JP2016200459A5 - - Google Patents

Download PDF

Info

Publication number
JP2016200459A5
JP2016200459A5 JP2015079459A JP2015079459A JP2016200459A5 JP 2016200459 A5 JP2016200459 A5 JP 2016200459A5 JP 2015079459 A JP2015079459 A JP 2015079459A JP 2015079459 A JP2015079459 A JP 2015079459A JP 2016200459 A5 JP2016200459 A5 JP 2016200459A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015079459A
Other versions
JP6404172B2 (ja
JP2016200459A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2015079459A external-priority patent/JP6404172B2/ja
Priority to JP2015079459A priority Critical patent/JP6404172B2/ja
Priority to KR1020177031870A priority patent/KR102283692B1/ko
Priority to US15/564,182 priority patent/US10256104B2/en
Priority to SG11201708029SA priority patent/SG11201708029SA/en
Priority to CN201680018290.XA priority patent/CN107429989B/zh
Priority to PCT/JP2016/061100 priority patent/WO2016163352A1/ja
Priority to TW105110866A priority patent/TWI661174B/zh
Publication of JP2016200459A publication Critical patent/JP2016200459A/ja
Publication of JP2016200459A5 publication Critical patent/JP2016200459A5/ja
Publication of JP6404172B2 publication Critical patent/JP6404172B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2015079459A 2015-04-08 2015-04-08 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置 Active JP6404172B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015079459A JP6404172B2 (ja) 2015-04-08 2015-04-08 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
CN201680018290.XA CN107429989B (zh) 2015-04-08 2016-04-05 膜厚测定方法、膜厚测定装置、研磨方法及研磨装置
US15/564,182 US10256104B2 (en) 2015-04-08 2016-04-05 Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus
SG11201708029SA SG11201708029SA (en) 2015-04-08 2016-04-05 Film-thickness measuring method, film-thickness measuring apparatus, polishing method, and polishing apparatus
KR1020177031870A KR102283692B1 (ko) 2015-04-08 2016-04-05 막 두께 측정 방법, 막 두께 측정 장치, 연마 방법 및 연마 장치
PCT/JP2016/061100 WO2016163352A1 (ja) 2015-04-08 2016-04-05 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
TW105110866A TWI661174B (zh) 2015-04-08 2016-04-07 膜厚測定方法、膜厚測定裝置、研磨方法及研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015079459A JP6404172B2 (ja) 2015-04-08 2015-04-08 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置

Publications (3)

Publication Number Publication Date
JP2016200459A JP2016200459A (ja) 2016-12-01
JP2016200459A5 true JP2016200459A5 (ja) 2017-12-14
JP6404172B2 JP6404172B2 (ja) 2018-10-10

Family

ID=57072616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015079459A Active JP6404172B2 (ja) 2015-04-08 2015-04-08 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置

Country Status (7)

Country Link
US (1) US10256104B2 (ja)
JP (1) JP6404172B2 (ja)
KR (1) KR102283692B1 (ja)
CN (1) CN107429989B (ja)
SG (1) SG11201708029SA (ja)
TW (1) TWI661174B (ja)
WO (1) WO2016163352A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6404172B2 (ja) * 2015-04-08 2018-10-10 株式会社荏原製作所 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
CN107036539B (zh) * 2017-06-14 2018-07-13 深圳中科飞测科技有限公司 膜厚测量系统及方法
JP7023062B2 (ja) * 2017-07-24 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP6912045B2 (ja) * 2018-07-17 2021-07-28 株式会社システムロード 膜厚測定方法およびその装置
KR102091419B1 (ko) * 2018-07-19 2020-03-20 주식회사 케이씨텍 광투과성 연마층을 갖는 기판 연마 시스템
US20200033723A1 (en) * 2018-07-30 2020-01-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Manufacturing Apparatus and Method Thereof
JP7210200B2 (ja) * 2018-09-21 2023-01-23 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた研削装置
JP7403998B2 (ja) * 2019-08-29 2023-12-25 株式会社荏原製作所 研磨装置および研磨方法
WO2021181545A1 (ja) * 2020-03-11 2021-09-16 株式会社日立ハイテク プラズマ処理装置及びプラズマ処理方法
KR20230048655A (ko) * 2021-10-05 2023-04-12 삼성전자주식회사 웨이퍼 검사 방법 및 이를 수행하기 위한 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000292128A (ja) 1999-04-12 2000-10-20 Sumitomo Electric Ind Ltd 半導体薄膜の膜厚測定装置および膜厚測定方法ならびに半導体ウェハおよびその製造方法
JP2002071319A (ja) * 2000-09-01 2002-03-08 Seiko Epson Corp セル厚検出方法、セル厚制御システム及び液晶装置の製造方法
JP2002277220A (ja) * 2001-03-19 2002-09-25 Hitachi Ltd 膜厚計測のための計測点決定方法およびそれを用いた薄膜デバイスの製造方法並びに薄膜デバイスの製造装置
JP4551035B2 (ja) 2001-08-22 2010-09-22 新日本製鐵株式会社 導電体の厚み測定装置
JP3941863B2 (ja) * 2002-03-27 2007-07-04 株式会社トプコン 表面検査方法及び表面検査装置
KR100568703B1 (ko) * 2004-08-10 2006-04-07 삼성전자주식회사 금속막의 두께 측정 방법 및 이를 수행하기 위한 장치
CN1877298A (zh) * 2006-07-05 2006-12-13 中国科学院上海光学精密机械研究所 膜层光谱的实时测量装置及其测量方法
JP4834847B2 (ja) * 2007-10-05 2011-12-14 大塚電子株式会社 多層膜解析装置および多層膜解析方法
US7649634B2 (en) * 2007-10-30 2010-01-19 Mountain View Optical Consultant Corp. Methods and systems for white light interferometry and characterization of films
JP5309359B2 (ja) * 2008-06-20 2013-10-09 大塚電子株式会社 膜厚測定装置および膜厚測定方法
JP6005467B2 (ja) * 2011-10-26 2016-10-12 株式会社荏原製作所 研磨方法および研磨装置
JP2013222856A (ja) * 2012-04-17 2013-10-28 Ebara Corp 研磨装置および研磨方法
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
JP5903135B2 (ja) * 2014-08-04 2016-04-13 株式会社東京精密 研磨終点検出装置、及び研磨終点検出方法
JP6404172B2 (ja) 2015-04-08 2018-10-10 株式会社荏原製作所 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置

Similar Documents

Publication Publication Date Title
JP2016200459A5 (ja)
BR112018005507A2 (ja)
BR112018004093A2 (ja)
BR122019018870A8 (ja)
BE2015C047I2 (ja)
BE2015C044I2 (ja)
BR0002694B1 (ja)
BR0009942B1 (ja)
CN303088648S (ja)
BR0000126B1 (ja)
BR0000763F1 (ja)
BR9908011B1 (ja)
CN303089720S (ja)
BR0001536B1 (ja)
BR0001684B1 (ja)
BR0001810B1 (ja)
BR0002033B1 (ja)
BR0005085B1 (ja)
CN303091142S (ja)
BR0203845B1 (ja)
BR0016704B1 (ja)
BR0002402B1 (ja)
BR0002435B1 (ja)
BR0010150B1 (ja)
BR0000695B1 (ja)