CN106414559A8 - 固化性聚倍半硅氧烷化合物、其制备方法、固化性组合物、固化物、和固化性组合物等的使用方法 - Google Patents

固化性聚倍半硅氧烷化合物、其制备方法、固化性组合物、固化物、和固化性组合物等的使用方法 Download PDF

Info

Publication number
CN106414559A8
CN106414559A8 CN201580025190.5A CN201580025190A CN106414559A8 CN 106414559 A8 CN106414559 A8 CN 106414559A8 CN 201580025190 A CN201580025190 A CN 201580025190A CN 106414559 A8 CN106414559 A8 CN 106414559A8
Authority
CN
China
Prior art keywords
compound
formula
curability
solidification compound
deficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201580025190.5A
Other languages
English (en)
Other versions
CN106414559A (zh
CN106414559B (zh
Inventor
松井优美
樫尾干广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN106414559A publication Critical patent/CN106414559A/zh
Publication of CN106414559A8 publication Critical patent/CN106414559A8/zh
Application granted granted Critical
Publication of CN106414559B publication Critical patent/CN106414559B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供：一种固化性聚倍半硅氧烷化合物，其是具有式：CHR1X0-D-SiO3/2[式中，R1表示氢原子或碳原子数1～6的烷基，X0表示卤原子、氰基或式：OG所表示的基团(式中，G表示羟基的保护基。)，D表示可具有单键或取代基的碳原子数1～20的2价有机基团。]所表示的结构单元的至少一种的固化性聚倍半硅氧烷化合物，其特征在于，29Si核磁共振波谱中，在-73ppm以上且不足-65ppm的区域具有第1峰顶、在-82ppm以上且不足-73ppm的区域具有第2峰顶、并且在-65ppm以上且不足-55ppm的区域实质上不具有峰；含有上述化合物和硅烷偶联剂的固化性组合物；上述固化性化合物的制备方法；将上述组合物固化而形成的固化物；以及上述组合物等的使用方法。
CN201580025190.5A 2014-05-07 2015-05-07 固化性聚倍半硅氧烷化合物、其制备方法、固化性组合物、固化物、和固化性组合物等的使用方法 Active CN106414559B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014096255 2014-05-07
JP2014-096255 2014-05-07
PCT/JP2015/063217 WO2015170709A1 (ja) 2014-05-07 2015-05-07 硬化性ポリシルセスキオキサン化合物、その製造方法、硬化性組成物、硬化物、及び、硬化性組成物等の使用方法

Publications (3)

Publication Number Publication Date
CN106414559A CN106414559A (zh) 2017-02-15
CN106414559A8 true CN106414559A8 (zh) 2017-06-30
CN106414559B CN106414559B (zh) 2019-09-20

Family

ID=54392559

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580025190.5A Active CN106414559B (zh) 2014-05-07 2015-05-07 固化性聚倍半硅氧烷化合物、其制备方法、固化性组合物、固化物、和固化性组合物等的使用方法

Country Status (7)

Country Link
US (1) US10370498B2 (zh)
EP (1) EP3141573A4 (zh)
JP (1) JP5981668B2 (zh)
KR (1) KR102253196B1 (zh)
CN (1) CN106414559B (zh)
TW (1) TWI700314B (zh)
WO (1) WO2015170709A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016013625A1 (ja) 2014-07-23 2016-01-28 リンテック株式会社 硬化性組成物、硬化性組成物の製造方法、硬化物、硬化性組成物の使用方法、及び光デバイス
CN112739748B (zh) * 2018-09-28 2022-07-12 琳得科株式会社 固化性聚倍半硅氧烷化合物、固化性组合物、固化物和固化性组合物的使用方法
CN113646083B (zh) * 2019-03-29 2024-06-07 住友化学株式会社 无机多孔质担载体、及使用其的核酸的制造方法
CN113956482B (zh) * 2021-08-27 2023-01-24 江西宏柏新材料股份有限公司 一种高介电常数含氰基聚倍半硅氧烷微粉的合成方法及应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7897667B2 (en) * 2000-03-24 2011-03-01 Hybrid Plastics, Inc. Fluorinated POSS as alloying agents in nonfluorinated polymers
US7129370B2 (en) * 2002-09-17 2006-10-31 Chisso Corporation Silicon compound and a production process for silicon compound
JP4734832B2 (ja) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 光素子用封止材
JP2005263869A (ja) 2004-03-16 2005-09-29 Nagase Chemtex Corp 光半導体封止用樹脂組成物
EP1854831A4 (en) 2005-02-23 2014-11-19 Mitsubishi Chem Corp SEMICONDUCTOR ELECTROLUMINESCENT COMPONENT ELEMENT, MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING COMPONENT USING THE SAME
JP4882413B2 (ja) 2005-02-23 2012-02-22 三菱化学株式会社 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
JP2006328231A (ja) 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
JP2007169375A (ja) * 2005-12-20 2007-07-05 Konishi Kagaku Ind Co Ltd ポリオルガノシルセスキオキサンおよびその製造方法
JP2008179811A (ja) * 2006-12-28 2008-08-07 Asahi Kasei Corp シロキサン誘導体及びその硬化物
CN103360601B (zh) 2008-02-14 2016-04-13 琳得科株式会社 由聚有机硅氧烷化合物构成的成型材料、密封材料及光元件密封体
TWI509023B (zh) * 2010-03-09 2015-11-21 Lintec Corp A hardened composition, a hardened product, and a hardening composition
JP5940456B2 (ja) * 2010-11-30 2016-06-29 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
JP6046898B2 (ja) * 2011-03-10 2016-12-21 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
KR101172900B1 (ko) * 2011-04-11 2012-08-10 주식회사 포스코건설 전로 고온공기 분사장치
KR101983423B1 (ko) 2012-03-23 2019-09-10 린텍 가부시키가이샤 경화성 조성물, 경화물 및 경화성 조성물의 사용 방법
MY171727A (en) 2012-10-30 2019-10-25 Lintec Corp Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like

Also Published As

Publication number Publication date
US10370498B2 (en) 2019-08-06
EP3141573A1 (en) 2017-03-15
TWI700314B (zh) 2020-08-01
CN106414559A (zh) 2017-02-15
US20170073474A1 (en) 2017-03-16
JPWO2015170709A1 (ja) 2017-04-20
KR102253196B1 (ko) 2021-05-17
CN106414559B (zh) 2019-09-20
JP5981668B2 (ja) 2016-08-31
TW201602170A (zh) 2016-01-16
WO2015170709A1 (ja) 2015-11-12
KR20170007296A (ko) 2017-01-18
EP3141573A4 (en) 2018-01-03

Similar Documents

Publication Publication Date Title
HK1250988A1 (zh) (r)-及(s)-1-(3-(3-n，n-二甲基胺基羰基)苯氧基-4-硝苯基)-1-乙基-n，n'-雙(伸乙基)胺基磷酸酯，組合物及其使用及製備方法
PH12016501522A1 (en) Sweet flavor modifier
MX2017011818A (es) Composiciones de silicona curables.
AR102468A1 (es) Métodos para la preparación de ribósidos
MX336770B (es) Composicion para la proteccion de superficies no fluoropolimericas.
WO2011117591A3 (en) Amine synergists and their use in radiation curing
MX2021006697A (es) Composición y método para el crecimiento del cabello.
CN106414559A8 (zh) 固化性聚倍半硅氧烷化合物、其制备方法、固化性组合物、固化物、和固化性组合物等的使用方法
MX2019002845A (es) Silanos y composiciones curables que comprenden dichos silanos.
PH12013500745A1 (en) Azaadamantane derivatives and methods of use
MY179876A (en) Sweet flavor modifier
MX338305B (es) Composicion para la proteccion de superficies no fluoropolimericas.
WO2014008458A3 (en) N-substituted benzamides and methods of use thereof
ZA201000079B (en) Organic compounds
NZ716840A (en) Combination formulation of two antiviral compounds
MX2017011821A (es) Silanos y composiciones curables que contienen dichos silanos como reticulantes.
WO2014144545A3 (en) Substituted benzoxazoles and methods of use thereof
WO2013076316A3 (en) Substituted n-(tetrazol-5-yl)- and n-(triazol-5-yl)hetarylcarboxamide compounds and their use as herbicides
WO2013171018A3 (de) Mischungen mit verbesserter kühlwirkung
WO2013072528A3 (en) Substituted n-(tetrazol-5-yl)- and n-(triazol-5-yl)pyridin-3-yl-carboxamide compounds and their use as herbicides
WO2014121040A8 (en) Flap modulators
WO2011132051A3 (en) Tricycle compounds as phosphodiesterase-10 inhibitors
WO2014047110A3 (en) Substituted alkyl diaryl derivatives, methods of preparation and uses
MY160392A (en) Triptolide prodrugs
MY183111A (en) 3-(heteroaryl-amino)-1,2,3,4-tetrahydro-9h-carbazole derivatives and their use as prostaglandin d2 receptor modulators

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CI01 Publication of corrected invention patent application

Correction item: Priority

Correct: 2014-096255 2014.05.07 JP

Number: 07

Volume: 33

CI01 Publication of corrected invention patent application
CI02 Correction of invention patent application

Correction item: Priority

Correct: 2014-096255 2014.05.07 JP

Number: 07

Page: The title page

Volume: 33

CI02 Correction of invention patent application
GR01 Patent grant
GR01 Patent grant