JP2016174328A - ウェーハの製造方法及びウェーハ - Google Patents
ウェーハの製造方法及びウェーハ Download PDFInfo
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- JP2016174328A JP2016174328A JP2015054404A JP2015054404A JP2016174328A JP 2016174328 A JP2016174328 A JP 2016174328A JP 2015054404 A JP2015054404 A JP 2015054404A JP 2015054404 A JP2015054404 A JP 2015054404A JP 2016174328 A JP2016174328 A JP 2016174328A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000013078 crystal Substances 0.000 claims abstract description 37
- 239000010453 quartz Substances 0.000 claims description 54
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 54
- 235000012431 wafers Nutrition 0.000 claims description 54
- 230000001681 protective effect Effects 0.000 claims description 17
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 description 52
- 239000002184 metal Substances 0.000 description 52
- 238000000034 method Methods 0.000 description 33
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910018487 Ni—Cr Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015054404A JP2016174328A (ja) | 2015-03-18 | 2015-03-18 | ウェーハの製造方法及びウェーハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015054404A JP2016174328A (ja) | 2015-03-18 | 2015-03-18 | ウェーハの製造方法及びウェーハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016174328A true JP2016174328A (ja) | 2016-09-29 |
| JP2016174328A5 JP2016174328A5 (enrdf_load_stackoverflow) | 2018-04-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015054404A Withdrawn JP2016174328A (ja) | 2015-03-18 | 2015-03-18 | ウェーハの製造方法及びウェーハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2016174328A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100700150B1 (ko) * | 2004-10-06 | 2007-03-29 | 주식회사 미래엔지니어링 | 오·폐수 중 질소제거장치 및 이를 이용한 질소제거방법 |
| CN111074227A (zh) * | 2019-11-21 | 2020-04-28 | 南京中电熊猫晶体科技有限公司 | 一种用于弥补单面刻蚀不对称性的镀膜方法 |
| JP2024021040A (ja) * | 2022-08-02 | 2024-02-15 | 台灣晶技股▲ふん▼有限公司 | 圧電振動素子の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007318350A (ja) * | 2006-05-24 | 2007-12-06 | Epson Toyocom Corp | 圧電振動片及びその製造方法 |
| JP2010258667A (ja) * | 2009-04-23 | 2010-11-11 | Seiko Epson Corp | 電子部品およびその製造方法、圧電振動子およびその製造方法 |
| JP2013042440A (ja) * | 2011-08-19 | 2013-02-28 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013046189A (ja) * | 2011-08-24 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013046085A (ja) * | 2011-08-22 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013143682A (ja) * | 2012-01-11 | 2013-07-22 | Seiko Epson Corp | 圧電振動素子、圧電振動素子の製造方法、圧電振動子、電子デバイス、及び電子機器 |
| JP2013258452A (ja) * | 2012-06-11 | 2013-12-26 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、電子機器、移動体、および振動素子の製造方法 |
-
2015
- 2015-03-18 JP JP2015054404A patent/JP2016174328A/ja not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007318350A (ja) * | 2006-05-24 | 2007-12-06 | Epson Toyocom Corp | 圧電振動片及びその製造方法 |
| JP2010258667A (ja) * | 2009-04-23 | 2010-11-11 | Seiko Epson Corp | 電子部品およびその製造方法、圧電振動子およびその製造方法 |
| JP2013042440A (ja) * | 2011-08-19 | 2013-02-28 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013046085A (ja) * | 2011-08-22 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013046189A (ja) * | 2011-08-24 | 2013-03-04 | Seiko Epson Corp | 圧電振動素子、圧電振動子、電子デバイス、及び電子機器 |
| JP2013143682A (ja) * | 2012-01-11 | 2013-07-22 | Seiko Epson Corp | 圧電振動素子、圧電振動素子の製造方法、圧電振動子、電子デバイス、及び電子機器 |
| JP2013258452A (ja) * | 2012-06-11 | 2013-12-26 | Seiko Epson Corp | 振動素子、振動子、電子デバイス、電子機器、移動体、および振動素子の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100700150B1 (ko) * | 2004-10-06 | 2007-03-29 | 주식회사 미래엔지니어링 | 오·폐수 중 질소제거장치 및 이를 이용한 질소제거방법 |
| CN111074227A (zh) * | 2019-11-21 | 2020-04-28 | 南京中电熊猫晶体科技有限公司 | 一种用于弥补单面刻蚀不对称性的镀膜方法 |
| JP2024021040A (ja) * | 2022-08-02 | 2024-02-15 | 台灣晶技股▲ふん▼有限公司 | 圧電振動素子の製造方法 |
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