JP2016526067A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016526067A5 JP2016526067A5 JP2016513975A JP2016513975A JP2016526067A5 JP 2016526067 A5 JP2016526067 A5 JP 2016526067A5 JP 2016513975 A JP2016513975 A JP 2016513975A JP 2016513975 A JP2016513975 A JP 2016513975A JP 2016526067 A5 JP2016526067 A5 JP 2016526067A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- alkyl groups
- benzyl
- hydroxyphenyl
- independently selected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 15
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 9
- 239000003822 epoxy resin Substances 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 125000003118 aryl group Chemical group 0.000 claims 6
- 125000001072 heteroaryl group Chemical group 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 claims 5
- -1 2-hydroxyphenyl Chemical group 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 3
- 125000004208 3-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C([H])C(*)=C1[H] 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims 3
- 229920003986 novolac Polymers 0.000 claims 3
- 125000003373 pyrazinyl group Chemical group 0.000 claims 3
- 125000005412 pyrazyl group Chemical group 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 claims 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920001944 Plastisol Polymers 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000004999 plastisol Substances 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 0 *C#Cc1nccnc1 Chemical compound *C#Cc1nccnc1 0.000 description 6
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361823111P | 2013-05-14 | 2013-05-14 | |
| US61/823,111 | 2013-05-14 | ||
| PCT/US2014/036547 WO2014186151A1 (en) | 2013-05-14 | 2014-05-02 | Epoxy resins comprising a pyrazine-containing compound |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016526067A JP2016526067A (ja) | 2016-09-01 |
| JP2016526067A5 true JP2016526067A5 (enExample) | 2017-03-30 |
| JP6266096B2 JP6266096B2 (ja) | 2018-01-24 |
Family
ID=50896556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016513975A Expired - Fee Related JP6266096B2 (ja) | 2013-05-14 | 2014-05-02 | ピラジン含有化合物を含むエポキシ樹脂 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9975988B2 (enExample) |
| EP (1) | EP2997086B1 (enExample) |
| JP (1) | JP6266096B2 (enExample) |
| KR (1) | KR101885703B1 (enExample) |
| CN (1) | CN105209536B (enExample) |
| WO (1) | WO2014186151A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2997013A4 (en) * | 2013-05-14 | 2017-03-22 | 3M Innovative Properties Company | Pyridine- or pyrazine-containing compounds |
| NO2769142T3 (enExample) * | 2015-04-16 | 2018-07-21 | ||
| EP3630883A4 (en) * | 2017-05-25 | 2020-12-09 | Henkel IP & Holding GmbH | Curable compositions |
| US11261358B2 (en) | 2017-08-22 | 2022-03-01 | Sunstar Engineering Inc. | Curable composition |
| EP3778736A1 (en) | 2019-08-15 | 2021-02-17 | Sika Technology Ag | Thermally expandable compositions comprising a chemical blowing agent |
| US12157835B2 (en) * | 2020-04-07 | 2024-12-03 | Rohr, Inc. | Corrosion inhibition system primers and adhesives for metal bond structures |
| US20220186041A1 (en) * | 2020-12-15 | 2022-06-16 | TE Connectivity Services Gmbh | Coating for improved flammability performance in electrical components |
| US20240360335A1 (en) * | 2023-04-27 | 2024-10-31 | Westlake Epoxy Inc. | Epoxy resin compositions, composite materials, and methods of coating substrates |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH484972A (de) | 1967-12-08 | 1970-01-31 | Ciba Geigy | Härtbare Mischungen aus Epoxidharzen, Dicyandiamid und Aminbeschleunigern |
| US3928351A (en) | 1972-03-06 | 1975-12-23 | Du Pont | Multifunctional pyrazines |
| US3931109A (en) | 1972-03-13 | 1976-01-06 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
| CH606253A5 (enExample) * | 1977-01-07 | 1978-10-31 | Ciba Geigy Ag | |
| JPS58111843A (ja) | 1981-12-25 | 1983-07-04 | Osaka Soda Co Ltd | ブレンドゴム加硫組成物 |
| US5503937A (en) * | 1984-07-17 | 1996-04-02 | The Dow Chemical Company | Curable composition which comprises adducts of heterocyclic compounds |
| US4895702A (en) * | 1985-10-15 | 1990-01-23 | The Dow Chemical Company | Corrosion inhibitor compositions containing inhibitor prepared from amino substituted pyrazines and epoxy compounds |
| DE3830750A1 (de) * | 1987-09-11 | 1989-03-30 | Koei Chemical Co | Haertbare harzzusammensetzung und daraus hergestellte schichtstoffe |
| SG43193A1 (en) * | 1990-05-21 | 1997-10-17 | Dow Chemical Co | Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom |
| US5541000A (en) | 1993-08-17 | 1996-07-30 | Minnesota Mining And Manufacturing Company | Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms |
| US5859153A (en) | 1996-06-21 | 1999-01-12 | Minnesota Mining And Manufacturing Company | Novolak compounds useful as adhesion promoters for epoxy resins |
| KR100230575B1 (ko) | 1996-10-30 | 1999-11-15 | 김충섭 | 열잠재성 촉매령 경화제인 n-벤질-피라지늄-헥사폴루오로 안티모네이트에 의해 경화된 열잠재성 및 내열성의 이관능성 에폭시 수지 경화물 |
| US7001938B2 (en) | 2003-01-27 | 2006-02-21 | Resolution Performance Products Llc | Epoxy resin curing compositions and resin compositions including same |
| TWI612509B (zh) | 2006-09-29 | 2018-01-21 | 半導體能源研究所股份有限公司 | 顯示裝置和電子裝置 |
| JP2008274080A (ja) * | 2007-04-27 | 2008-11-13 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| JP5603256B2 (ja) | 2008-01-23 | 2014-10-08 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂硬化剤組成物及び前記硬化剤組成物を含むエポキシ樹脂組成物 |
| JP2009173812A (ja) | 2008-01-25 | 2009-08-06 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
| KR101239571B1 (ko) * | 2008-11-24 | 2013-03-06 | 바스프 에스이 | 열잠재성 염기를 포함하는 경화성 조성물 |
| EP2398863B1 (en) | 2009-02-19 | 2013-05-01 | 3M Innovative Properties Company | Fusion bonded epoxy coating compositions that include magnesium oxide |
| EP2997013A4 (en) | 2013-05-14 | 2017-03-22 | 3M Innovative Properties Company | Pyridine- or pyrazine-containing compounds |
-
2014
- 2014-05-02 KR KR1020157034871A patent/KR101885703B1/ko not_active Expired - Fee Related
- 2014-05-02 WO PCT/US2014/036547 patent/WO2014186151A1/en not_active Ceased
- 2014-05-02 US US14/782,625 patent/US9975988B2/en active Active
- 2014-05-02 CN CN201480026936.XA patent/CN105209536B/zh active Active
- 2014-05-02 JP JP2016513975A patent/JP6266096B2/ja not_active Expired - Fee Related
- 2014-05-02 EP EP14728767.6A patent/EP2997086B1/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102341430B (zh) | 环氧树脂组合物、固化剂及固化促进剂 | |
| ES2380589T3 (es) | Piezas de construcción estructurales híbridas de metal-plástico | |
| CN104861760B (zh) | 石墨烯复合涂层 | |
| JP5460583B2 (ja) | エポキシ硬化のための触媒 | |
| JP2013529724A5 (enExample) | ||
| JP2009120812A5 (enExample) | ||
| CN101687977B (zh) | 用于固化环氧化物的催化剂 | |
| MX2017013420A (es) | Una composicion de revestimiento intumescente. | |
| JP2016506430A5 (enExample) | ||
| JP2013510924A5 (enExample) | ||
| JP2017524777A5 (enExample) | ||
| JP2016536212A5 (enExample) | ||
| JP2007504341A5 (enExample) | ||
| WO2015082409A3 (en) | Coating method for surfaces in chemical installations | |
| JP2017527674A5 (enExample) | ||
| JP5409612B2 (ja) | エポキシドの硬化のための触媒 | |
| TW201612271A (en) | Film adhesive, semiconductor package using film adhesive and method for manufacturing same | |
| JP2010530908A5 (enExample) | ||
| JP2015525275A5 (enExample) | ||
| JP6266096B2 (ja) | ピラジン含有化合物を含むエポキシ樹脂 | |
| JP2011162785A5 (enExample) | ||
| CN101679607B (zh) | 用于固化环氧化物的催化剂 | |
| MY188623A (en) | Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device | |
| JP2017533299A5 (enExample) | ||
| US10906921B2 (en) | Base generator, reagent, organic salt, composition, method for manufacturing device, cured film and device |