JP2016508603A5 - - Google Patents
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- Publication number
- JP2016508603A5 JP2016508603A5 JP2015555284A JP2015555284A JP2016508603A5 JP 2016508603 A5 JP2016508603 A5 JP 2016508603A5 JP 2015555284 A JP2015555284 A JP 2015555284A JP 2015555284 A JP2015555284 A JP 2015555284A JP 2016508603 A5 JP2016508603 A5 JP 2016508603A5
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- mount
- interface
- pods
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000035945 sensitivity Effects 0.000 claims 6
- 230000000295 complement effect Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 230000003750 conditioning effect Effects 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000011359 shock absorbing material Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361757864P | 2013-01-29 | 2013-01-29 | |
| US61/757,864 | 2013-01-29 | ||
| PCT/US2014/012830 WO2014120560A1 (en) | 2013-01-29 | 2014-01-23 | Sensors with modular threaded packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016508603A JP2016508603A (ja) | 2016-03-22 |
| JP2016508603A5 true JP2016508603A5 (enExample) | 2017-02-23 |
Family
ID=51221487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015555284A Pending JP2016508603A (ja) | 2013-01-29 | 2014-01-23 | モジュール型ねじ切り付きパッケージを備えるセンサ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140208876A1 (enExample) |
| EP (1) | EP2950939A4 (enExample) |
| JP (1) | JP2016508603A (enExample) |
| CA (1) | CA2899029A1 (enExample) |
| HK (1) | HK1216162A1 (enExample) |
| WO (1) | WO2014120560A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10782161B2 (en) * | 2015-06-17 | 2020-09-22 | Berkeley Springs Instruments, Llc | Ultrasonic transducer mounting apparatus for attaching a transducer block to a pipeline |
| US11921086B2 (en) * | 2016-02-25 | 2024-03-05 | RMCI, Inc. | Sensor mounting pad with secondary restraint feature |
| KR101843522B1 (ko) * | 2016-12-01 | 2018-03-30 | 한국항공우주연구원 | 비절연 iepe 가속도 센서를 위한 절연 마운팅 어댑터 |
| DE102019108161A1 (de) * | 2019-03-29 | 2020-03-26 | Ifm Electronic Gmbh | Adapter zur Befestigung eines Schwingungssensors an einer Maschine |
| CN114981851A (zh) * | 2019-12-20 | 2022-08-30 | Vega格里沙贝两合公司 | 传感器装置和扩展模块 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826540A (en) * | 1987-01-12 | 1989-05-02 | Sam Mele | Adjustable depth thermocouple system |
| US4825710A (en) * | 1987-10-02 | 1989-05-02 | Allen-Bradley Company, Inc. | Enclosure for electrical sensor |
| JPH01296130A (ja) * | 1988-05-24 | 1989-11-29 | Nissan Motor Co Ltd | 圧力センサ |
| US4922754A (en) * | 1989-03-17 | 1990-05-08 | Kennametal Inc. | Acoustic emission transducer and mounting adapter for monitoring metalcutting tools |
| JPH07938Y2 (ja) * | 1990-02-02 | 1995-01-11 | リオン株式会社 | 圧電形加速度ピックアップ |
| US5586085A (en) * | 1991-10-31 | 1996-12-17 | Lichte; Leo J. | Container and adaptor for use with fluid volume sensor |
| ATE181402T1 (de) * | 1992-08-10 | 1999-07-15 | Dow Deutschland Inc | Verfahren zur überwachung und steuerung eines verdichters und vorrichtung hierfür. |
| JP3322730B2 (ja) * | 1993-08-17 | 2002-09-09 | 日本特殊陶業株式会社 | 内燃機関のシリンダー内圧の変化を検出するための信号変換装置 |
| JP2883012B2 (ja) * | 1994-10-26 | 1999-04-19 | リオン株式会社 | 三方向圧電式加速度センサ |
| JPH08248059A (ja) * | 1995-03-08 | 1996-09-27 | Nec Corp | 3次元加速度センサ |
| JPH09184849A (ja) * | 1995-12-28 | 1997-07-15 | Mitsubishi Heavy Ind Ltd | 圧電型速度センサー |
| US5952657A (en) * | 1997-08-22 | 1999-09-14 | Thermo Microscopes, Corp. | Atomic force microscope with integrated optics for attachment to optical microscope |
| US5861624A (en) * | 1997-08-22 | 1999-01-19 | Park Scientific Instruments | Atomic force microscope for attachment to optical microscope |
| US6038924A (en) * | 1997-12-22 | 2000-03-21 | Research Foundation Of State Of New York | Low frequency seismic accelerometer |
| JP3339433B2 (ja) * | 1998-11-25 | 2002-10-28 | 株式会社村田製作所 | 加速度センサモジュールおよびこのモジュールを用いた加速度検出装置の製造方法 |
| JP3664041B2 (ja) * | 2000-05-17 | 2005-06-22 | 株式会社村田製作所 | 電荷型センサ用増幅回路 |
| US20030024332A1 (en) * | 2001-08-01 | 2003-02-06 | Pcb Piezotronics Inc., Imi Sensors | Sensor connector assembly |
| JP2003207426A (ja) * | 2002-01-11 | 2003-07-25 | Nsk Ltd | センサ付転動装置及び検出器 |
| US6923063B2 (en) * | 2002-09-16 | 2005-08-02 | Radiaulics, Inc. | Acoustic sensing device, system and method for monitoring emissions from machinery |
| FR2872518B1 (fr) * | 2004-07-02 | 2007-07-27 | Usinor Sa | Procede de controle du bullage en poche et installation de mise en oeuvre |
| JP2006250744A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 無線センサ装置 |
| JP2007132808A (ja) * | 2005-11-10 | 2007-05-31 | Akebono Brake Ind Co Ltd | センサ構造 |
| US7861608B2 (en) * | 2006-06-03 | 2011-01-04 | Pendotech | Universal sensor fitting for process applications |
| CN201319040Y (zh) * | 2008-01-23 | 2009-09-30 | 美捷特(厦门)传感器件有限公司 | 一种对iepe型压电加速度传感器状态检测的装置 |
| US8091437B2 (en) * | 2008-05-05 | 2012-01-10 | John Stumpf | Transducer matrix film |
| JP4961417B2 (ja) * | 2008-12-17 | 2012-06-27 | 株式会社テイエルブイ | 機器状態情報収集方法、及び、それに用いる機器状態情報収集キット |
| US20100232894A1 (en) * | 2009-03-16 | 2010-09-16 | The Boeing Company | Adaptor with Interchangeable Load Sensing Elements |
| EP2284531B1 (de) * | 2009-07-31 | 2013-09-25 | Hach Lange GmbH | Wasseranalyse-Sensoranordnung |
| EP2312326B1 (en) * | 2009-10-16 | 2014-12-10 | SPECS Surface Nano Analysis GmbH | Mount for a scanning probe sensor package, scanning probe microscope and method of mounting or dismounting a scanning probe sensor package. |
| US8250937B2 (en) * | 2010-03-10 | 2012-08-28 | Asepco | Aseptic manifold and probe assembly |
| US8375793B2 (en) * | 2011-02-10 | 2013-02-19 | Dytran Instruments, Inc. | Accelerometer for high temperature applications |
| US8542556B2 (en) * | 2011-03-18 | 2013-09-24 | Thomas E. Owen | Directional seismic sensor array |
-
2014
- 2014-01-23 WO PCT/US2014/012830 patent/WO2014120560A1/en not_active Ceased
- 2014-01-23 CA CA2899029A patent/CA2899029A1/en not_active Abandoned
- 2014-01-23 EP EP14745775.8A patent/EP2950939A4/en not_active Withdrawn
- 2014-01-23 HK HK16104173.3A patent/HK1216162A1/zh unknown
- 2014-01-23 JP JP2015555284A patent/JP2016508603A/ja active Pending
- 2014-01-23 US US14/162,361 patent/US20140208876A1/en not_active Abandoned
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