JP2016505389A5 - - Google Patents
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- Publication number
- JP2016505389A5 JP2016505389A5 JP2015549469A JP2015549469A JP2016505389A5 JP 2016505389 A5 JP2016505389 A5 JP 2016505389A5 JP 2015549469 A JP2015549469 A JP 2015549469A JP 2015549469 A JP2015549469 A JP 2015549469A JP 2016505389 A5 JP2016505389 A5 JP 2016505389A5
- Authority
- JP
- Japan
- Prior art keywords
- robot
- laser
- head unit
- control
- manipulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012636 effector Substances 0.000 claims 10
- 239000000463 material Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 5
- 230000003287 optical effect Effects 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261740340P | 2012-12-20 | 2012-12-20 | |
| US61/740,340 | 2012-12-20 | ||
| PCT/US2013/074233 WO2014107274A1 (en) | 2012-12-20 | 2013-12-11 | Material processing low-inertia laser scanning end-effector manipulation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016505389A JP2016505389A (ja) | 2016-02-25 |
| JP2016505389A5 true JP2016505389A5 (enExample) | 2016-12-22 |
| JP6382220B2 JP6382220B2 (ja) | 2018-08-29 |
Family
ID=51062417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015549469A Active JP6382220B2 (ja) | 2012-12-20 | 2013-12-11 | 材料加工低慣性レーザー走査エンドエフェクタ操作 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10399178B2 (enExample) |
| EP (1) | EP2934812B1 (enExample) |
| JP (1) | JP6382220B2 (enExample) |
| KR (2) | KR102249405B1 (enExample) |
| CN (1) | CN104870140B (enExample) |
| BR (1) | BR112015014893A2 (enExample) |
| WO (1) | WO2014107274A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9914985B2 (en) * | 2014-09-09 | 2018-03-13 | G.C. Laser Systems, Inc. | Laser ablation and processing methods and systems |
| US10788836B2 (en) * | 2016-02-29 | 2020-09-29 | AI Incorporated | Obstacle recognition method for autonomous robots |
| JP6035461B1 (ja) * | 2016-04-28 | 2016-11-30 | 武井電機工業株式会社 | レーザー加工方法及びレーザー加工装置 |
| JP6829053B2 (ja) * | 2016-11-09 | 2021-02-10 | コマツ産機株式会社 | マシンルーム |
| JP6496340B2 (ja) * | 2017-03-17 | 2019-04-03 | ファナック株式会社 | スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム |
| DE102017111244A1 (de) * | 2017-05-23 | 2018-12-13 | ConsultEngineerIP AG | Quasi-Simultaner Laser-Schweissprozess |
| US20220274208A1 (en) * | 2018-08-01 | 2022-09-01 | Cohpros International Co., Ltd. | Cutting device for cutting composite material |
| JP6852031B2 (ja) * | 2018-09-26 | 2021-03-31 | 株式会社東芝 | 溶接装置及びノズル装置 |
| WO2020068573A2 (en) * | 2018-09-28 | 2020-04-02 | Corning Incorporated | Rotating light source utilized to modify substrates |
| CN112823079A (zh) * | 2018-10-25 | 2021-05-18 | 3M创新有限公司 | 用于机器人涂漆修复中的多自由度柔性致动器力控制系统和方法 |
| IT201900000995A1 (it) * | 2019-01-23 | 2020-07-23 | Nuovo Pignone Tecnologie Srl | Apparecchiatura robotica industriale con generazione di percorso di lavorazione migliorata e metodo per azionare un' apparecchiatura robotica industriale secondo un percorso di lavorazione migliorato |
| DE102019103659B4 (de) * | 2019-02-13 | 2023-11-30 | Bystronic Laser Ag | Gasführung, Laserschneidkopf und Laserschneidmaschine |
| CN109807475A (zh) * | 2019-03-26 | 2019-05-28 | 广西加一米科技有限公司 | 铝带激光连续切割机组 |
| WO2020261537A1 (ja) * | 2019-06-28 | 2020-12-30 | 三菱重工業株式会社 | レーザー加工装置 |
| EP3984688A1 (de) * | 2020-10-16 | 2022-04-20 | Bystronic Laser AG | Verfahren, computerprogramm und laserschneidsystem für intelligentes eckenschneiden |
| DE102021202644A1 (de) * | 2021-03-18 | 2022-09-22 | Volkswagen Aktiengesellschaft | Verfahren zur Herstellung einer Ableiterfolie für Batterien |
| CN115555852B (zh) * | 2021-06-30 | 2023-06-30 | 宁德时代新能源科技股份有限公司 | 极片成型方法及设备 |
| US12330239B2 (en) * | 2022-02-09 | 2025-06-17 | Ford Global Technologies, Llc | Laser notching apparatus for cutting of electrode sheets |
| CN115958290A (zh) * | 2023-01-20 | 2023-04-14 | 通快(中国)有限公司 | 用于激光焊接的气体辅助装置和激光焊接系统 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915646B2 (ja) | 1991-08-29 | 1999-07-05 | オークマ株式会社 | 板金加工方法及びその機械 |
| US5204517A (en) * | 1991-12-24 | 1993-04-20 | Maxwell Laboratories, Inc. | Method and system for control of a material removal process using spectral emission discrimination |
| JP2917763B2 (ja) * | 1993-08-11 | 1999-07-12 | 日産自動車株式会社 | 肉盛溶接における溶接金属粉末供給方法及びその装置 |
| US6427096B1 (en) | 1999-02-12 | 2002-07-30 | Honeywell International Inc. | Processing tool interface apparatus for use in manufacturing environment |
| US20020104833A1 (en) * | 2001-02-08 | 2002-08-08 | Automated Welding Systems Inc. | Welding head mount for robotic welding apparatus with micro adjustment capability |
| US20040034599A1 (en) | 2001-06-01 | 2004-02-19 | Pietro Ferrero | Method and device for the robot-controlled cutting of workpieces to be assembled by means of laser radiation |
| JP2003181663A (ja) | 2001-12-11 | 2003-07-02 | Mitsubishi Heavy Ind Ltd | 複合溶接方法および複合溶接ヘッド |
| DE10204993B4 (de) | 2002-02-05 | 2005-06-09 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum Bearbeiten von dreidimensional ausgedehnten Werkstückoberflächen mittels Laser |
| GB2390319B (en) * | 2002-07-03 | 2005-07-27 | Rolls Royce Plc | Method and apparatus for laser welding |
| JP2005177786A (ja) * | 2003-12-17 | 2005-07-07 | Denso Corp | 高密度エネルギビーム加工方法及びその装置、孔付き管の製造方法及びその装置 |
| JP4922584B2 (ja) * | 2004-12-10 | 2012-04-25 | 株式会社安川電機 | ロボットシステム |
| JP2007044726A (ja) * | 2005-08-09 | 2007-02-22 | Nissan Motor Co Ltd | レーザ溶接装置および溶接方法 |
| CN100409994C (zh) * | 2005-10-14 | 2008-08-13 | 江苏大学 | 基于激光冲击技术的水约束层增压的方法和装置 |
| JP2009045625A (ja) * | 2007-08-13 | 2009-03-05 | Fuji Electric Systems Co Ltd | レーザ加工装置 |
| JP4258567B1 (ja) | 2007-10-26 | 2009-04-30 | パナソニック電工株式会社 | 三次元形状造形物の製造方法 |
| DE102007062212A1 (de) * | 2007-12-21 | 2009-06-25 | Linde Ag | Verfahren und Vorrichtung zum Laser-Remote-Schneiden |
| JP5262810B2 (ja) | 2009-02-18 | 2013-08-14 | 村田機械株式会社 | パラレルメカニズム |
| CN102656679B (zh) * | 2009-10-19 | 2016-10-26 | 万佳雷射有限公司 | 用于加工连续的多段柔性箔片的装置 |
| JP2011125877A (ja) | 2009-12-16 | 2011-06-30 | Mitsubishi Heavy Ind Ltd | レーザ加工方法及び装置 |
| JP5609500B2 (ja) * | 2010-10-01 | 2014-10-22 | スズキ株式会社 | レーザ溶接装置 |
| DE102011016519B4 (de) * | 2011-04-08 | 2019-03-28 | Lessmüller Lasertechnik GmbH | Vorrichtung zur Bearbeitung eines Werkstücks mittels eines hochenergetischen Bearbeitungsstrahls |
| CN202278307U (zh) * | 2011-08-19 | 2012-06-20 | 广州有色金属研究院 | 一种可调式双线结构光焊缝跟踪视觉传感系统 |
| CN102825383B (zh) * | 2012-07-19 | 2014-10-29 | 宁海县盛源激光科技有限公司 | 一种数控半导体激光加工机床 |
-
2013
- 2013-12-11 KR KR1020207031772A patent/KR102249405B1/ko active Active
- 2013-12-11 BR BR112015014893A patent/BR112015014893A2/pt not_active IP Right Cessation
- 2013-12-11 US US14/653,921 patent/US10399178B2/en active Active
- 2013-12-11 JP JP2015549469A patent/JP6382220B2/ja active Active
- 2013-12-11 CN CN201380066463.1A patent/CN104870140B/zh active Active
- 2013-12-11 WO PCT/US2013/074233 patent/WO2014107274A1/en not_active Ceased
- 2013-12-11 EP EP13870028.1A patent/EP2934812B1/en active Active
- 2013-12-11 KR KR1020157019370A patent/KR20150096766A/ko not_active Ceased
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