JP2016186528A5 - - Google Patents

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Publication number
JP2016186528A5
JP2016186528A5 JP2015065935A JP2015065935A JP2016186528A5 JP 2016186528 A5 JP2016186528 A5 JP 2016186528A5 JP 2015065935 A JP2015065935 A JP 2015065935A JP 2015065935 A JP2015065935 A JP 2015065935A JP 2016186528 A5 JP2016186528 A5 JP 2016186528A5
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JP
Japan
Prior art keywords
electro
optical device
translucent cover
substrate
metal part
Prior art date
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Application number
JP2015065935A
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English (en)
Japanese (ja)
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JP6520299B2 (ja
JP2016186528A (ja
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Publication date
Priority claimed from JP2015065935A external-priority patent/JP6520299B2/ja
Priority to JP2015065935A priority Critical patent/JP6520299B2/ja
Application filed filed Critical
Priority to US15/017,746 priority patent/US9465210B1/en
Priority to CN201610162769.2A priority patent/CN106019579B/zh
Priority to US15/259,937 priority patent/US9885945B2/en
Publication of JP2016186528A publication Critical patent/JP2016186528A/ja
Priority to US15/856,675 priority patent/US10156779B2/en
Publication of JP2016186528A5 publication Critical patent/JP2016186528A5/ja
Publication of JP6520299B2 publication Critical patent/JP6520299B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015065935A 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、および電子機器 Active JP6520299B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015065935A JP6520299B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、および電子機器
US15/017,746 US9465210B1 (en) 2015-03-27 2016-02-08 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
CN201610162769.2A CN106019579B (zh) 2015-03-27 2016-03-21 电光学装置、电光学装置的制造方法以及电子设备
US15/259,937 US9885945B2 (en) 2015-03-27 2016-09-08 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
US15/856,675 US10156779B2 (en) 2015-03-27 2017-12-28 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015065935A JP6520299B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、および電子機器

Publications (3)

Publication Number Publication Date
JP2016186528A JP2016186528A (ja) 2016-10-27
JP2016186528A5 true JP2016186528A5 (enExample) 2018-04-19
JP6520299B2 JP6520299B2 (ja) 2019-05-29

Family

ID=56976168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015065935A Active JP6520299B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、および電子機器

Country Status (3)

Country Link
US (3) US9465210B1 (enExample)
JP (1) JP6520299B2 (enExample)
CN (1) CN106019579B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184068A (ja) 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
DE102015222508A1 (de) * 2015-11-16 2017-05-18 Robert Bosch Gmbh Mikromechanisches Bauteil, Beleuchtungsvorrichtung und entsprechendes Herstellungsverfahren

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09166790A (ja) * 1995-09-13 1997-06-24 Canon Inc 表示装置
KR100332967B1 (ko) * 2000-05-10 2002-04-19 윤종용 디지털 마이크로-미러 디바이스 패키지의 제조 방법
JP2003175500A (ja) * 2001-12-11 2003-06-24 Sony Corp マイクロパッケージ構造
US6639313B1 (en) * 2002-03-20 2003-10-28 Analog Devices, Inc. Hermetic seals for large optical packages and the like
US6894853B2 (en) * 2002-05-10 2005-05-17 Texas Instruments Incorporated Stress relieved frame
JP4342174B2 (ja) 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
US7002727B2 (en) * 2003-03-31 2006-02-21 Reflectivity, Inc. Optical materials in packaging micromirror devices
US20060131600A1 (en) * 2004-03-05 2006-06-22 Junichi Nakaoka Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
KR20070007422A (ko) * 2005-07-11 2007-01-16 호서대학교 산학협력단 디지털 미세거울표시소자 패키지
JP4906496B2 (ja) * 2006-12-25 2012-03-28 新光電気工業株式会社 半導体パッケージ
JP5330697B2 (ja) * 2007-03-19 2013-10-30 株式会社リコー 機能素子のパッケージ及びその製造方法
CN101398601B (zh) * 2007-09-28 2010-11-10 鸿富锦精密工业（深圳）有限公司 散热装置
US7898724B2 (en) 2008-11-05 2011-03-01 Texas Instruments Incorporated Thermal conduction by encapsulation
EP2769956B1 (en) * 2013-02-20 2016-08-24 Harman Becker Automotive Systems GmbH Circuit board comprising spatial light modulator
JP6141684B2 (ja) * 2013-05-29 2017-06-07 真一 隣 半導体素子および半導体素子の製造方法
TWI794098B (zh) * 2013-09-06 2023-02-21 日商半導體能源研究所股份有限公司 發光裝置以及發光裝置的製造方法
CN203858412U (zh) * 2014-06-06 2014-10-01 台达电子工业股份有限公司 数字微镜装置及其遮光散热组件

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