JP2016221929A5 - - Google Patents

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Publication number
JP2016221929A5
JP2016221929A5 JP2015113320A JP2015113320A JP2016221929A5 JP 2016221929 A5 JP2016221929 A5 JP 2016221929A5 JP 2015113320 A JP2015113320 A JP 2015113320A JP 2015113320 A JP2015113320 A JP 2015113320A JP 2016221929 A5 JP2016221929 A5 JP 2016221929A5
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JP
Japan
Prior art keywords
resin composite
composite material
laser light
curing
pressurizing
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Application number
JP2015113320A
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English (en)
Japanese (ja)
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JP6742697B2 (ja
JP2016221929A (ja
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Application filed filed Critical
Priority claimed from JP2015113320A external-priority patent/JP6742697B2/ja
Priority to JP2015113320A priority Critical patent/JP6742697B2/ja
Priority to PCT/JP2016/065167 priority patent/WO2016194676A1/ja
Priority to US15/560,347 priority patent/US20180250852A1/en
Priority to EP16803111.0A priority patent/EP3260263A4/en
Priority to CN201680016721.9A priority patent/CN107428039A/zh
Publication of JP2016221929A publication Critical patent/JP2016221929A/ja
Publication of JP2016221929A5 publication Critical patent/JP2016221929A5/ja
Publication of JP6742697B2 publication Critical patent/JP6742697B2/ja
Application granted granted Critical
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JP2015113320A 2015-06-03 2015-06-03 樹脂複合材料の硬化装置、および硬化方法 Active JP6742697B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015113320A JP6742697B2 (ja) 2015-06-03 2015-06-03 樹脂複合材料の硬化装置、および硬化方法
CN201680016721.9A CN107428039A (zh) 2015-06-03 2016-05-23 树脂复合材料的固化装置、固化方法及树脂成型品
US15/560,347 US20180250852A1 (en) 2015-06-03 2016-05-23 Curing device for resin composite material, curing method, and molded resin article
EP16803111.0A EP3260263A4 (en) 2015-06-03 2016-05-23 Curing device for resin composite material, curing method, and molded resin article
PCT/JP2016/065167 WO2016194676A1 (ja) 2015-06-03 2016-05-23 樹脂複合材料の硬化装置、硬化方法、および樹脂成形品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015113320A JP6742697B2 (ja) 2015-06-03 2015-06-03 樹脂複合材料の硬化装置、および硬化方法

Publications (3)

Publication Number Publication Date
JP2016221929A JP2016221929A (ja) 2016-12-28
JP2016221929A5 true JP2016221929A5 (enExample) 2018-05-24
JP6742697B2 JP6742697B2 (ja) 2020-08-19

Family

ID=57441378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015113320A Active JP6742697B2 (ja) 2015-06-03 2015-06-03 樹脂複合材料の硬化装置、および硬化方法

Country Status (5)

Country Link
US (1) US20180250852A1 (enExample)
EP (1) EP3260263A4 (enExample)
JP (1) JP6742697B2 (enExample)
CN (1) CN107428039A (enExample)
WO (1) WO2016194676A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8337979B2 (en) 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
EP2385016B1 (en) 2006-05-19 2018-08-08 Massachusetts Institute of Technology Continuous process for the production of nanostructures
WO2019055155A1 (en) 2017-09-15 2019-03-21 Massachusetts Institute Of Technology LOW-RATE MANUFACTURE OF COMPOSITE MATERIAL DEFECTS
US11345790B2 (en) * 2019-08-13 2022-05-31 International Business Machines Corporation Reducing resin squeeze-out
CN111770675B (zh) * 2020-06-19 2022-05-06 深圳市联得自动化装备股份有限公司 制作曲面模组的热压方法和热压设备、曲面模组和应用
CN111844799B (zh) * 2020-07-22 2022-03-29 江苏新扬新材料股份有限公司 一种航空粒子分离器的成型方法
CN117162540B (zh) * 2023-11-02 2024-01-26 湖南科技大学 树脂基复合材料微波超声固化成型装备和固化成型方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148519B2 (ja) * 1994-06-24 2001-03-19 シャープ株式会社 液晶表示素子の製造方法
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
DE19801346C1 (de) * 1998-01-16 1999-02-18 Sonotronic Nagel Gmbh Vorrichtung und Verfahren zum Formprägen eines schmelzfähigen Materials
JP3596421B2 (ja) * 2000-04-26 2004-12-02 トヨタ自動車株式会社 樹脂成形品の高強度化方法
DE50204407D1 (de) * 2002-10-02 2006-02-09 Leister Process Technologies S Verfahren und Vorrichtung zum Verbinden von Werkstücken aus Kunststoff in dreidimensionaler Form mittels Laserstrahl
JP2004148732A (ja) * 2002-10-31 2004-05-27 Sakura Gomme Kk 繊維強化光硬化樹脂成形品の製造装置
US6975788B2 (en) * 2002-12-09 2005-12-13 Lucent Technologies, Inc. Optical switch having combined input/output fiber array
US6906300B2 (en) * 2003-08-13 2005-06-14 The Boeing Company Consolidation device and method
JP2005081396A (ja) * 2003-09-09 2005-03-31 Nissan Motor Co Ltd レーザ溶着装置およびレーザ溶着方法
US7677877B2 (en) * 2005-11-04 2010-03-16 Asml Netherlands B.V. Imprint lithography
JP5408972B2 (ja) * 2008-11-26 2014-02-05 日東電工株式会社 シート接合体作製方法
JP4430131B1 (ja) * 2009-08-10 2010-03-10 静岡県 レーザ溶融接合用ベルト素材及びレーザ接合方法
JP5548579B2 (ja) * 2010-10-15 2014-07-16 日東電工株式会社 偏光フィルムの製造方法
JP5860241B2 (ja) * 2011-08-02 2016-02-16 日東電工株式会社 樹脂部材の接合方法
JP5344415B1 (ja) * 2012-02-14 2013-11-20 精電舎電子工業株式会社 熱可塑性樹脂材の溶着装置、溶着方法、および溶着装置用の押圧ユニット
JP5915370B2 (ja) * 2012-05-16 2016-05-11 ソニー株式会社 電気泳動素子、電気泳動表示装置、電子機器、及び、電気泳動素子の製造方法
CN104968483B (zh) * 2013-02-05 2017-03-08 株式会社日立制作所 激光接合装置及激光接合方法
KR102110839B1 (ko) * 2013-07-24 2020-05-15 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN103660286B (zh) * 2013-11-25 2016-08-24 王瑛玮 一种复合材料制备方法
CN103935044B (zh) * 2014-05-07 2017-01-11 王瑛玮 预浸料激光扫描制备复合材料

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