JP2016157902A5 - - Google Patents

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Publication number
JP2016157902A5
JP2016157902A5 JP2015036557A JP2015036557A JP2016157902A5 JP 2016157902 A5 JP2016157902 A5 JP 2016157902A5 JP 2015036557 A JP2015036557 A JP 2015036557A JP 2015036557 A JP2015036557 A JP 2015036557A JP 2016157902 A5 JP2016157902 A5 JP 2016157902A5
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JP
Japan
Prior art keywords
rigid
multilayer
flexible substrate
flexible
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015036557A
Other languages
English (en)
Japanese (ja)
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JP2016157902A (ja
JP6538372B2 (ja
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Publication date
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Priority to JP2015036557A priority Critical patent/JP6538372B2/ja
Priority claimed from JP2015036557A external-priority patent/JP6538372B2/ja
Priority to TW104131143A priority patent/TWI613948B/zh
Priority to KR1020150136717A priority patent/KR101853530B1/ko
Priority to CN201510640100.5A priority patent/CN105934109B/zh
Publication of JP2016157902A publication Critical patent/JP2016157902A/ja
Publication of JP2016157902A5 publication Critical patent/JP2016157902A5/ja
Application granted granted Critical
Publication of JP6538372B2 publication Critical patent/JP6538372B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015036557A 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法 Active JP6538372B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法
TW104131143A TWI613948B (zh) 2015-02-26 2015-09-21 多層剛性可撓性基板及其製造方法
KR1020150136717A KR101853530B1 (ko) 2015-02-26 2015-09-25 다층 리지드 플렉시블 기판 및 그 제조방법
CN201510640100.5A CN105934109B (zh) 2015-02-26 2015-09-30 多层刚挠性基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015036557A JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016157902A JP2016157902A (ja) 2016-09-01
JP2016157902A5 true JP2016157902A5 (enrdf_load_stackoverflow) 2018-04-05
JP6538372B2 JP6538372B2 (ja) 2019-07-03

Family

ID=56826491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015036557A Active JP6538372B2 (ja) 2015-02-26 2015-02-26 多層リジッドフレキシブル基板の製造方法

Country Status (4)

Country Link
JP (1) JP6538372B2 (enrdf_load_stackoverflow)
KR (1) KR101853530B1 (enrdf_load_stackoverflow)
CN (1) CN105934109B (enrdf_load_stackoverflow)
TW (1) TWI613948B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021020919A1 (ko) * 2019-07-30 2021-02-04 삼성전자 주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997983A (en) * 1997-05-30 1999-12-07 Teledyneindustries, Inc. Rigid/flex printed circuit board using angled prepreg
JP2002252469A (ja) * 2001-02-23 2002-09-06 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
JP2006066894A (ja) * 2004-07-28 2006-03-09 Hitachi Chem Co Ltd 印刷回路板
JP2006324406A (ja) * 2005-05-18 2006-11-30 Sharp Corp フレックスリジッド多層配線板
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板
KR200415210Y1 (ko) * 2006-02-14 2006-04-28 (주)인터플렉스 리지드 플렉시블 인쇄회로기판
CN101518163B (zh) * 2006-09-21 2011-06-08 株式会社大昌电子 刚挠性印刷电路板及该刚挠性印刷电路板的制造方法
JP5176680B2 (ja) * 2008-05-12 2013-04-03 富士通株式会社 多層プリント配線板，及び電子装置
TW201127228A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
US9480148B2 (en) * 2011-02-21 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
TW201340807A (zh) * 2011-12-28 2013-10-01 松下電器產業股份有限公司 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
AT13434U1 (de) * 2012-02-21 2013-12-15 Austria Tech & System Tech Verfahren zur Herstellung einer Leiterplatte und Verwendung eines derartigen Verfahrens
WO2015132949A1 (ja) * 2014-03-07 2015-09-11 株式会社メイコー フレキシブル部を有するリジッドプリント配線基板の曲げ戻し方法

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