JP2016157902A5 - - Google Patents

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Publication number
JP2016157902A5
JP2016157902A5 JP2015036557A JP2015036557A JP2016157902A5 JP 2016157902 A5 JP2016157902 A5 JP 2016157902A5 JP 2015036557 A JP2015036557 A JP 2015036557A JP 2015036557 A JP2015036557 A JP 2015036557A JP 2016157902 A5 JP2016157902 A5 JP 2016157902A5
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JP
Japan
Prior art keywords
rigid
multilayer
flexible substrate
flexible
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015036557A
Other languages
English (en)
Japanese (ja)
Other versions
JP6538372B2 (ja
JP2016157902A (ja
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Publication date
Application filed filed Critical
Priority to JP2015036557A priority Critical patent/JP6538372B2/ja
Priority claimed from JP2015036557A external-priority patent/JP6538372B2/ja
Priority to TW104131143A priority patent/TWI613948B/zh
Priority to KR1020150136717A priority patent/KR101853530B1/ko
Priority to CN201510640100.5A priority patent/CN105934109B/zh
Publication of JP2016157902A publication Critical patent/JP2016157902A/ja
Publication of JP2016157902A5 publication Critical patent/JP2016157902A5/ja
Application granted granted Critical
Publication of JP6538372B2 publication Critical patent/JP6538372B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015036557A 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法 Active JP6538372B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法
TW104131143A TWI613948B (zh) 2015-02-26 2015-09-21 多層剛性可撓性基板及其製造方法
KR1020150136717A KR101853530B1 (ko) 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법
CN201510640100.5A CN105934109B (zh) 2015-02-26 2015-09-30 多层刚挠性基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016157902A JP2016157902A (ja) 2016-09-01
JP2016157902A5 true JP2016157902A5 (ko) 2018-04-05
JP6538372B2 JP6538372B2 (ja) 2019-07-03

Family

ID=56826491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015036557A Active JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Country Status (4)

Country Link
JP (1) JP6538372B2 (ko)
KR (1) KR101853530B1 (ko)
CN (1) CN105934109B (ko)
TW (1) TWI613948B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021020919A1 (ko) * 2019-07-30 2021-02-04 삼성전자 주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997983A (en) * 1997-05-30 1999-12-07 Teledyneindustries, Inc. Rigid/flex printed circuit board using angled prepreg
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판
WO2008035416A1 (fr) * 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Plaquette de circuit imprimé flexorigide et procédé de fabrication de la plaquette de circuit imprimé flexorigide
JP5176680B2 (ja) * 2008-05-12 2013-04-03 富士通株式会社 多層プリント配線板，及び電子装置
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
JP5617028B2 (ja) * 2011-02-21 2014-10-29 パナソニック株式会社 金属張積層板、及びプリント配線板
TW201340807A (zh) * 2011-12-28 2013-10-01 Panasonic Corp 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens
KR101437494B1 (ko) * 2014-03-07 2014-09-03 메이코 일렉트로닉스 컴파니 리미티드 플렉시블부를 구비하는 리지드 프린트 배선기판의 벤딩복구방법

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