JP2016506629A - シリコンウェハから不純物をゲッタリングするための酸化物媒体 - Google Patents

シリコンウェハから不純物をゲッタリングするための酸化物媒体 Download PDF

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Publication number
JP2016506629A
JP2016506629A JP2015550007A JP2015550007A JP2016506629A JP 2016506629 A JP2016506629 A JP 2016506629A JP 2015550007 A JP2015550007 A JP 2015550007A JP 2015550007 A JP2015550007 A JP 2015550007A JP 2016506629 A JP2016506629 A JP 2016506629A
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JP
Japan
Prior art keywords
acid
silicon
medium
oxide
getter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015550007A
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English (en)
Japanese (ja)
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JP2016506629A5 (enExample
Inventor
ケーラー，インゴー
ドール，オリバー
バルト，セバスチャン
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Merck Patent GmbH
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Merck Patent GmbH
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Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of JP2016506629A publication Critical patent/JP2016506629A/ja
Publication of JP2016506629A5 publication Critical patent/JP2016506629A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/12—Active materials
    • H10F77/122—Active materials comprising only Group IV materials
    • H10F77/1223—Active materials comprising only Group IV materials characterised by the dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • H10P14/6342—
    • H10P14/6686—
    • H10P14/68—
    • H10P32/141—
    • H10P32/171—
    • H10P32/19—
    • H10P36/03—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Photovoltaic Devices (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
JP2015550007A 2012-12-28 2013-12-18 シリコンウェハから不純物をゲッタリングするための酸化物媒体 Pending JP2016506629A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP12008660.8 2012-12-28
EP12008660 2012-12-28
EP13005736.7 2013-12-10
EP13005736 2013-12-10
PCT/EP2013/003837 WO2014101988A1 (de) 2012-12-28 2013-12-18 Oxidmedien zum gettern von verunreinigungen aus siliziumwafern

Publications (2)

Publication Number Publication Date
JP2016506629A true JP2016506629A (ja) 2016-03-03
JP2016506629A5 JP2016506629A5 (enExample) 2017-02-16

Family

ID=49956119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015550007A Pending JP2016506629A (ja) 2012-12-28 2013-12-18 シリコンウェハから不純物をゲッタリングするための酸化物媒体

Country Status (8)

Country Link
US (1) US20150357508A1 (enExample)
EP (1) EP2938762A1 (enExample)
JP (1) JP2016506629A (enExample)
KR (1) KR20150103129A (enExample)
CN (1) CN104884684A (enExample)
SG (2) SG10201705329RA (enExample)
TW (1) TW201443108A (enExample)
WO (1) WO2014101988A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3241242A1 (de) * 2014-12-30 2017-11-08 Merck Patent GmbH Laserdotierung von halbleiter
WO2016150548A2 (de) * 2015-03-23 2016-09-29 Merck Patent Gmbh Druckbare pastöse diffusions- und legierungsbarriere zur herstellung von hocheffizienten kristallinen siliziumsolarzellen
JP6737066B2 (ja) * 2016-08-22 2020-08-05 株式会社Sumco エピタキシャルシリコンウェーハの製造方法、エピタキシャルシリコンウェーハ、及び固体撮像素子の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534258A (en) * 1978-09-01 1980-03-10 Tokyo Denshi Kagaku Kabushiki Coating solution for forming silica film
JP2002539615A (ja) * 1999-03-11 2002-11-19 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング 半導体にｐ、ｐ＋およびｎ、ｎ＋領域を形成するためのドーパント・ペースト
JP2011517062A (ja) * 2008-03-24 2011-05-26 ハネウェル・インターナショナル・インコーポレーテッド 非コンタクトの印刷方法を使用して半導体基板のドーピング領域を形成する方法、および、非コンタクトの印刷方法を使用してかかるドーピング領域を形成するドーパント含有インク
JP2011211036A (ja) * 2010-03-30 2011-10-20 Shin-Etsu Chemical Co Ltd 基板処理方法、基板の製造方法及び太陽電池の製造方法
WO2012119686A2 (de) * 2011-03-08 2012-09-13 Merck Patent Gmbh Aluminiumoxidpasten und verfahren zu deren verwendung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3837873A (en) * 1972-05-31 1974-09-24 Texas Instruments Inc Compositions for use in forming a doped oxide film
DE10045249A1 (de) * 2000-09-13 2002-04-04 Siemens Ag Photovoltaisches Bauelement und Verfahren zum Herstellen des Bauelements
US7393469B2 (en) * 2003-07-31 2008-07-01 Ramazan Benrashid High performance sol-gel spin-on glass materials
US7951696B2 (en) * 2008-09-30 2011-05-31 Honeywell International Inc. Methods for simultaneously forming N-type and P-type doped regions using non-contact printing processes
EP2938761A1 (de) * 2012-12-28 2015-11-04 Merck Patent GmbH Dotiermedien zur lokalen dotierung von siliziumwafern

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534258A (en) * 1978-09-01 1980-03-10 Tokyo Denshi Kagaku Kabushiki Coating solution for forming silica film
JP2002539615A (ja) * 1999-03-11 2002-11-19 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング 半導体にｐ、ｐ＋およびｎ、ｎ＋領域を形成するためのドーパント・ペースト
JP2011517062A (ja) * 2008-03-24 2011-05-26 ハネウェル・インターナショナル・インコーポレーテッド 非コンタクトの印刷方法を使用して半導体基板のドーピング領域を形成する方法、および、非コンタクトの印刷方法を使用してかかるドーピング領域を形成するドーパント含有インク
JP2011211036A (ja) * 2010-03-30 2011-10-20 Shin-Etsu Chemical Co Ltd 基板処理方法、基板の製造方法及び太陽電池の製造方法
WO2012119686A2 (de) * 2011-03-08 2012-09-13 Merck Patent Gmbh Aluminiumoxidpasten und verfahren zu deren verwendung

Also Published As

Publication number Publication date
SG10201705329RA (en) 2017-07-28
US20150357508A1 (en) 2015-12-10
WO2014101988A1 (de) 2014-07-03
CN104884684A (zh) 2015-09-02
TW201443108A (zh) 2014-11-16
SG11201505028XA (en) 2015-07-30
KR20150103129A (ko) 2015-09-09
EP2938762A1 (de) 2015-11-04

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