JP2016510917A5 - - Google Patents

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Publication number
JP2016510917A5
JP2016510917A5 JP2015559308A JP2015559308A JP2016510917A5 JP 2016510917 A5 JP2016510917 A5 JP 2016510917A5 JP 2015559308 A JP2015559308 A JP 2015559308A JP 2015559308 A JP2015559308 A JP 2015559308A JP 2016510917 A5 JP2016510917 A5 JP 2016510917A5
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JP
Japan
Prior art keywords
temperature
component
power supply
pcd
instantaneous
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JP2015559308A
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English (en)
Japanese (ja)
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JP2016510917A (ja
JP6162262B2 (ja
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Priority claimed from US13/779,153 external-priority patent/US9037882B2/en
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Publication of JP2016510917A publication Critical patent/JP2016510917A/ja
Publication of JP2016510917A5 publication Critical patent/JP2016510917A5/ja
Application granted granted Critical
Publication of JP6162262B2 publication Critical patent/JP6162262B2/ja
Expired - Fee Related legal-status Critical Current
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JP2015559308A 2013-02-27 2014-02-26 最適な電力レベルを予測するために熱抵抗値を使用したポータブルコンピューティングデバイスにおける熱管理のためのシステムおよび方法 Expired - Fee Related JP6162262B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/779,153 US9037882B2 (en) 2013-02-27 2013-02-27 System and method for thermal management in a portable computing device using thermal resistance values to predict optimum power levels
US13/779,153 2013-02-27
PCT/US2014/018774 WO2014134211A1 (fr) 2013-02-27 2014-02-26 Système et procédé de gestion thermique dans un dispositif informatique portable en utilisant des valeurs de résistance thermique pour prédire des niveaux de puissance optimaux

Publications (3)

Publication Number Publication Date
JP2016510917A JP2016510917A (ja) 2016-04-11
JP2016510917A5 true JP2016510917A5 (fr) 2017-01-19
JP6162262B2 JP6162262B2 (ja) 2017-07-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015559308A Expired - Fee Related JP6162262B2 (ja) 2013-02-27 2014-02-26 最適な電力レベルを予測するために熱抵抗値を使用したポータブルコンピューティングデバイスにおける熱管理のためのシステムおよび方法

Country Status (6)

Country Link
US (2) US9037882B2 (fr)
EP (1) EP2962169B1 (fr)
JP (1) JP6162262B2 (fr)
KR (1) KR101814264B1 (fr)
CN (1) CN105009021B (fr)
WO (1) WO2014134211A1 (fr)

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US9625963B2 (en) 2014-08-29 2017-04-18 Qualcomm Incorporated Thermally-constrained voltage and frequency scaling
US9903764B2 (en) * 2014-09-30 2018-02-27 Samsung Electronics Co., Ltd. Integrated circuit for estimating power of at least one node using temperature and a system including the same
US20160117199A1 (en) * 2014-10-28 2016-04-28 Samsung Electronics Co., Ltd. Computing system with thermal mechanism and method of operation thereof
US9582052B2 (en) * 2014-10-30 2017-02-28 Qualcomm Incorporated Thermal mitigation of multi-core processor
US9958921B2 (en) 2015-03-09 2018-05-01 Advanced Micro Devices, Inc. Power management to change power limits based on device skin temperature
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US9785209B2 (en) * 2015-03-31 2017-10-10 Qualcomm Incorporated Thermal management in a computing device based on workload detection
US10215800B2 (en) * 2015-04-24 2019-02-26 Qualcomm Incorporated Device specific thermal mitigation
US20170083063A1 (en) * 2015-09-21 2017-03-23 Qualcomm Incorporated Circuits and methods providing temperature mitigation for computing devices using in-package sensor
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US9733685B2 (en) 2015-12-14 2017-08-15 International Business Machines Corporation Temperature-aware microprocessor voltage management
US10168752B2 (en) * 2016-03-08 2019-01-01 Qualcomm Incorporated Systems and methods for determining a sustained thermal power envelope comprising multiple heat sources
US10496141B2 (en) * 2016-03-17 2019-12-03 Qualcomm Incorporated System and method for intelligent thermal management in a system on a chip having a heterogeneous cluster architecture
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CN106656796B (zh) * 2016-11-11 2020-04-24 中国人民解放军国防科学技术大学 一种基于温度等级的超前阶梯式缓冲区调节方法
KR102643797B1 (ko) * 2017-01-10 2024-03-05 삼성전자주식회사 동적 발열 관리 방법
JP6872440B2 (ja) 2017-06-30 2021-05-19 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の制御方法
CN111108461B (zh) * 2017-09-28 2023-09-12 高通股份有限公司 调制解调器热管理
US10409359B2 (en) * 2018-01-17 2019-09-10 Qualcomm Incorporated Dynamic bin ordering for load synchronization
CN109710003A (zh) * 2018-12-26 2019-05-03 联想(北京)有限公司 温度控制方法及系统
KR20210032213A (ko) 2019-09-16 2021-03-24 삼성전자주식회사 전력 스텝에 기초한 동적 다이내믹 전압 주파주 스케일링(dvfs) 수행 방법
US11892893B2 (en) 2019-10-01 2024-02-06 Microsoft Technology Licensing, Llc Systems and methods for thermal system management
WO2021066829A1 (fr) * 2019-10-03 2021-04-08 Hewlett-Packard Development Company, L.P. Modification de paramètres de surfréquençage
US11460423B2 (en) * 2020-02-25 2022-10-04 Dell Products L.P. System and method to create an air flow map and detect air recirculation in an information handling system
KR20220059243A (ko) * 2020-11-02 2022-05-10 삼성전자주식회사 전력 측정에 기초한 온도 검출 및 열 관리를 위한 방법 및 장치
CN113157438A (zh) * 2021-03-10 2021-07-23 电子科技大学 一种高能效比多核微处理器的动态热管理方法

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