JP2016174145A5 - - Google Patents
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- Publication number
- JP2016174145A5 JP2016174145A5 JP2016029418A JP2016029418A JP2016174145A5 JP 2016174145 A5 JP2016174145 A5 JP 2016174145A5 JP 2016029418 A JP2016029418 A JP 2016029418A JP 2016029418 A JP2016029418 A JP 2016029418A JP 2016174145 A5 JP2016174145 A5 JP 2016174145A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor
- bonding layer
- temporary bonding
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 description 23
- 235000012431 wafers Nutrition 0.000 description 22
- 239000000758 substrate Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000000926 separation method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011877 solvent mixture Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/636,981 | 2015-03-03 | ||
| US14/636,981 US9644118B2 (en) | 2015-03-03 | 2015-03-03 | Method of releasably attaching a semiconductor substrate to a carrier |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016174145A JP2016174145A (ja) | 2016-09-29 |
| JP2016174145A5 true JP2016174145A5 (enExample) | 2017-06-15 |
| JP6346209B2 JP6346209B2 (ja) | 2018-06-20 |
Family
ID=55262658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016029418A Active JP6346209B2 (ja) | 2015-03-03 | 2016-02-19 | 一時接合 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9644118B2 (enExample) |
| EP (1) | EP3065166B1 (enExample) |
| JP (1) | JP6346209B2 (enExample) |
| KR (1) | KR101767119B1 (enExample) |
| CN (1) | CN105938801B (enExample) |
| TW (1) | TWI619790B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9296915B1 (en) * | 2015-04-10 | 2016-03-29 | Dow Global Technologies Llc | Toughened arylcyclobutene polymers |
| JP7201342B2 (ja) * | 2018-06-06 | 2023-01-10 | 株式会社ディスコ | ウエーハの加工方法 |
| JP2019220550A (ja) | 2018-06-19 | 2019-12-26 | 株式会社ディスコ | ウエーハの加工方法 |
| CN108734156B (zh) * | 2018-07-27 | 2023-08-15 | 星科金朋半导体（江阴）有限公司 | 一种超薄指纹识别芯片的封装方法及其封装结构 |
| CN108734154B (zh) * | 2018-07-27 | 2023-08-15 | 星科金朋半导体（江阴）有限公司 | 一种超薄指纹识别芯片的封装方法及其封装结构 |
| US12040311B1 (en) * | 2022-12-22 | 2024-07-16 | The Boeing Company | Substrate debonding from bonded part |
| WO2025094887A1 (ja) * | 2023-11-02 | 2025-05-08 | 日産化学株式会社 | 接着剤組成物、積層体、及び加工された半導体基板の製造方法 |
| WO2025205909A1 (ja) * | 2024-03-27 | 2025-10-02 | 日産化学株式会社 | 接着剤組成物、積層体、及び加工された半導体基板の製造方法 |
| WO2025205932A1 (ja) * | 2024-03-27 | 2025-10-02 | 日産化学株式会社 | 接着剤組成物、積層体、及び加工された半導体基板の製造方法 |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4661193A (en) | 1984-08-27 | 1987-04-28 | The Dow Chemical Company | Adhesive compositions for arylcyclobutene monomeric compositions |
| US4812588A (en) | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
| WO1989006253A1 (fr) | 1987-12-25 | 1989-07-13 | Nippon Zeon Co., Ltd. | Derive hydrogene d'un copolymere a ouverture de noyaux et procede de production |
| US5138081A (en) | 1991-04-30 | 1992-08-11 | The Dow Chemical Company | Process for purifying vinylically-unsaturated organosilicon compounds |
| US5136069A (en) | 1991-03-28 | 1992-08-04 | The Dow Chemical Company | Process for preparing vinylically-unsaturated compounds (II) |
| US5854302A (en) | 1993-04-29 | 1998-12-29 | The Dow Chemical Company | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
| DE59408507D1 (de) | 1993-10-06 | 1999-08-26 | Ticona Gmbh | Modifiziertes Cycloolefincopolymer |
| JPH07118619A (ja) * | 1993-10-25 | 1995-05-09 | Sekisui Chem Co Ltd | 水溶性粘着剤組成物 |
| BR9610547A (pt) | 1995-09-12 | 1999-07-06 | Dow Chemical Co | Compostos aromáticos substituídos com etinila síntese polímeros e usos dos mesmos |
| US5874026A (en) * | 1997-12-01 | 1999-02-23 | Calgon Corporation | Method of forming corrosion inhibiting films with hydrogenated benzotriazole derivatives |
| WO2002006377A1 (en) | 2000-07-19 | 2002-01-24 | Dow Global Technologies Inc. | Spin-on-dielectric compositions with coating enhancer |
| US6722950B1 (en) * | 2000-11-07 | 2004-04-20 | Planar Labs Corporation | Method and apparatus for electrodialytic chemical mechanical polishing and deposition |
| JP4565804B2 (ja) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
| PT1568071T (pt) | 2002-11-29 | 2019-06-17 | Fraunhofer Ges Forschung | Pastilha com camada de separação e camada de suporte e seu processo de fabrico |
| US6869894B2 (en) | 2002-12-20 | 2005-03-22 | General Chemical Corporation | Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
| JP2005150235A (ja) | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
| US7541264B2 (en) | 2005-03-01 | 2009-06-02 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
| JP5335443B2 (ja) | 2006-03-01 | 2013-11-06 | シン マテリアルズ アクチェンゲゼルシャフト | ウエハ支持構造体及び該ウエハ支持構造体の製造に用いられる層システム |
| US20080014532A1 (en) | 2006-07-14 | 2008-01-17 | 3M Innovative Properties Company | Laminate body, and method for manufacturing thin substrate using the laminate body |
| US7713835B2 (en) | 2006-10-06 | 2010-05-11 | Brewer Science Inc. | Thermally decomposable spin-on bonding compositions for temporary wafer bonding |
| US20080200011A1 (en) * | 2006-10-06 | 2008-08-21 | Pillalamarri Sunil K | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach |
| JP5863157B2 (ja) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | 粘着シート |
| JP5256641B2 (ja) | 2007-04-06 | 2013-08-07 | Ｊｓｒ株式会社 | 接着剤組成物 |
| JP5788173B2 (ja) | 2007-06-25 | 2015-09-30 | ブルーワー サイエンス アイ エヌシー． | 高温スピンオン仮接合用組成物 |
| US20090017323A1 (en) | 2007-07-13 | 2009-01-15 | 3M Innovative Properties Company | Layered body and method for manufacturing thin substrate using the layered body |
| DE112009000140B4 (de) | 2008-01-24 | 2022-06-15 | Brewer Science, Inc. | Verfahren zum reversiblen Anbringen eines Vorrichtungswafers an einem Trägersubstrat und ein daraus erhaltener Gegenstand |
| US8092628B2 (en) | 2008-10-31 | 2012-01-10 | Brewer Science Inc. | Cyclic olefin compositions for temporary wafer bonding |
| DE102008044200B4 (de) | 2008-11-28 | 2012-08-23 | Thin Materials Ag | Bonding-Verfahren |
| DE102008055155A1 (de) | 2008-12-23 | 2010-07-01 | Thin Materials Ag | Trennverfahren für ein Schichtsystem umfassend einen Wafer |
| WO2010121068A2 (en) | 2009-04-16 | 2010-10-21 | Suss Microtec, Inc. | Improved apparatus for temporary wafer bonding and debonding |
| TW201043658A (en) | 2009-06-15 | 2010-12-16 | Sumitomo Bakelite Co | Temporarily fixing agent for semiconductor wafer and method for producing semiconductor device using the same |
| TWI479259B (zh) | 2009-06-15 | 2015-04-01 | Sumitomo Bakelite Co | A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same |
| DE102009028025A1 (de) * | 2009-07-27 | 2011-02-03 | Henkel Ag & Co. Kgaa | Mehrstufiges Verfahren zur Behandlung von Metalloberflächen vor einer Tauchlackierung |
| US8343300B2 (en) | 2009-12-23 | 2013-01-01 | Suss Microtec Lithography, Gmbh | Automated thermal slide debonder |
| US8647964B2 (en) | 2010-02-12 | 2014-02-11 | Dow Corning Corporation | Temporary wafer bonding method for semiconductor processing |
| JP2011168663A (ja) | 2010-02-17 | 2011-09-01 | Sumitomo Bakelite Co Ltd | 有機基板の仮固定剤及びそれを用いた半導体装置の製造方法 |
| US7883991B1 (en) | 2010-02-18 | 2011-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temporary carrier bonding and detaching processes |
| KR101578575B1 (ko) * | 2010-03-24 | 2015-12-17 | 세키스이가가쿠 고교가부시키가이샤 | 접착제 조성물, 접착 테이프, 반도체 웨이퍼의 처리 방법 및 tsv 웨이퍼의 제조 방법 |
| US8852391B2 (en) | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
| US8461017B2 (en) | 2010-07-19 | 2013-06-11 | Soitec | Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region |
| JP5605957B2 (ja) * | 2010-08-06 | 2014-10-15 | 日東電工株式会社 | 電子部品の製造方法 |
| US9263314B2 (en) | 2010-08-06 | 2016-02-16 | Brewer Science Inc. | Multiple bonding layers for thin-wafer handling |
| DE102011079687A1 (de) | 2011-07-22 | 2013-01-24 | Wacker Chemie Ag | Temporäre Verklebung von chemisch ähnlichen Substraten |
| US8696864B2 (en) | 2012-01-26 | 2014-04-15 | Promerus, Llc | Room temperature debonding composition, method and stack |
| US9269623B2 (en) * | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
| US20140141048A1 (en) * | 2012-11-21 | 2014-05-22 | Boston Scientific Scimed, Inc. | Ionic hydrophilic polymer coatings for use in medical devices |
| US9315696B2 (en) * | 2013-10-31 | 2016-04-19 | Dow Global Technologies Llc | Ephemeral bonding |
| DE102019205487A1 (de) | 2019-04-16 | 2020-10-22 | Robert Bosch Gmbh | Teilnehmerstation für ein serielles Bussystem und Verfahren zur Kommunikation in einem seriellen Bussystem |
-
2015
- 2015-03-03 US US14/636,981 patent/US9644118B2/en active Active
-
2016
- 2016-01-12 EP EP16150925.2A patent/EP3065166B1/en active Active
- 2016-02-16 TW TW105104515A patent/TWI619790B/zh active
- 2016-02-18 KR KR1020160018925A patent/KR101767119B1/ko active Active
- 2016-02-19 CN CN201610091933.5A patent/CN105938801B/zh active Active
- 2016-02-19 JP JP2016029418A patent/JP6346209B2/ja active Active
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