JP2016519213A5 - - Google Patents

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JP2016519213A5
JP2016519213A5 JP2016504637A JP2016504637A JP2016519213A5 JP 2016519213 A5 JP2016519213 A5 JP 2016519213A5 JP 2016504637 A JP2016504637 A JP 2016504637A JP 2016504637 A JP2016504637 A JP 2016504637A JP 2016519213 A5 JP2016519213 A5 JP 2016519213A5
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Japan
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processing station
chamber portion
chamber
coating drum
volume
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JP2016504637A
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Japanese (ja)
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JP6360882B2 (ja
JP2016519213A (ja
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Priority claimed from EP13161697.1A external-priority patent/EP2784176B1/en
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JP2016504637A 2013-03-28 2014-03-25 フレキシブル基板のための堆積プラットフォーム及びその操作方法 Active JP6360882B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13161697.1A EP2784176B1 (en) 2013-03-28 2013-03-28 Deposition platform for flexible substrates
EP13161697.1 2013-03-28
PCT/EP2014/055967 WO2014154692A1 (en) 2013-03-28 2014-03-25 Deposition platform for flexible substrates and method of operation thereof

Publications (3)

Publication Number Publication Date
JP2016519213A JP2016519213A (ja) 2016-06-30
JP2016519213A5 true JP2016519213A5 (enExample) 2017-05-18
JP6360882B2 JP6360882B2 (ja) 2018-07-18

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JP2016504637A Active JP6360882B2 (ja) 2013-03-28 2014-03-25 フレキシブル基板のための堆積プラットフォーム及びその操作方法

Country Status (7)

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US (3) US20140290861A1 (enExample)
EP (1) EP2784176B1 (enExample)
JP (1) JP6360882B2 (enExample)
KR (1) KR102032542B1 (enExample)
CN (1) CN105247100A (enExample)
TW (1) TWI625410B (enExample)
WO (1) WO2014154692A1 (enExample)

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EP2762609B1 (en) * 2013-01-31 2019-04-17 Applied Materials, Inc. Apparatus and method for depositing at least two layers on a substrate
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP2762608B1 (en) * 2013-01-31 2019-10-02 Applied Materials, Inc. Gas separation by adjustable separation wall
EP2883980B1 (en) * 2013-12-10 2017-02-08 Applied Materials, Inc. Vacuum processing apparatus with substrate spreading device and method for operating same
TWI549760B (zh) * 2015-04-09 2016-09-21 Pomiran Metalization Res Co Ltd Cleaning method and system of roll - to - roll polyimide film
FR3035122B1 (fr) * 2015-04-20 2017-04-28 Coating Plasma Ind Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede
CN104775102B (zh) * 2015-05-04 2017-07-14 上海产业技术研究院 卷对卷磁控溅射阴极与柱状多弧源相结合的真空镀膜系统
CN105239052A (zh) * 2015-11-17 2016-01-13 广东腾胜真空技术工程有限公司 双放双收卷绕镀膜装置及方法
EP3469113B1 (de) * 2016-06-10 2021-11-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum beschichten eines mit einer schutzfolie versehenen flexiblen substrates
CN109477203A (zh) * 2016-07-01 2019-03-15 应用材料公司 用于涂布柔性基板的沉积设备和涂布柔性基板的方法
KR102622868B1 (ko) * 2016-11-28 2024-01-08 엘지디스플레이 주식회사 열충격이 방지된 롤투롤 제조장치
US20180164628A1 (en) * 2016-12-12 2018-06-14 Wuhan China Star Optoelectronics Technology Co., Ltd. Processing system of flexible display device and method thereof
CN106449491A (zh) * 2016-12-12 2017-02-22 武汉华星光电技术有限公司 柔性显示器件处理系统及方法
CN109415804A (zh) * 2017-06-14 2019-03-01 应用材料公司 用于涂覆柔性基板的沉积设备
KR102543516B1 (ko) * 2017-12-20 2023-06-13 엘지디스플레이 주식회사 롤투롤 증착용 드럼, 롤투롤 증착 장치 및 필름 롤
JP2019160940A (ja) * 2018-03-09 2019-09-19 凸版印刷株式会社 原子層堆積装置および原子層堆積方法
FI4013905T3 (fi) 2019-08-12 2023-05-19 Kurt J Lesker Company Erittäin puhtaat olosuhteet atomimittakaavan prosessointiin
US11185915B2 (en) 2019-08-30 2021-11-30 Applied Materials, Inc. Deposition of reactive metals with protection layer for high volume manufacturing
EP4162094A4 (en) * 2020-06-04 2024-10-02 Applied Materials, Inc. Vapor deposition apparatus and method for coating a substrate in a vacuum chamber
WO2022040075A1 (en) * 2020-08-21 2022-02-24 Applied Materials, Inc. Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate
CN116391061B (zh) * 2020-10-21 2025-02-25 应用材料公司 用于在卷材涂覆工艺中使用的滚筒装置、卷材涂覆设备和用于在卷材涂覆工艺中控制卷材的温度的方法
CN113441377B (zh) * 2021-06-29 2022-10-28 辽宁分子流科技有限公司 一种纳米银丝电极薄膜的制备方法
JP2023114815A (ja) * 2022-02-07 2023-08-18 日新電機株式会社 プラズマ処理装置

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EP2762608B1 (en) * 2013-01-31 2019-10-02 Applied Materials, Inc. Gas separation by adjustable separation wall
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode

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