JP2016213359A5 - - Google Patents

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Publication number
JP2016213359A5
JP2016213359A5 JP2015096999A JP2015096999A JP2016213359A5 JP 2016213359 A5 JP2016213359 A5 JP 2016213359A5 JP 2015096999 A JP2015096999 A JP 2015096999A JP 2015096999 A JP2015096999 A JP 2015096999A JP 2016213359 A5 JP2016213359 A5 JP 2016213359A5
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JP
Japan
Prior art keywords
plasma processing
heater
plasma
output value
value
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JP2015096999A
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English (en)
Japanese (ja)
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JP2016213359A (ja
JP6581387B2 (ja
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Publication of JP2016213359A5 publication Critical patent/JP2016213359A5/ja
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JP2015096999A 2015-05-12 2015-05-12 プラズマ処理装置およびプラズマ処理方法 Active JP6581387B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015096999A JP6581387B2 (ja) 2015-05-12 2015-05-12 プラズマ処理装置およびプラズマ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015096999A JP6581387B2 (ja) 2015-05-12 2015-05-12 プラズマ処理装置およびプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2016213359A JP2016213359A (ja) 2016-12-15
JP2016213359A5 true JP2016213359A5 (https=) 2018-01-18
JP6581387B2 JP6581387B2 (ja) 2019-09-25

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JP2015096999A Active JP6581387B2 (ja) 2015-05-12 2015-05-12 プラズマ処理装置およびプラズマ処理方法

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JP (1) JP6581387B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6983322B2 (ja) 2018-08-02 2021-12-17 株式会社Fuji 大気圧プラズマ発生装置
US20250038019A1 (en) * 2022-09-26 2025-01-30 Hitachi High-Tech Corporation Manufacturing system and method of semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167590A (ja) * 1994-12-13 1996-06-25 Dainippon Screen Mfg Co Ltd プラズマアッシング方法
JP2005116565A (ja) * 2003-10-02 2005-04-28 Hitachi Kokusai Electric Inc 基板処理装置
JP4786925B2 (ja) * 2005-04-04 2011-10-05 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP5203612B2 (ja) * 2007-01-17 2013-06-05 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN101990707B (zh) * 2008-09-30 2013-03-06 东京毅力科创株式会社 基板的异常载置状态的检测方法、基板处理方法、计算机可读取的存储介质以及基板处理装置
JP5616737B2 (ja) * 2009-11-20 2014-10-29 株式会社日立国際電気 半導体装置の製造方法、基板処理方法および基板処理装置
JP2013115403A (ja) * 2011-12-01 2013-06-10 Mitsubishi Heavy Ind Ltd 基板の温度計測装置及び方法、基板の温度調整装置及び方法

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