JP2016207409A5 - - Google Patents

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Publication number
JP2016207409A5
JP2016207409A5 JP2015086682A JP2015086682A JP2016207409A5 JP 2016207409 A5 JP2016207409 A5 JP 2016207409A5 JP 2015086682 A JP2015086682 A JP 2015086682A JP 2015086682 A JP2015086682 A JP 2015086682A JP 2016207409 A5 JP2016207409 A5 JP 2016207409A5
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JP
Japan
Prior art keywords
gas
pipe
processing chamber
mass flow
flow controller
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JP2015086682A
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English (en)
Japanese (ja)
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JP6541406B2 (ja
JP2016207409A (ja
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Publication of JP2016207409A5 publication Critical patent/JP2016207409A5/ja
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Publication of JP6541406B2 publication Critical patent/JP6541406B2/ja
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JP2015086682A 2015-04-21 2015-04-21 プラズマ処理装置 Active JP6541406B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015086682A JP6541406B2 (ja) 2015-04-21 2015-04-21 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015086682A JP6541406B2 (ja) 2015-04-21 2015-04-21 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2016207409A JP2016207409A (ja) 2016-12-08
JP2016207409A5 true JP2016207409A5 (enExample) 2018-02-01
JP6541406B2 JP6541406B2 (ja) 2019-07-10

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ID=57490144

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JP2015086682A Active JP6541406B2 (ja) 2015-04-21 2015-04-21 プラズマ処理装置

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JP (1) JP6541406B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7296854B2 (ja) * 2019-11-07 2023-06-23 東京エレクトロン株式会社 ガス供給方法及び基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070066038A1 (en) * 2004-04-30 2007-03-22 Lam Research Corporation Fast gas switching plasma processing apparatus
JP4782585B2 (ja) * 2006-02-28 2011-09-28 株式会社日立ハイテクノロジーズ プラズマエッチング装置及び方法
JP5235293B2 (ja) * 2006-10-02 2013-07-10 東京エレクトロン株式会社 処理ガス供給機構および処理ガス供給方法ならびにガス処理装置
JP5442413B2 (ja) * 2009-12-03 2014-03-12 ルネサスエレクトロニクス株式会社 半導体製造装置および流量制御装置
JP6027490B2 (ja) * 2013-05-13 2016-11-16 東京エレクトロン株式会社 ガスを供給する方法、及びプラズマ処理装置

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