JP2016197738A - 光散乱層を有するled組立体 - Google Patents
光散乱層を有するled組立体 Download PDFInfo
- Publication number
- JP2016197738A JP2016197738A JP2016129893A JP2016129893A JP2016197738A JP 2016197738 A JP2016197738 A JP 2016197738A JP 2016129893 A JP2016129893 A JP 2016129893A JP 2016129893 A JP2016129893 A JP 2016129893A JP 2016197738 A JP2016197738 A JP 2016197738A
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- Prior art keywords
- layer
- light scattering
- scattering layer
- led
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000149 argon plasma sintering Methods 0.000 title claims abstract description 46
- 239000000463 material Substances 0.000 claims abstract description 18
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 claims description 2
- -1 preferably Inorganic materials 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 19
- 238000002834 transmittance Methods 0.000 description 15
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000411 transmission spectrum Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004140 HfO Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Devices (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
− 前記光散乱層と、前記光散乱層に隣接する前記フィルタ層の材料との間の屈折率における差Δnが、Δn≧0.2、好ましくは、Δn≧0.3であり、
− 前記光散乱層と、前記LEDの方向に前記光散乱層に隣接する層の材料との間の屈折率における差Δnが、Δn≧0.2、好ましくは、Δn≧0.3であり、
− 前記光散乱層の厚さDと、前記光散乱層の屈折率nとの積が、1900nm≧n*D≧400nmであるLED組立体が提供される。
− 前記光散乱層を用いることで、角度一様性にわたって望ましい色のためのパッケージ効率が高められるという利点、
− より広範囲の表面粗さの前記変換層又は基板層が用いられ得るという利点、及び
− 前記LED組立体が、改善された色ターゲッティング能力を示すという利点のうちの少なくとも1つを持つことが明らかになった。
オフィス照明システム、
家庭用アプリケーションシステム、
店舗照明システム、
家庭用照明システム、
アクセント照明システム、
スポット照明システム、
劇場照明システム、
光ファイバアプリケーションシステム、
投影システム、
自己照明ディスプレイシステム、
画素化ディスプレイシステム、
セグメント化ディスプレイシステム、
警告標識システム、
医療用照明アプリケーションシステム、
インジケータサインシステム、
装飾用照明システム、
携帯用システム、
自動車用アプリケーション、及び
温室照明システムといったアプリケーションのうちの1つ以上において用いられるシステムに関する。
例I
例II
例III
例IV
例V
例VI
例VII
例VIII
例IX
表I:例Iの構成
Claims (5)
- LEDチップ、
蛍光体層、
フィルタ層であり、当該フィルタ層における法線に対する放射角度に依存して、前記LEDチップから発せられる光を少なくとも部分的に反射するように構成されたフィルタ層、及び
前記LEDチップによって発せられる光の経路中の、前記蛍光体層と前記フィルタ層との間に設けられる光散乱層
を有し、
前記光散乱層と、前記光散乱層に隣接する前記フィルタ層の材料との間の屈折率における差Δnが、Δn≧0.2であり、
前記光散乱層と、前記LEDの方向に前記光散乱層に隣接する層の材料との間の屈折率における差Δnが、Δn≧0.2であり、
前記光散乱層の厚さDと、前記光散乱層の屈折率nとの積が、1900nm≧n*D≧400nmであり、
前記光散乱層の厚さDが、800nm≧D≧300nmである、
LED組立体。 - 1400nm≧n*D≧1000nm、好ましくは、1200nm≧n*D≧1100nmである請求項1に記載のLED組立体。
- 前記光散乱層の材料が、基本的に、無機酸化物を有するグループから選ばれ、好ましくは、ZrO2、Y2O3、Ta2O5、Nb2O5、SiO2、TiO2、Al2O3、HfO2又はそれらの混合物を有するグループから選ばれる請求項1又は2に記載のLED組立体。
- 前記フィルタ層が、交互の低屈折率材料及び高屈折率材料の誘電体層コーティングを有する請求項1乃至3のいずれか一項に記載のLED組立体。
- 請求項1乃至4のいずれか一項に記載のLED組立体を有するシステムであって、
オフィス照明システム、
家庭用アプリケーションシステム、
店舗照明システム、
家庭用照明システム、
アクセント照明システム、
スポット照明システム、
劇場照明システム、
光ファイバアプリケーションシステム、
投影システム、
自己照明ディスプレイシステム、
画素化ディスプレイシステム、
セグメント化ディスプレイシステム、
警告標識システム、
医療用照明アプリケーションシステム、
インジケータサインシステム、
装飾用照明システム、
携帯用システム、
自動車用アプリケーション、及び
温室照明システムといったアプリケーションのうちの1つ以上において用いられるシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11152838.6 | 2011-02-01 | ||
EP11152838A EP2482350A1 (en) | 2011-02-01 | 2011-02-01 | LED assembly comprising a light scattering layer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013550984A Division JP2014504030A (ja) | 2011-02-01 | 2012-01-24 | 光散乱層を有するled組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016197738A true JP2016197738A (ja) | 2016-11-24 |
JP6646536B2 JP6646536B2 (ja) | 2020-02-14 |
Family
ID=44144732
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013550984A Pending JP2014504030A (ja) | 2011-02-01 | 2012-01-24 | 光散乱層を有するled組立体 |
JP2016129893A Active JP6646536B2 (ja) | 2011-02-01 | 2016-06-30 | 光散乱層を有するled組立体 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013550984A Pending JP2014504030A (ja) | 2011-02-01 | 2012-01-24 | 光散乱層を有するled組立体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9214609B2 (ja) |
EP (2) | EP2482350A1 (ja) |
JP (2) | JP2014504030A (ja) |
KR (1) | KR102066063B1 (ja) |
CN (1) | CN103329294B (ja) |
RU (1) | RU2586268C2 (ja) |
WO (1) | WO2012104744A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013144927A1 (en) * | 2012-03-30 | 2013-10-03 | Koninklijke Philips N.V. | Optical cavity including a light emitting device and wavelength converting material |
DE102014112973A1 (de) * | 2014-09-09 | 2016-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
KR102252994B1 (ko) | 2014-12-18 | 2021-05-20 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지용 파장 변환 필름 |
KR102415331B1 (ko) | 2015-08-26 | 2022-06-30 | 삼성전자주식회사 | 발광 소자 패키지, 및 이를 포함하는 장치 |
CN109411590B (zh) * | 2017-08-17 | 2020-01-07 | 光宝光电(常州)有限公司 | 发光二极管结构及发光单元 |
US11335835B2 (en) * | 2017-12-20 | 2022-05-17 | Lumileds Llc | Converter fill for LED array |
US10686596B2 (en) | 2018-03-01 | 2020-06-16 | Microsoft Technology Licensing, Llc | Mutually authenticated adaptive management interfaces for interaction with sensitive infrastructure |
KR20200051197A (ko) * | 2018-11-05 | 2020-05-13 | 삼성전자주식회사 | 발광 소자 |
JP2023134141A (ja) * | 2022-03-14 | 2023-09-27 | スタンレー電気株式会社 | 半導体発光装置およびそれを備えた車両用灯具 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261540A (ja) * | 2005-03-18 | 2006-09-28 | Stanley Electric Co Ltd | 発光デバイス |
WO2010064177A1 (en) * | 2008-12-02 | 2010-06-10 | Philips Intellectual Property & Standards Gmbh | Led assembly |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101361202B (zh) * | 2006-01-16 | 2010-12-08 | 松下电器产业株式会社 | 半导体发光装置 |
DE102006051746A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht |
US7521862B2 (en) * | 2006-11-20 | 2009-04-21 | Philips Lumileds Lighting Co., Llc | Light emitting device including luminescent ceramic and light-scattering material |
BRPI1007686B1 (pt) * | 2009-05-19 | 2019-11-05 | Koninl Philips Electronics Nv | sistema de iluminação |
US20110012147A1 (en) * | 2009-07-15 | 2011-01-20 | Koninklijke Philips Electronics N.V. | Wavelength-converted semiconductor light emitting device including a filter and a scattering structure |
RU2402108C1 (ru) * | 2009-11-09 | 2010-10-20 | Владимир Семенович Абрамов | Светодиодный источник излучения для систем управления транспортом |
EP2323184A1 (en) | 2009-11-13 | 2011-05-18 | Koninklijke Philips Electronics N.V. | LED assembly |
-
2011
- 2011-02-01 EP EP11152838A patent/EP2482350A1/en not_active Withdrawn
-
2012
- 2012-01-24 CN CN201280007301.6A patent/CN103329294B/zh active Active
- 2012-01-24 WO PCT/IB2012/050322 patent/WO2012104744A1/en active Application Filing
- 2012-01-24 KR KR1020137023008A patent/KR102066063B1/ko active IP Right Grant
- 2012-01-24 EP EP12701956.0A patent/EP2671266B1/en active Active
- 2012-01-24 RU RU2013140419/28A patent/RU2586268C2/ru active
- 2012-01-24 US US13/976,479 patent/US9214609B2/en active Active
- 2012-01-24 JP JP2013550984A patent/JP2014504030A/ja active Pending
-
2016
- 2016-06-30 JP JP2016129893A patent/JP6646536B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261540A (ja) * | 2005-03-18 | 2006-09-28 | Stanley Electric Co Ltd | 発光デバイス |
WO2010064177A1 (en) * | 2008-12-02 | 2010-06-10 | Philips Intellectual Property & Standards Gmbh | Led assembly |
Also Published As
Publication number | Publication date |
---|---|
US9214609B2 (en) | 2015-12-15 |
WO2012104744A1 (en) | 2012-08-09 |
JP6646536B2 (ja) | 2020-02-14 |
EP2671266A1 (en) | 2013-12-11 |
CN103329294B (zh) | 2016-08-10 |
RU2586268C2 (ru) | 2016-06-10 |
KR102066063B1 (ko) | 2020-01-15 |
US20130299865A1 (en) | 2013-11-14 |
EP2482350A1 (en) | 2012-08-01 |
RU2013140419A (ru) | 2015-03-10 |
CN103329294A (zh) | 2013-09-25 |
JP2014504030A (ja) | 2014-02-13 |
KR20140004745A (ko) | 2014-01-13 |
EP2671266B1 (en) | 2016-07-20 |
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