JPS58120778A - Vacuum vapor-depositing device - Google Patents

Abstract

PURPOSE:To obtain a titled device which is capable of cooling without complicating a rotary mechanism, by constituting a cooling body for cooling a sample plate by tightly adhering to the rotatable sample plate, so that it can hold non- contact when the sample plate is rotated. CONSTITUTION:In a bell jar 1 of a vacuum vapor-depositing device, a vapor- depositing material 2 is heated and evaporated by a heater 3, and is scattered in the upper direction suitably from the opening part of a cover 5 of the source part by opening and closing a shutter 4. Samples 13, 13' are supported by a sample plate 11, are rotated by operation of a rotate-driving part 14 of the sample plate 11, and uniform vapor-deposition is performed. On the upper part of the sample plate 11, a cooling body 12 supported by a supporting mechanism 16 is provided, is constituted so that it adheres tightly and is separated freely to and from the sample plate 11 by an up-and-down driving part 15, the adherence surface of both of them has a plane of high accuracy, and in a state of adherence, sufficient thermal conductivity is obtained. Also, the cooling body is capable of receiving the feed and discharge of a cooling liquid such as cooling water, liquidized fleon, liquid nitrogen, etc. through a flexible conduit 19 from a lead-in port 17 and a discharge port 18 of the cooling liquid.

Description

DETAILED DESCRIPTION OF THE INVENTION ((Trans)Technical Field of the Invention This is 10 relating to vacuum evaporation @ rice provided with a means for removing the object to be evaporated.

(b) Technology background It is used in various industrial fields.

In this vacuum evaporation, the support iron k for the object to be evaporated is often rotated for the purpose of evaporating over a wide area or uniformly evaporating. In vacuum evaporation, the object to be evaporated is often referred to as a sample, and its supporting device is often referred to as a sample stage. Therefore, in this specification, the names "sample" and "sample stage" will also be used. It is well known that the physical properties of the sample change, and in the semiconductor industry, it is not sufficient to evaporate the sample while heating it, so a heating means is provided to raise the temperature.
On the other hand, due to the heat resistance of the sample and the physical properties of the film formed, it may be necessary to cool the sample. Plastic materials are generally susceptible to deformation and deterioration due to ripening, but thermal radiation from the source alone may exceed the permissible temperature, so it is necessary to lower the sample temperature by some means.

In addition, metal vapor deposited films are generally polycrystalline, but low-temperature table 1f
It is known that an amorphous film may be formed by IK deposition, and a vapor deposition apparatus capable of cooling the sample is required for this purpose as well. Problem: It is not easy to provide a sample stage with both rotation and cooling functions. In the conventional method of circulating a cooling liquid inside the sample stage, a rotating shaft is used to introduce and discharge the cooling liquid, but the structure is complicated and it is difficult to achieve a high vacuum.

(d) Object of the Invention The present invention provides a vacuum evaporation apparatus that can be cooled without complicating the rotation mechanism. .

(e) Structure of the Invention The vacuum evaporation apparatus of the present invention includes a rotatable sample stand and a cooling body that cools the sample stand by being in close contact with the sample stand, and the cooling body cools the sample stand when the sample stand is rotated. Embodiment of the Invention The embodiment of the invention is shown in the drawings. In the drawing, 1 is a Pelger, 2 is a source material, 3 is a heater, and 4 is a shutter. , 5 is a cover of the source part 0 When the heater 3 is energized, the heated source material evaporates, and the opening 6 of the cover 5 is heated.
Sample 1 was scattered upward through the
It adheres to the surface of 3. A shutter 4 is provided to control the start and end of vapor deposition. When silicon is vapor-deposited, the source silicon fi is subjected to sub-beam heating, but the above-mentioned components are the same as usual, including in that case.

The sample 13' fixed to another part of the sample stage 11 is mounted.

A cooling weight 2 is provided above the sample stage 11. Although the cooling body is located at a position apart from the sample stage 11 in the figure, it is configured so that it can be placed in close contact with the sample stage 11 by operating the vertical drive unit 15.

The two surfaces that are in contact with each other, the top surface of the sample stage and the bottom surface of the cooling body, have highly precise flatness so that they are in close contact with each other, and when they are in close contact, sufficient thermal conductivity can be obtained. There is.

The device of the invention operates as follows.

First, the sample and source are set and the Pelger is evacuated, but at this time the sample stage 11 and the cooling body 12 are kept in close contact with each other for 1iK.

A cooling liquid is injected from the inlet 17, flows through the cooling body, cools the sample stage (and sample) that is in close contact with the cooling body, and is discharged from the discharge port 18. are connected by a flexible conduit such as a metal base, and are designed so that the vertical movement of the cooling body will not be hindered.

As the cooling fluid, one selected depending on the required temperature, such as cold water, liquefied Freon, or liquid chlorine, is used.

Before starting vapor deposition, the cooling body 12 is separated from the sample stage 11 and moved upward, and vapor deposition is performed while only the sample stage is rotated. Since the sample stage 11 is made to have good thermal conductivity and a large heat capacity, even after the cooling body is disconnected, the rise in degrees is gradual and the required low temperature is maintained.

Cooling conditions vary depending on the purpose, but for example, when depositing aluminum on an acrylic plate, the only requirement is to suppress the temperature rise due to radiant heat from the source, but the deposition time is short (
(within 1 minute), the source temperature is close to 1000° C., and cooling once using cold water before deposition is sufficient to achieve the purpose.

If a relatively long time vapor deposition is required, the sample temperature can be kept below an allowable value by dividing the vapor deposition process and performing the cooling process in between.

In the drawings, reference numeral 16 schematically represents a cooling body support mechanism, which has a guide mechanism (not shown) and is formed to prevent the cooling body from shifting to the left or right and from inclining. There is. For this part, techniques commonly used in the field of mechanical engineering can be used. (b) Effects of the invention Since the Kinai F14 has a structure that allows the sample and the cooling body to be separated, the rotating mechanism II [ Saponification is avoided, and the low temperature that is said to be 8 points can be maintained.

[Brief explanation of drawings]

1 shows the present invention briefly, and in the figure, 1 is a Pelger, 2 is a Fi vapor deposition material, 3 is a heater, 4 is a shutter,
5 is a cover for the source section, and 6 is an opening. 11 is a sample stage, 12 is a cooling body, 13.13' is a sample, 1
4 is the ig1 rotation drive part of the sample stage, 15 is the vertical drive part of the cooling body, 16 is the cooling body support mechanism, 17 and 181 are the cooling liquid inlet and outlet, and 19 is a flexible conduit. air

Claims (1)

[Claims] It is characterized by comprising a device for supporting the deposition target which is configured to be rotatable, and a control device which is configured to be in contact with the wrinkle support device and to be connected to it, but also to be in a non-contact state. vacuum evaporation equipment.