JP2016511289A5 - - Google Patents
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- Publication number
- JP2016511289A5 JP2016511289A5 JP2015549514A JP2015549514A JP2016511289A5 JP 2016511289 A5 JP2016511289 A5 JP 2016511289A5 JP 2015549514 A JP2015549514 A JP 2015549514A JP 2015549514 A JP2015549514 A JP 2015549514A JP 2016511289 A5 JP2016511289 A5 JP 2016511289A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- amine
- terminated
- curing agent
- epoxy composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 33
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 229920005862 polyol Polymers 0.000 claims description 18
- 150000003077 polyols Chemical class 0.000 claims description 16
- 150000002902 organometallic compounds Chemical class 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 13
- 125000003277 amino group Chemical group 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- IXNCIJOVUPPCOF-UHFFFAOYSA-N 2-ethylhexan-1-ol;titanium Chemical compound [Ti].CCCCC(CC)CO.CCCCC(CC)CO.CCCCC(CC)CO.CCCCC(CC)CO IXNCIJOVUPPCOF-UHFFFAOYSA-N 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- NSPSPMKCKIPQBH-UHFFFAOYSA-K bismuth;7,7-dimethyloctanoate Chemical compound [Bi+3].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O NSPSPMKCKIPQBH-UHFFFAOYSA-K 0.000 claims description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- 229920000459 Nitrile rubber Polymers 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- -1 butadiene acrylonitrile polyol Chemical class 0.000 claims description 2
- 238000005191 phase separation Methods 0.000 claims description 2
- 229920005906 polyester polyol Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 230000007704 transition Effects 0.000 description 5
- 230000000877 morphologic effect Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261740138P | 2012-12-20 | 2012-12-20 | |
| US61/740,138 | 2012-12-20 | ||
| PCT/US2013/075037 WO2014099666A2 (en) | 2012-12-20 | 2013-12-13 | Epoxy composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016511289A JP2016511289A (ja) | 2016-04-14 |
| JP2016511289A5 true JP2016511289A5 (enExample) | 2018-03-15 |
| JP6389469B2 JP6389469B2 (ja) | 2018-09-12 |
Family
ID=50000072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015549514A Expired - Fee Related JP6389469B2 (ja) | 2012-12-20 | 2013-12-13 | エポキシ組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9771450B2 (enExample) |
| EP (1) | EP2935391B1 (enExample) |
| JP (1) | JP6389469B2 (enExample) |
| CN (1) | CN104981495B (enExample) |
| BR (1) | BR112015014294A2 (enExample) |
| WO (1) | WO2014099666A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2794713B1 (en) * | 2011-12-20 | 2017-09-06 | Dow Global Technologies LLC | Toughening agent for epoxy thermoset |
| WO2017072869A1 (ja) * | 2015-10-28 | 2017-05-04 | 株式会社日立製作所 | 施策評価システムおよび施策評価方法 |
| WO2018081032A1 (en) * | 2016-10-25 | 2018-05-03 | Dow Global Technologies Llc | Epoxy adhesive having improved low-temperature impact resistance |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1194086A (en) * | 1968-08-15 | 1970-06-10 | Dow Chemical Co | Process for Curing Polyepoxides and Resulting Product |
| US4117361A (en) * | 1975-01-10 | 1978-09-26 | Westinghouse Electric Corp. | Solventless impregnating composition |
| JP3356302B2 (ja) * | 1992-04-24 | 2002-12-16 | 関西ペイント株式会社 | 水性塗料用樹脂組成物 |
| GB9604297D0 (en) * | 1996-02-29 | 1996-05-01 | Dow Deutschland Inc | Polymeric amines and reactive epoxy polymer compositions |
| JP3726380B2 (ja) * | 1996-10-16 | 2005-12-14 | 日立化成工業株式会社 | 変性エポキシ樹脂及び塗料 |
| JP3504500B2 (ja) * | 1997-08-28 | 2004-03-08 | 信越化学工業株式会社 | 熱硬化性接着剤及びそれを用いたフレキシブル印刷配線板材料 |
| JP3879831B2 (ja) * | 2002-01-28 | 2007-02-14 | 三菱瓦斯化学株式会社 | 熱硬化性ｐｐｅのオリゴマー体 |
| US6835785B2 (en) * | 2002-01-28 | 2004-12-28 | Mitsubishi Gas Chemical Company, Inc. | Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| JP2004203923A (ja) * | 2002-12-24 | 2004-07-22 | Nof Corp | シリコーン樹脂組成物および用途 |
| BRPI0618648A2 (pt) * | 2005-11-10 | 2011-09-06 | Sigmakalon B V | composição de revestimento base com base em epóxi, substrato de metal revestido, processo para revestir um substrato metálico, sistema de revestimento de camada dupla para um substrato metálico, e, usos de óxido de zinco, e de uma composição de revestimento base com base em epóxi |
| WO2012030338A1 (en) * | 2010-09-01 | 2012-03-08 | Dow Global Technologies Llc | Elastomeric epoxy materials and the use thereof |
| US9005761B2 (en) * | 2011-12-22 | 2015-04-14 | Elite Material Co., Ltd. | Halogen-free resin composition and its application for copper clad laminate and printed circuit board |
-
2013
- 2013-12-13 BR BR112015014294A patent/BR112015014294A2/pt not_active Application Discontinuation
- 2013-12-13 CN CN201380072462.8A patent/CN104981495B/zh not_active Expired - Fee Related
- 2013-12-13 EP EP13824047.8A patent/EP2935391B1/en not_active Not-in-force
- 2013-12-13 WO PCT/US2013/075037 patent/WO2014099666A2/en not_active Ceased
- 2013-12-13 JP JP2015549514A patent/JP6389469B2/ja not_active Expired - Fee Related
- 2013-12-13 US US14/652,295 patent/US9771450B2/en not_active Expired - Fee Related