JP2016526067A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016526067A5 JP2016526067A5 JP2016513975A JP2016513975A JP2016526067A5 JP 2016526067 A5 JP2016526067 A5 JP 2016526067A5 JP 2016513975 A JP2016513975 A JP 2016513975A JP 2016513975 A JP2016513975 A JP 2016513975A JP 2016526067 A5 JP2016526067 A5 JP 2016526067A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- alkyl groups
- benzyl
- hydroxyphenyl
- independently selected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 15
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 9
- 239000003822 epoxy resin Substances 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 9
- 229920000647 polyepoxide Polymers 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 125000003118 aryl group Chemical group 0.000 claims 6
- 125000001072 heteroaryl group Chemical group 0.000 claims 6
- 239000004593 Epoxy Substances 0.000 claims 5
- -1 2-hydroxyphenyl Chemical group 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 3
- 125000004208 3-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C([H])C(*)=C1[H] 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims 3
- 229920003986 novolac Polymers 0.000 claims 3
- 125000003373 pyrazinyl group Chemical group 0.000 claims 3
- 125000005412 pyrazyl group Chemical group 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 claims 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920001944 Plastisol Polymers 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000004999 plastisol Substances 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 0 *C#Cc1nccnc1 Chemical compound *C#Cc1nccnc1 0.000 description 6
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361823111P | 2013-05-14 | 2013-05-14 | |
| US61/823,111 | 2013-05-14 | ||
| PCT/US2014/036547 WO2014186151A1 (en) | 2013-05-14 | 2014-05-02 | Epoxy resins comprising a pyrazine-containing compound |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016526067A JP2016526067A (ja) | 2016-09-01 |
| JP2016526067A5 true JP2016526067A5 (enExample) | 2017-03-30 |
| JP6266096B2 JP6266096B2 (ja) | 2018-01-24 |
Family
ID=50896556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016513975A Expired - Fee Related JP6266096B2 (ja) | 2013-05-14 | 2014-05-02 | ピラジン含有化合物を含むエポキシ樹脂 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9975988B2 (enExample) |
| EP (1) | EP2997086B1 (enExample) |
| JP (1) | JP6266096B2 (enExample) |
| KR (1) | KR101885703B1 (enExample) |
| CN (1) | CN105209536B (enExample) |
| WO (1) | WO2014186151A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105209435B (zh) | 2013-05-14 | 2018-02-02 | 3M创新有限公司 | 包含吡啶或吡嗪的化合物 |
| NO2769142T3 (enExample) * | 2015-04-16 | 2018-07-21 | ||
| EP3630883A4 (en) * | 2017-05-25 | 2020-12-09 | Henkel IP & Holding GmbH | Curable compositions |
| JP6687759B2 (ja) * | 2017-08-22 | 2020-04-28 | サンスター技研株式会社 | 硬化性組成物 |
| EP3778736A1 (en) | 2019-08-15 | 2021-02-17 | Sika Technology Ag | Thermally expandable compositions comprising a chemical blowing agent |
| US12157835B2 (en) * | 2020-04-07 | 2024-12-03 | Rohr, Inc. | Corrosion inhibition system primers and adhesives for metal bond structures |
| US20220186041A1 (en) * | 2020-12-15 | 2022-06-16 | TE Connectivity Services Gmbh | Coating for improved flammability performance in electrical components |
| US20240360335A1 (en) * | 2023-04-27 | 2024-10-31 | Westlake Epoxy Inc. | Epoxy resin compositions, composite materials, and methods of coating substrates |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH484972A (de) | 1967-12-08 | 1970-01-31 | Ciba Geigy | Härtbare Mischungen aus Epoxidharzen, Dicyandiamid und Aminbeschleunigern |
| US3928351A (en) * | 1972-03-06 | 1975-12-23 | Du Pont | Multifunctional pyrazines |
| US3931109A (en) | 1972-03-13 | 1976-01-06 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
| CH606253A5 (enExample) * | 1977-01-07 | 1978-10-31 | Ciba Geigy Ag | |
| JPS58111843A (ja) * | 1981-12-25 | 1983-07-04 | Osaka Soda Co Ltd | ブレンドゴム加硫組成物 |
| US5503937A (en) * | 1984-07-17 | 1996-04-02 | The Dow Chemical Company | Curable composition which comprises adducts of heterocyclic compounds |
| US4895702A (en) * | 1985-10-15 | 1990-01-23 | The Dow Chemical Company | Corrosion inhibitor compositions containing inhibitor prepared from amino substituted pyrazines and epoxy compounds |
| DE3830750A1 (de) * | 1987-09-11 | 1989-03-30 | Koei Chemical Co | Haertbare harzzusammensetzung und daraus hergestellte schichtstoffe |
| EP0458502B1 (en) | 1990-05-21 | 2003-06-18 | Dow Global Technologies Inc. | Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| US5541000A (en) * | 1993-08-17 | 1996-07-30 | Minnesota Mining And Manufacturing Company | Latent, thermal cure accelerators for epoxy-aromatic amine resins having lowered peak exotherms |
| US5859153A (en) | 1996-06-21 | 1999-01-12 | Minnesota Mining And Manufacturing Company | Novolak compounds useful as adhesion promoters for epoxy resins |
| KR100230575B1 (ko) * | 1996-10-30 | 1999-11-15 | 김충섭 | 열잠재성 촉매령 경화제인 n-벤질-피라지늄-헥사폴루오로 안티모네이트에 의해 경화된 열잠재성 및 내열성의 이관능성 에폭시 수지 경화물 |
| US7001938B2 (en) | 2003-01-27 | 2006-02-21 | Resolution Performance Products Llc | Epoxy resin curing compositions and resin compositions including same |
| TWI831616B (zh) | 2006-09-29 | 2024-02-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP2008274080A (ja) | 2007-04-27 | 2008-11-13 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| BRPI0905711A2 (pt) | 2008-01-23 | 2015-07-14 | Dow Global Technologies Inc | Composição de revestimento em pó sólido |
| JP2009173812A (ja) | 2008-01-25 | 2009-08-06 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
| BRPI0921185A2 (pt) | 2008-11-24 | 2018-05-29 | Basf Se | composição curável, artigo para revestimento ou ligado, uso de um composto, e, composto |
| EP2398863B1 (en) | 2009-02-19 | 2013-05-01 | 3M Innovative Properties Company | Fusion bonded epoxy coating compositions that include magnesium oxide |
| CN105209435B (zh) | 2013-05-14 | 2018-02-02 | 3M创新有限公司 | 包含吡啶或吡嗪的化合物 |
-
2014
- 2014-05-02 US US14/782,625 patent/US9975988B2/en not_active Expired - Fee Related
- 2014-05-02 KR KR1020157034871A patent/KR101885703B1/ko not_active Expired - Fee Related
- 2014-05-02 JP JP2016513975A patent/JP6266096B2/ja not_active Expired - Fee Related
- 2014-05-02 EP EP14728767.6A patent/EP2997086B1/en active Active
- 2014-05-02 CN CN201480026936.XA patent/CN105209536B/zh active Active
- 2014-05-02 WO PCT/US2014/036547 patent/WO2014186151A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102341430B (zh) | 环氧树脂组合物、固化剂及固化促进剂 | |
| ES2380589T3 (es) | Piezas de construcción estructurales híbridas de metal-plástico | |
| CN104861760B (zh) | 石墨烯复合涂层 | |
| JP5460583B2 (ja) | エポキシ硬化のための触媒 | |
| JP2013529724A5 (enExample) | ||
| JP2009120812A5 (enExample) | ||
| CN101687977B (zh) | 用于固化环氧化物的催化剂 | |
| MX2017013420A (es) | Una composicion de revestimiento intumescente. | |
| JP2016506430A5 (enExample) | ||
| JP2013510924A5 (enExample) | ||
| JP2017524777A5 (enExample) | ||
| JP2016536212A5 (enExample) | ||
| JP2007504341A5 (enExample) | ||
| WO2015082409A3 (en) | Coating method for surfaces in chemical installations | |
| JP2017527674A5 (enExample) | ||
| JP5409612B2 (ja) | エポキシドの硬化のための触媒 | |
| TW201612271A (en) | Film adhesive, semiconductor package using film adhesive and method for manufacturing same | |
| JP2010530908A5 (enExample) | ||
| JP2015525275A5 (enExample) | ||
| JP6266096B2 (ja) | ピラジン含有化合物を含むエポキシ樹脂 | |
| JP2011162785A5 (enExample) | ||
| CN101679607B (zh) | 用于固化环氧化物的催化剂 | |
| MY188623A (en) | Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device | |
| JP2017533299A5 (enExample) | ||
| US10906921B2 (en) | Base generator, reagent, organic salt, composition, method for manufacturing device, cured film and device |