CN106019579B - 电光学装置、电光学装置的制造方法以及电子设备 - Google Patents
电光学装置、电光学装置的制造方法以及电子设备 Download PDFInfo
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- CN106019579B CN106019579B CN201610162769.2A CN201610162769A CN106019579B CN 106019579 B CN106019579 B CN 106019579B CN 201610162769 A CN201610162769 A CN 201610162769A CN 106019579 B CN106019579 B CN 106019579B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
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- 238000000034 method Methods 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 31
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
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- 229910052709 silver Inorganic materials 0.000 description 21
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000007257 malfunction Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000004904 shortening Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
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- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
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- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0081—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2066—Reflectors in illumination beam
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Projection Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015065935A JP6520299B2 (ja) | 2015-03-27 | 2015-03-27 | 電気光学装置、電気光学装置の製造方法、および電子機器 |
| JP2015-065935 | 2015-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106019579A CN106019579A (zh) | 2016-10-12 |
| CN106019579B true CN106019579B (zh) | 2020-07-24 |
Family
ID=56976168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610162769.2A Active CN106019579B (zh) | 2015-03-27 | 2016-03-21 | 电光学装置、电光学装置的制造方法以及电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US9465210B1 (enExample) |
| JP (1) | JP6520299B2 (enExample) |
| CN (1) | CN106019579B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016184068A (ja) | 2015-03-26 | 2016-10-20 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、および電子機器 |
| DE102015222508A1 (de) * | 2015-11-16 | 2017-05-18 | Robert Bosch Gmbh | Mikromechanisches Bauteil, Beleuchtungsvorrichtung und entsprechendes Herstellungsverfahren |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6639313B1 (en) * | 2002-03-20 | 2003-10-28 | Analog Devices, Inc. | Hermetic seals for large optical packages and the like |
| US6894853B2 (en) * | 2002-05-10 | 2005-05-17 | Texas Instruments Incorporated | Stress relieved frame |
| KR20070007422A (ko) * | 2005-07-11 | 2007-01-16 | 호서대학교 산학협력단 | 디지털 미세거울표시소자 패키지 |
| CN101398601A (zh) * | 2007-09-28 | 2009-04-01 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
| CN103996674A (zh) * | 2013-02-20 | 2014-08-20 | 哈曼贝克自动系统股份有限公司 | 电子组件 |
| CN203858412U (zh) * | 2014-06-06 | 2014-10-01 | 台达电子工业股份有限公司 | 数字微镜装置及其遮光散热组件 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09166790A (ja) * | 1995-09-13 | 1997-06-24 | Canon Inc | 表示装置 |
| KR100332967B1 (ko) * | 2000-05-10 | 2002-04-19 | 윤종용 | 디지털 마이크로-미러 디바이스 패키지의 제조 방법 |
| JP2003175500A (ja) * | 2001-12-11 | 2003-06-24 | Sony Corp | マイクロパッケージ構造 |
| JP4342174B2 (ja) | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
| US7002727B2 (en) * | 2003-03-31 | 2006-02-21 | Reflectivity, Inc. | Optical materials in packaging micromirror devices |
| US20060131600A1 (en) * | 2004-03-05 | 2006-06-22 | Junichi Nakaoka | Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member |
| JP4906496B2 (ja) * | 2006-12-25 | 2012-03-28 | 新光電気工業株式会社 | 半導体パッケージ |
| JP5330697B2 (ja) * | 2007-03-19 | 2013-10-30 | 株式会社リコー | 機能素子のパッケージ及びその製造方法 |
| US7898724B2 (en) | 2008-11-05 | 2011-03-01 | Texas Instruments Incorporated | Thermal conduction by encapsulation |
| JP6141684B2 (ja) * | 2013-05-29 | 2017-06-07 | 真一 隣 | 半導体素子および半導体素子の製造方法 |
| TWI794098B (zh) * | 2013-09-06 | 2023-02-21 | 日商半導體能源研究所股份有限公司 | 發光裝置以及發光裝置的製造方法 |
-
2015
- 2015-03-27 JP JP2015065935A patent/JP6520299B2/ja active Active
-
2016
- 2016-02-08 US US15/017,746 patent/US9465210B1/en active Active
- 2016-03-21 CN CN201610162769.2A patent/CN106019579B/zh active Active
- 2016-09-08 US US15/259,937 patent/US9885945B2/en active Active
-
2017
- 2017-12-28 US US15/856,675 patent/US10156779B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6639313B1 (en) * | 2002-03-20 | 2003-10-28 | Analog Devices, Inc. | Hermetic seals for large optical packages and the like |
| US6894853B2 (en) * | 2002-05-10 | 2005-05-17 | Texas Instruments Incorporated | Stress relieved frame |
| KR20070007422A (ko) * | 2005-07-11 | 2007-01-16 | 호서대학교 산학협력단 | 디지털 미세거울표시소자 패키지 |
| CN101398601A (zh) * | 2007-09-28 | 2009-04-01 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
| CN103996674A (zh) * | 2013-02-20 | 2014-08-20 | 哈曼贝克自动系统股份有限公司 | 电子组件 |
| CN203858412U (zh) * | 2014-06-06 | 2014-10-01 | 台达电子工业股份有限公司 | 数字微镜装置及其遮光散热组件 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160282610A1 (en) | 2016-09-29 |
| US20180120681A1 (en) | 2018-05-03 |
| JP6520299B2 (ja) | 2019-05-29 |
| US9465210B1 (en) | 2016-10-11 |
| CN106019579A (zh) | 2016-10-12 |
| US9885945B2 (en) | 2018-02-06 |
| US20160377965A1 (en) | 2016-12-29 |
| JP2016186528A (ja) | 2016-10-27 |
| US10156779B2 (en) | 2018-12-18 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |