JP2016500474A - 半導体アセンブリ - Google Patents
半導体アセンブリ Download PDFInfo
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- JP2016500474A JP2016500474A JP2015545677A JP2015545677A JP2016500474A JP 2016500474 A JP2016500474 A JP 2016500474A JP 2015545677 A JP2015545677 A JP 2015545677A JP 2015545677 A JP2015545677 A JP 2015545677A JP 2016500474 A JP2016500474 A JP 2016500474A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 115
- 239000003990 capacitor Substances 0.000 claims description 18
- 230000005611 electricity Effects 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (24)
- 半導体モジュール(20a)および冷却器(30a)を備えるスタック(38)であって、前記半導体モジュール(20a)は前記冷却器(30a)に接触して設けられ、前記スタックは第1の側面および第2の側面を有する、スタック(38)と、
前記スタック上に力(F)を及ぼすように適合されるクランピングアセンブリ(40)と、を備える半導体アセンブリ(10)であって、
前記スタック(38)には、前記第1の側面(22)と第2の側面(24)との間にスルーホール(26、36)が設けられており、前記クランピングアセンブリ(40)のその一部は、前記スタックの前記スルーホール(26、36)を通って延びており、
前記クランピングアセンブリ(40)の前記一部は、電気を伝導するように構成された導電部(42)を備える、前記スタックの前記スルーホール(26、36)を通って延びる、ことを特徴とする、半導体アセンブリ。 - 前記スタック(38)の、前記スルーホール(26、36)を通って延びる前記クランピングアセンブリ(40)は、単一のバスバー(42)を備える、請求項1に記載の半導体アセンブリ。
- 前記導電部(42)を、前記半導体モジュール(20a)から電気的に絶縁するために設けられた絶縁エレメント(50)を備える、請求項1または2に記載の半導体アセンブリ。
- 前記スルーホール(26、36)が前記スタック(38)の中央に設けられている、請求項1から3のいずれか一項に記載の半導体アセンブリ。
- 前記半導体モジュール(20a)は一般的に平坦であり、第1の平面状の側面(22)および第2の反対側の平面状の側面(24)を有する、請求項1から4のいずれか一項に記載の半導体アセンブリ。
- 前記半導体モジュール(22)の前記第1および第2の平面状の側面(24、26)はモジュール電源接続として機能する、請求項5に記載の半導体アセンブリ。
- 前記冷却器(30a−30e)は、実質的に前記半導体モジュール(20a)の側面の全領域で冷却器と接触するように配置される、請求項1から6のいずれか一項に記載の半導体アセンブリ。
- 前記冷却器(30a)は導電性である、請求項1から7のいずれか一項に記載の半導体アセンブリ。
- 前記半導体モジュール(20a)および冷却器(30a)は円形である、請求項1から8のいずれか一項に記載の半導体アセンブリ。
- 前記クランピングアセンブリ(40)は、前記スタックの第1の側面上に力を及ぼすように適合される第1のクランピングエレメント(44a)と、前記スタックの第2の側面上に力を及ぼすように適合される第2のクランピングアセンブリ(44b)とを備える、請求項1から9のいずれか一項に記載の半導体アセンブリ。
- 電気機器(60)の一部を備え、前記導電部(42)は第1の端部(42a)において前記スタック(38)の前記第1の側面に電気的に接続され、第2の端部(42b)において前記電気機器(60)の一部の第1の極(−DC)に電気的および機械的に接続される、請求項1から9のいずれか一項に記載の半導体アセンブリ。
- 前記電気機器(60)の一部はコンデンサである、請求項1に記載の半導体アセンブリ。
- 前記スタック(38)は複数の半導体モジュール(20a−20d)および複数の冷却器(30a−30e)を備え、前記半導体モジュールの各々(20a−20d)は前記冷却器(30a−30e)の2つの間に設けられている、請求項1から12のいずれか一項に記載の半導体アセンブリ。
- 前記スタック(38)は2つの半導体モジュール(20a、20b)および3つの冷却器(30a−30c)を備える、請求項13に記載の半導体アセンブリ。
- 前記3つの冷却器の中央に位置する第2の冷却器(30b)への電気的接続のために設けられた接続を備える、請求項14に記載の半導体アセンブリ。
- 前記クランピングアセンブリ(40)は前記クランピングアセンブリの第1の端部(42a)においてバネパッケージ(46)を備える、請求項1から15のいずれか一項に記載の半導体アセンブリ。
- 前記半導体モジュール(20a−20d)は高電圧半導体を備える、請求項1から16のいずれか一項に記載の半導体アセンブリ。
- 前記半導体モジュール(20a−20d)は絶縁ゲートバイポーラトランジスタを備える、請求項17に記載の半導体アセンブリ。
- 前面(60a)に複数の端子(−DC、+DC)を有し、バスバー(42)を受けるための手段を備える、電気機器の一部(60)。
- バスバー(42)を受けるための前記手段はねじ山を備える、請求項19に記載の電気機器(60)の一部。
- バスバー(42)を受けるための前記手段は前記電気機器(60)の一部の電気的接続に電気的に接続される、請求項19または20に記載の電気機器(60)の一部。
- 前記電気機器(60)の一部はコンデンサである、請求項19から21のいずれかに記載の電気機器(60)の一部。
- 前記前面(60a)上に設けられた絶縁シートを備える、請求項19から22のいずれかに記載の電気機器(60)の一部。
- バスバーを受けるための前記手段に接続された請求項1から18のいずれか一項に記載の半導体アセンブリを備える、請求項19から23のいずれかに記載の電気機器(60)の一部。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/EP2012/074722 WO2014086427A1 (en) | 2012-12-07 | 2012-12-07 | Semiconductor assembly |
Publications (2)
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JP2016500474A true JP2016500474A (ja) | 2016-01-12 |
JP6125657B2 JP6125657B2 (ja) | 2017-05-10 |
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JP2015545677A Active JP6125657B2 (ja) | 2012-12-07 | 2012-12-07 | 半導体アセンブリ |
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US (1) | US9984953B2 (ja) |
EP (1) | EP2929562B1 (ja) |
JP (1) | JP6125657B2 (ja) |
CN (1) | CN104981901B (ja) |
WO (1) | WO2014086427A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10770420B2 (en) | 2016-09-07 | 2020-09-08 | Mitsubishi Electric Corporation | Semiconductor device |
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Publication number | Priority date | Publication date | Assignee | Title |
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AU2015393305B2 (en) * | 2015-04-27 | 2018-11-15 | Toshiba Energy Systems & Solutions Corporation | Pressure-contact type semiconductor element stack |
DE102015218151A1 (de) * | 2015-09-22 | 2017-03-23 | Conti Temic Microelectronic Gmbh | Leistungsmodul, Wechselrichter und elektrische Antriebsanordnung mit einem Leistungsmodul |
DE102015122250A1 (de) * | 2015-12-18 | 2017-06-22 | Karlsruher Institut für Technologie | Multifunktionale Modulverbindungsstruktur |
WO2018050713A1 (en) | 2016-09-15 | 2018-03-22 | Rise Acreo Ab | Press-pack power module |
US10178813B2 (en) * | 2017-01-26 | 2019-01-08 | The United States Of America As Represented By The Secretary Of The Army | Stacked power module with integrated thermal management |
JP6973256B2 (ja) * | 2018-04-12 | 2021-11-24 | トヨタ自動車株式会社 | 半導体装置 |
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WO2012085952A1 (en) * | 2010-12-22 | 2012-06-28 | Pellini S.P.A. | Assembly for the heat dissipation and the electrical connection of current-rectifier button diodes |
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US3445737A (en) * | 1967-01-20 | 1969-05-20 | Int Rectifier Corp | Unitary full wave rectifier plate |
DE3711192A1 (de) | 1987-04-02 | 1988-10-13 | Bosch Gmbh Robert | Lager- und kuehleinrichtung fuer gleichrichterdioden bei elektrischen maschinen |
US5119175A (en) * | 1990-08-17 | 1992-06-02 | Westinghouse Electric Corp. | High power density solid-state, insulating coolant module |
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JP6125657B2 (ja) | 2017-05-10 |
CN104981901B (zh) | 2018-05-15 |
EP2929562A1 (en) | 2015-10-14 |
US9984953B2 (en) | 2018-05-29 |
US20160329264A1 (en) | 2016-11-10 |
WO2014086427A1 (en) | 2014-06-12 |
CN104981901A (zh) | 2015-10-14 |
EP2929562B1 (en) | 2021-04-28 |
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