water (273.16K, 0.6117kPa).
従って、コーティングすべき基板を収容するための収容装置の少なくとも収容面における本発明による好ましい温度範囲は、３００Ｋと０Ｋの間にあり、好ましくは２７５Ｋと０Ｋの間にあり、さらに好ましくは２５０Ｋと０Ｋの間にあり、よりさらに好ましくは２００Ｋと０Ｋの間にあり、最も好ましくは１５０Ｋと０Ｋの間にある。冷却は、電気的にペルチェ素子によって実施することができ、又は、冷却手段、特に冷却液及び／又は冷却ガスによって実施することができる。収容装置の加熱が必要な場合には、この加熱を電気的に実施することが好ましい。 Therefore, the preferred temperature range according to the invention at least on the receiving surface of the receiving device for receiving the substrate to be coated is between 300K and 0K, preferably between 275K and 0K, more preferably 250K and 0K. More preferably between 200K and 0K, most preferably between 150K and 0K. The cooling can be carried out electrically by Peltier elements, or can be carried out by cooling means, in particular cooling liquid and / or cooling gas. When heating of the storage device is necessary, it is preferable to perform this heating electrically.
本装置の本発明による圧力が印加されうる（スプレー塗布）チャンバの好ましい圧力動作範囲は、１０５Ｐａと１Ｐａの間にあり、好ましくは１０４Ｐａと１Ｐａの間にあり、さらに好ましくは１０３Ｐａと１Ｐａの間にあり、最も好ましくは１０２Ｐａと１Ｐａの間にある。 The preferred pressure operating range of the chamber to which the pressure according to the invention of the device can be applied (spray application) is between 10 5 Pa and 1 Pa, preferably between 10 4 Pa and 1 Pa, more preferably 10 3. It is between Pa and 1 Pa, most preferably between 10 2 Pa and 1 Pa.
従って、単一成分系の場合には、圧力・温度相図において厳密に１つの点、すなわち３つの相全てが互いに熱力学的平衡にある１つの圧力・温度の組み合わせが存在する。この点は、三重点Ｔと呼ばれる。 Thus, in the case of a single component system, there is exactly one point in the pressure / temperature phase diagram, ie, one pressure / temperature combination in which all three phases are in thermodynamic equilibrium with each other. This point is called the triple point T.
以下、二成分系について簡略的に考察する。二成分系は、第１成分である溶剤を含み、この第１成分は過剰に、つまり過多に存在する。第２成分は、コーティング成分、つまり溶剤中に溶解した物質であり、本発明によれば好ましくはレジストである。第２成分の導入により、圧力・温度・濃度図でしか熱力学系を完全かつ正確に表せないということは明白である。しかしながら、本発明においては溶剤の物理的特性及び化学的特性しか考慮しないという事実に基づき、本発明を説明するために、溶質の溶解後における変化した圧力・温度相図で十分である（図２）。 Hereinafter, the two-component system will be briefly considered. The two-component system includes a solvent that is a first component, and this first component is present in excess, that is, in excess. The second component is a coating component, ie a substance dissolved in a solvent, and is preferably a resist according to the present invention. It is clear that by introducing the second component, the thermodynamic system can be expressed completely and accurately only by the pressure / temperature / concentration diagram. However, based on the fact that the present invention only considers the physical and chemical properties of the solvent, a modified pressure-temperature phase diagram after dissolution of the solute is sufficient to illustrate the present invention (FIG. 2). ).
溶剤に溶質が添加されると溶剤の相平衡境界が変化し、この溶剤は、このときには二成分系、つまり二元系となっている（図２）。或る特定の圧力における沸点の上昇は、沸点上昇と呼ばれる。この沸点上昇は一般的に、沸騰曲線２に沿った全ての圧力範囲に該当するので、溶質が添加されると純粋な溶剤の沸点は右へとシフトする。従って、凝固曲線３に沿って凝固点降下が生じる。すなわち溶質の溶解によって、圧力が一定の場合、溶剤の凝固点がより低温へとシフトする。
When a solute is added to the solvent, the phase equilibrium boundary of the solvent changes, and this solvent is now a binary system, that is, a binary system (FIG. 2). The increase in boiling point at a certain pressure is called boiling point increase. This boiling point rise generally corresponds to the entire pressure range along the
或る特定の温度における蒸気圧の降下は、蒸気圧降下と呼ばれる。蒸気圧降下と、沸点上昇又は凝固点降下とは互いに正比例することが多い。沸点上昇、凝固点降下、及び蒸気圧降下は、専ら濃度にのみ依存し、溶質の種類には依存しない。物質が自身の化学的性質に依存せずに、自身の量のみによって第２の物質の物理的特性及び／又は化学的特性を変化させるという性質は、束一的性質と呼ばれる。 The drop in vapor pressure at a particular temperature is called the vapor pressure drop. Vapor pressure drop and boiling point rise or freezing point depression are often directly proportional to each other. The boiling point rise, freezing point drop, and vapor pressure drop depend solely on the concentration and not on the type of solute. The property that a material changes the physical and / or chemical properties of a second material only by its own amount without depending on its own chemical properties is called a bundled property.
溶質の束一的性質によって決定された圧力・温度相図は、本発明による（スプレー塗布）方法のための基礎として考慮される。 The pressure-temperature phase diagram determined by the solute bundle properties is considered as the basis for the (spray coating) method according to the present invention.
工業分野では今日まで専ら、溶剤とレジストとからなる溶液を液体の状態で噴霧して、適度な温度及び適度な圧力において基板上に被着させるスプレー塗布装置のみが稼働されている。図３は、今日におけるスプレー塗布装置のプロセス範囲Ｂ（コーティング、特にレジスト塗布）を示す。温度及び／又は圧力は非常に可変的であり、実際に非常によく変化する。しかしながら、溶剤・レジストの二成分系は、常に液体の状態にある。このような液体の状態は、相応にして低粘性を引き起こす。この低粘性は、特に溶剤によって引き起こされる。本来のスプレー工程中にも既に、溶剤の少なからぬ部分が蒸発する。 Until now, in the industrial field, only a spray coating apparatus for spraying a solution composed of a solvent and a resist in a liquid state and depositing the solution on a substrate at an appropriate temperature and an appropriate pressure has been operated. FIG. 3 shows the process range B (coating, in particular resist application) of today's spray applicators. The temperature and / or pressure is very variable and actually varies very well. However, the solvent / resist two-component system is always in a liquid state. Such a liquid state correspondingly causes a low viscosity. This low viscosity is caused in particular by solvents. Even during the original spraying process, a considerable part of the solvent evaporates.
プロセス範囲Ｂ内における本来のスプレー塗布工程の後、基板は、専用に設けられたホットプレートの上で、又は、加熱可能なサンプルホルダの直に上で熱処理される。この熱処理４は、溶剤の蒸発を加速するために使用される。蒸発させるべき溶剤が、表面を覆っている本来関心があるレジストよりも高い揮発性、すなわちより高い蒸気圧を有していることが好ましい。溶剤及び熱を連続的に除去することにより、レジストは部分的に硬化する。レジストの種類の中には、より高温で実施される追加的な熱処理工程を実施することが可能なものもある。 After the original spray application step in process area B, the substrate is heat-treated on a dedicated hot plate or directly on a heatable sample holder. This heat treatment 4 is used to accelerate the evaporation of the solvent. It is preferred that the solvent to be evaporated has a higher volatility, i.e. a higher vapor pressure, than the resist of natural interest covering the surface. By continuously removing solvent and heat, the resist is partially cured. Some resist types are capable of performing additional heat treatment steps performed at higher temperatures.
この種のスプレー塗布における重大な欠点は、レジストの溶剤が蒸発する前に、また場合によっては蒸発の最中にも、液状の溶剤の高い流動性に起因してレジストの表面上に粗面が形成されてしまうことである。 A serious disadvantage of this type of spray application is that the rough surface on the resist surface is caused by the high fluidity of the liquid solvent before the solvent of the resist evaporates and in some cases even during evaporation. It will be formed.
本発明の技術思想は、溶剤中に溶解したレジストを、表面上に、特にパターニング済みの基板の表面上に、特にウェハの表面上に、液体の状態で被着させるのではなく、既にコーティング中において、特にスプレー塗布中において、又は、コーティング材料が基板の表面に衝突している間に、レジストを特に急激に凍結させるということに基づく（図４）。 The technical idea of the present invention is that the resist dissolved in the solvent is not already deposited in the liquid state on the surface, in particular on the surface of the patterned substrate, in particular on the surface of the wafer, but already in coating. In particular, it is based on the fact that the resist freezes particularly rapidly during spray application or while the coating material strikes the surface of the substrate (FIG. 4).
本発明の実施形態は、基板を収容可能であると同時に、特に基板を冷却可能でもあるサンプルホルダが設けられた、特別なチャンバにおいて実施される。このスプレーチャンバはさらに、オプションとして真空チャンバとして構成されており、この真空チャンバでは、特に本発明による制御装置を用いて、少なくとも本発明による相転移に関連した圧力範囲内に圧力を調節することが可能である。 Embodiments of the present invention are implemented in a special chamber provided with a sample holder that can accommodate a substrate and at the same time be capable of cooling the substrate. The spray chamber is further optionally configured as a vacuum chamber in which the pressure can be adjusted at least within the pressure range associated with the phase transition according to the invention, in particular using the control device according to the invention. Is possible.
本発明のプロセスフローを、図４の圧力・温度相図に示す。コーティング材料がまだ液体の状態であるコーティング領域Ｂ’から出発して、冷却されたサンプルホルダの表面にコーティング材料が衝突すると、急激な凍結が生じる（５）。本発明によれば、急激に凍結（５）することによって、溶剤中に溶解されたレジストは、熱運動による粗面の形成が不可能となる。 The process flow of the present invention is shown in the pressure / temperature phase diagram of FIG. Starting from the coating region B ', where the coating material is still in a liquid state, when the coating material strikes the surface of the cooled sample holder, rapid freezing occurs (5). According to the present invention, by rapidly freezing (5), the resist dissolved in the solvent cannot be roughened by thermal motion.
本発明によるさらなるステップ（６）において、コーティング材料に含まれた溶剤は、特にコーティング成分の蒸発が生じることなく、低温で穏やかに気体の状態へと昇華転移する。好ましくは、これらのプロセスパラメータにおける溶剤の蒸気圧は、溶剤中に溶解したコーティング成分の蒸気圧よりも少なくとも１．００１倍大きく、好ましくは少なくとも２倍大きく、さらに好ましくは１０倍大きく、よりさらに好ましくは１００倍大きく、最も好ましくは１０００倍大きい。溶剤の穏やかな昇華と低い温度とによって、コーティング材料のコーティング成分はますます凝縮する。なぜなら溶剤が徐々に蒸発するからである。レジストはますます沈積していき、或る特定の時点を経過すると全ての溶剤が蒸発する。 In a further step (6) according to the invention, the solvent contained in the coating material undergoes a sublimation transition to the gaseous state gently at low temperatures without in particular the evaporation of the coating components. Preferably, the vapor pressure of the solvent at these process parameters is at least 1.001 times greater than the vapor pressure of the coating components dissolved in the solvent, preferably at least 2 times greater, more preferably 10 times greater, even more preferably. Is 100 times larger, most preferably 1000 times larger. Due to the mild sublimation of the solvent and the low temperature, the coating components of the coating material are increasingly condensed. This is because the solvent gradually evaporates. The resist is increasingly deposited and all the solvent evaporates after a certain point in time.
本発明によれば、対応する（スプレー塗布）チャンバは、特に冷却可能な（冷却手段）サンプルホルダと、当該チャンバの真空化可能な真空密のケーシングとからなる。実現可能な真空は、特に１０−１ｍｂａｒ未満であり、好ましくは１０−３ｍｂａｒ未満であり、さらに好ましくは１０−５ｍｂａｒ未満であり、よりさらに好ましくは１０−７ｍｂａｒ未満であり、最も好ましくは１０−９ｍｂａｒ未満である。 According to the invention, the corresponding (spray application) chamber consists in particular of a sample holder that can be cooled (cooling means) and a vacuum-tight casing in which the chamber can be evacuated. Achievable vacuum is in particular less than 10 −1 mbar, preferably less than 10 −3 mbar, more preferably less than 10 −5 mbar, even more preferably less than 10 −7 mbar, most preferably Is less than 10 −9 mbar.
サンプルホルダは、特に以下に記載したいずれか一種類のサンプルホルダとすることができる：
・真空式サンプルホルダ
・静電気式サンプルホルダ
・磁気式サンプルホルダ
・機械式クランプを備えるサンプルホルダ
・接着面を備えるサンプルホルダ。
The sample holder can in particular be any one of the sample holders described below:
・ Vacuum sample holder ・ Electrostatic sample holder ・ Magnetic sample holder ・ Sample holder with mechanical clamp ・ Sample holder with adhesive surface
上述した実施形態と組み合わせることができる特別な１つの実施形態では、ウェハの表面を、コーティングの直前及び／又は最中に、冷却ノズル（冷却手段）を介して冷温ガスによって冷却することも可能である。このことは、基板全体を冷却する必要がなく、レジストが噴き付けられる前に基板の表面が短時間かつ非常に局地的に冷却されるという利点を有しうる。このためには、気化した液体窒素又はヘリウムを使用することが好ましい。全体の工程は、特にソフトウェアによってサポートされた外部の制御装置によって制御及び最適化される。コーティング装置（特にスプレー塗布装置）の、当業者に知られた全ての基本的な性能は、本発明によるプロセスの使用によって影響されることはない。スプレーノズルによる溶解したレジストの被着方法、すなわち被着の速度、動作は、変更せずに維持することができる。 In one particular embodiment that can be combined with the embodiments described above, the surface of the wafer can also be cooled by a cold gas via a cooling nozzle (cooling means) immediately before and / or during the coating. is there. This can have the advantage that the entire substrate need not be cooled and the surface of the substrate can be cooled very quickly and very locally before the resist is sprayed. For this purpose, it is preferable to use vaporized liquid nitrogen or helium. The entire process is controlled and optimized by an external control device, in particular supported by software. All basic performances known to the person skilled in the art of coating equipment (especially spray applicators) are not affected by the use of the process according to the invention. The method of depositing the dissolved resist by the spray nozzle, that is, the deposition speed and operation can be maintained without change.
本発明による（スプレー塗布）チャンバ内には、特に少なくとも収容面において温度調整可能な収容装置が設けられている。この収容装置の調整可能な温度範囲は、好ましくは−２００℃と４００℃の間にあり、さらに好ましくは−２００℃と２００℃の間にあり、よりさらに好ましくは−２００℃と０℃の間にある。 In the (spray application) chamber according to the invention, a housing device is provided which can be temperature-adjusted at least on the housing surface. The adjustable temperature range of the containment device is preferably between -200 ° C and 400 ° C, more preferably between -200 ° C and 200 ° C, even more preferably between -200 ° C and 0 ° C. It is in.
本発明のさらなる利点、特徴、及び詳細は、図面に基づく好ましい実施例に関する以下の説明から明らかとなる。 Further advantages, features and details of the invention will become apparent from the following description of a preferred embodiment based on the drawings.
図１から４は、上述した本発明の概要にて説明済みである。 1 to 4 have been described in the outline of the present invention described above.
図５は、温度調節可能な、特に冷却可能な収容装置８を備える真空化可能なチャンバ７の概略図を示す。収容装置８の収容面１２の上には、基板９（特にウェハ）が配置されている。収容装置８の上側では、スプレーノズル１１及び（オプションの）冷却ノズル１０が保持装置１３に取り付けられている。スプレーノズル１１及び冷却ノズル１０は、図示されていない制御装置によって、好ましくは互いに独立して開ループ／閉ループ制御することができ、コーティングすべき基板９の表面９ｏ全体に到達することができる。
FIG. 5 shows a schematic view of a
１ 昇華曲線又は再昇華曲線
２ 蒸発曲線又は凝縮曲線
３ 融解又は凝固曲線
４ 熱処理
５ 凍結
６ 昇華転移
７ チャンバ
８ 収容装置
９ 基板
９ｏ 表面
１０ 冷却ノズル
１１ スプレーノズル
１２ 収容面
１３ 保持装置
ｓ 固相
ｌ 液相
ｇ 気相
Ｂ コーティング
Ｂ’コーティング
DESCRIPTION OF
Claims (11)
・特に周囲環境よりも低圧になるように調整可能な、圧力が印加されうるチャンバ（７）と、
・前記基板（９）を収容面（１２）の上に収容するための収容装置（８）と、
・前記基板（９）をコーティングするためのスプレーノズル（１１）と
を備える装置において、
前記装置は、前記収容装置（８）の前記収容面（１２）の上に収容された前記基板（９）の少なくとも前記表面（９ｏ）を冷却するための冷却手段を有する
ことを特徴とする、装置。 An apparatus for coating a surface (9o) of a substrate (9) with a coating material having at least one coating component and at least one solvent,
A chamber (7) to which pressure can be applied, which can be adjusted in particular to be lower than the surrounding environment;
A housing device (8) for housing the substrate (9) on the housing surface (12);
An apparatus comprising a spray nozzle (11) for coating the substrate (9);
The apparatus has a cooling means for cooling at least the surface (9o) of the substrate (9) accommodated on the accommodation surface (12) of the accommodation apparatus (8), apparatus.
ことを特徴とする、請求項１記載の装置。 Device according to claim 1, characterized in that the cooling means comprise at least one cooling nozzle (10) and / or a containment device (8) capable of cooling at least in the containment surface (12). .
ことを特徴とする、請求項２記載の装置。 3. A device according to claim 2, characterized in that the cooling nozzle (10) is or can be arranged above the receiving surface (12).
前記制御装置によって前記スプレーノズル（１１）と前記冷却手段とを、特に別個に制御可能である
ことを特徴とする、請求項１から３のいずれか一項記載の装置。 The device comprises a control device, in particular supported by software;
4. The device according to claim 1, wherein the spray nozzle (11) and the cooling means can be controlled in particular separately by the control device.
ことを特徴とする、請求項４記載の装置。 The cooling means is controlled by the controller so that at least the surface (9o) of the substrate (9) has a temperature below the phase transition temperature from the liquid phase to the solid phase of the coating material during the coating. The device according to claim 4, wherein:
ことを特徴とする、請求項４又は５記載の装置。 After the coating, especially if the temperature is approximately unchanged, the phase of the coating component from the solid phase to the gas phase is reached, while the solvent solid phase to gas phase boundary is exceeded. 6. A device according to claim 4 or 5, characterized in that the pressure application means controlled by the control device are controlled so as to reduce the pressure in the chamber (7) so as not to cross the boundary.
ことを特徴とする、請求項１から６のいずれか一項記載の装置。 The apparatus is for measuring the temperature at the surface (9o) and / or the receiving surface (12) of the substrate (9) and / or for measuring the pressure in the chamber (7). The apparatus according to claim 1, further comprising: a measuring unit.
前記基板（９）の少なくとも前記表面（９ｏ）を、コーティング中に冷却する
方法。 A method of coating a surface (9o) of a substrate (9) with a coating material having at least one coating component and at least one solvent comprising:
Method of cooling at least the surface (9o) of the substrate (9) during coating.
請求項８記載の方法。 9. Method according to claim 8, wherein during the coating, the pressure and the temperature at the surface (9o) are controlled by a control device.
請求項８記載の方法。 The method according to claim 8, wherein at least the surface (9o) of the substrate (9) has a temperature below the phase transition temperature from the liquid phase to the solid phase of the coating material during the coating.
請求項９又は１０記載の方法。 After the coating, especially if the temperature at the surface (9o) is approximately unchanged, the solid phase of the coating component should be crossed over the phase boundary from the solid phase to the gas phase of the solvent. 11. A method according to claim 9 or 10, wherein the pressure is increased by the controller so as not to cross the phase boundary from to the gas phase.
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| DE102013105320.3A DE102013105320A1 (en) | 2013-05-23 | 2013-05-23 | Apparatus and method for coating a substrate |
| PCT/EP2014/056539 WO2014187600A1 (en) | 2013-05-23 | 2014-04-01 | Device and method for coating a substrate |
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| EP3690926B1 (en) * | 2016-09-29 | 2022-08-17 | EV Group E. Thallner GmbH | Apparatus and method for bonding of two substrates |
| CN106423734B (en) * | 2016-10-26 | 2022-05-10 | 广东工业大学 | Spraying and glue dispensing device and technology |
| KR102125141B1 (en) * | 2017-09-22 | 2020-06-19 | 가부시키가이샤 스크린 홀딩스 | Substrate processing method and substrate processing apparatus |
| US10994300B2 (en) * | 2018-11-27 | 2021-05-04 | Service Support Specialties, Inc | Method and/or system for coating a substrate |
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| JP2011183385A (en) * | 2011-04-04 | 2011-09-22 | Shibaura Mechatronics Corp | Apparatus and method for applying solution |
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| Publication number | Publication date |
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| TW201501806A (en) | 2015-01-16 |
| AT520565B1 (en) | 2019-06-15 |
| KR20160016774A (en) | 2016-02-15 |
| TWI668052B (en) | 2019-08-11 |
| US20160082453A1 (en) | 2016-03-24 |
| JP6360160B2 (en) | 2018-07-18 |
| WO2014187600A1 (en) | 2014-11-27 |
| KR102160846B1 (en) | 2020-09-29 |
| CN105377452B (en) | 2018-09-25 |
| US9962721B2 (en) | 2018-05-08 |
| DE102013105320A1 (en) | 2014-11-27 |
| AT520565A5 (en) | 2019-05-15 |
| CN105377452A (en) | 2016-03-02 |
| SG11201509621VA (en) | 2015-12-30 |
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