JP2016500930A5 - - Google Patents
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- Publication number
- JP2016500930A5 JP2016500930A5 JP2015540752A JP2015540752A JP2016500930A5 JP 2016500930 A5 JP2016500930 A5 JP 2016500930A5 JP 2015540752 A JP2015540752 A JP 2015540752A JP 2015540752 A JP2015540752 A JP 2015540752A JP 2016500930 A5 JP2016500930 A5 JP 2016500930A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- semiconductor substrate
- interconnect
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 9
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 239000003989 dielectric material Substances 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052776 Thorium Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261721889P | 2012-11-02 | 2012-11-02 | |
| US61/721,889 | 2012-11-02 | ||
| US13/764,261 US20140124877A1 (en) | 2012-11-02 | 2013-02-11 | Conductive interconnect including an inorganic collar |
| US13/764,261 | 2013-02-11 | ||
| PCT/US2013/067568 WO2014070926A1 (en) | 2012-11-02 | 2013-10-30 | A conductive interconnect including an inorganic collar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016500930A JP2016500930A (ja) | 2016-01-14 |
| JP2016500930A5 true JP2016500930A5 (OSRAM) | 2016-11-24 |
Family
ID=50621573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015540752A Pending JP2016500930A (ja) | 2012-11-02 | 2013-10-30 | 無機カラーを含む導電性インターコネクト |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140124877A1 (OSRAM) |
| EP (1) | EP2915191B1 (OSRAM) |
| JP (1) | JP2016500930A (OSRAM) |
| KR (1) | KR20150082395A (OSRAM) |
| CN (1) | CN104769711B (OSRAM) |
| WO (1) | WO2014070926A1 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI568662B (zh) * | 2013-03-08 | 2017-02-01 | 先技股份有限公司 | 微機電裝置 |
| US9698116B2 (en) * | 2014-10-31 | 2017-07-04 | Nxp Usa, Inc. | Thick-silver layer interface for a semiconductor die and corresponding thermal layer |
| US9713264B2 (en) | 2014-12-18 | 2017-07-18 | Intel Corporation | Zero-misalignment via-pad structures |
| US10475736B2 (en) | 2017-09-28 | 2019-11-12 | Intel Corporation | Via architecture for increased density interface |
| US20210159198A1 (en) * | 2019-11-24 | 2021-05-27 | Nanya Technology Corporation | Semiconductor structure and manufacturing method thereof |
| CN114649287A (zh) * | 2022-05-19 | 2022-06-21 | 甬矽半导体(宁波)有限公司 | 一种芯片制作方法、芯片连接方法以及芯片 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS642339A (en) * | 1987-06-24 | 1989-01-06 | Nec Corp | Manufacture of semiconductor device |
| US5445894A (en) * | 1991-04-22 | 1995-08-29 | Dow Corning Corporation | Ceramic coatings |
| JPH10209163A (ja) * | 1997-01-21 | 1998-08-07 | Citizen Watch Co Ltd | 半導体装置およびその製造方法 |
| JP3654485B2 (ja) * | 1997-12-26 | 2005-06-02 | 富士通株式会社 | 半導体装置の製造方法 |
| CN100395662C (zh) * | 2000-08-31 | 2008-06-18 | Az电子材料（日本）株式会社 | 感光性聚硅氮烷组合物、采用该组合物形成图案的方法及烧结其涂层膜的方法 |
| US6734568B2 (en) * | 2001-08-29 | 2004-05-11 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| US20050274871A1 (en) * | 2004-06-10 | 2005-12-15 | Jin Li | Method and apparatus for collecting photons in a solid state imaging sensor |
| US20070238222A1 (en) * | 2006-03-28 | 2007-10-11 | Harries Richard J | Apparatuses and methods to enhance passivation and ILD reliability |
| JP4768491B2 (ja) * | 2006-03-30 | 2011-09-07 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置の製造方法 |
| JP4247690B2 (ja) * | 2006-06-15 | 2009-04-02 | ソニー株式会社 | 電子部品及その製造方法 |
| US9524945B2 (en) * | 2010-05-18 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with L-shaped non-metal sidewall protection structure |
| JP2011091087A (ja) * | 2009-10-20 | 2011-05-06 | Fujitsu Ltd | 半導体装置とその製造方法 |
| US8441124B2 (en) * | 2010-04-29 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall protection structure |
| US9018758B2 (en) * | 2010-06-02 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall spacer and metal top cap |
| WO2012107971A1 (ja) * | 2011-02-10 | 2012-08-16 | パナソニック株式会社 | 半導体装置及びその製造方法 |
-
2013
- 2013-02-11 US US13/764,261 patent/US20140124877A1/en not_active Abandoned
- 2013-10-30 WO PCT/US2013/067568 patent/WO2014070926A1/en not_active Ceased
- 2013-10-30 JP JP2015540752A patent/JP2016500930A/ja active Pending
- 2013-10-30 KR KR1020157014345A patent/KR20150082395A/ko not_active Withdrawn
- 2013-10-30 EP EP13795327.9A patent/EP2915191B1/en active Active
- 2013-10-30 CN CN201380057472.4A patent/CN104769711B/zh active Active
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