JP2016152193A - Method of manufacturing circuit protection element - Google Patents

Method of manufacturing circuit protection element Download PDF

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JP2016152193A
JP2016152193A JP2015030474A JP2015030474A JP2016152193A JP 2016152193 A JP2016152193 A JP 2016152193A JP 2015030474 A JP2015030474 A JP 2015030474A JP 2015030474 A JP2015030474 A JP 2015030474A JP 2016152193 A JP2016152193 A JP 2016152193A
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forming
circuit protection
sheet
resistance value
insulating substrate
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JP6650572B2 (en
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智幸 鷲崎
Tomoyuki Washisaki
智幸 鷲崎
和俊 松村
Kazutoshi Matsumura
和俊 松村
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Panasonic Intellectual Property Management Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit protection element that can enhance the yield.SOLUTION: A method of manufacturing a circuit protection element comprises a step of forming plural upper surface electrodes 12 so as to straddle division parts 22a in the longitudinal direction of a sheet-like insulation substrate 21 having plural division parts 22a and 22b in the longitudinal and lateral directions, and forming an element part 13 for bridging a pair of upper surface electrodes 12 at each element part 23 surrounded by the division parts 22a, 22b in the longitudinal and lateral directions, and a step of forming trimming grooves 17 for forming fusion cutting portions and trimming grooves 18 for adjusting the resistance value on the element parts 13 by a laser. All the element parts 23 are simultaneously plated on the sheet-like insulation substrate 21 before the trimming grooves 17 for forming the fusion cutting portions and the trimming grooves 18 for adjusting the resistance value are formed, thereby forming element parts 13.SELECTED DRAWING: Figure 3

Description

本発明は、過電流が流れると回路を遮断して各種電子機器を保護する回路保護素子の製造方法に関するものである。   The present invention relates to a method of manufacturing a circuit protection element that protects various electronic devices by interrupting a circuit when an overcurrent flows.

従来のこの種の回路保護素子の製造方法は、図４に示すように、絶縁基板１の上面の両端部に一対の電極２を形成した後、この一対の上面電極２と電気的に接続されるエレメント部３を形成し、その後、このエレメント部３をレーザで切削してエレメント部３を貫通する溶断部形成用トリミング溝４を形成し、溶断部形成用トリミング溝４で囲まれた溶断部５を設けるようにしていた。   As shown in FIG. 4, a conventional method for manufacturing a circuit protection element of this type is formed by forming a pair of electrodes 2 at both ends of the upper surface of the insulating substrate 1 and then electrically connecting the pair of upper surface electrodes 2 to each other. Then, the element part 3 is cut with a laser to form a fusing part forming trimming groove 4 penetrating the element part 3, and the fusing part surrounded by the fusing part forming trimming groove 4 5 was provided.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。   As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

特開２００５−２２２７６２号公報JP 2005-222762 A

上記した従来の回路保護素子の製造方法においては、定格電流に応じて都度エレメント部３の厚みや溶断部５の体積等を変えるようにしているため、歩留まりが悪化するという課題を有していた。   In the above-described conventional method for manufacturing a circuit protection element, the thickness of the element part 3 and the volume of the fusing part 5 are changed each time according to the rated current, which has a problem that the yield deteriorates. .

本発明は上記従来の課題を解決するもので、歩留まりを向上させることができる回路保護素子の製造方法を提供することを目的とするものである。   The present invention solves the above-described conventional problems, and an object of the present invention is to provide a method for manufacturing a circuit protection element capable of improving the yield.

上記目的を達成するために、本発明は、複数の縦方向および横方向の分割部を有するシート状絶縁基板を用意する工程と、前記シート状絶縁基板の前記縦方向の分割部を跨ぐように上面電極を複数形成し、前記縦方向および横方向の分割部で囲まれたそれぞれの素子部において前記上面電極間を橋絡するエレメント部を形成する工程と、前記エレメント部にレーザによって溶断部形成用トリミング溝および抵抗値調整用トリミング溝を形成する工程とを備え、前記シート状絶縁基板上において前記全ての素子部に同時にめっきすることによって前記エレメント部を形成するようにしている。   In order to achieve the above object, the present invention provides a step of preparing a sheet-like insulating substrate having a plurality of vertical and horizontal divided portions, and straddles the vertical divided portions of the sheet-like insulating substrate. Forming a plurality of upper surface electrodes, forming an element portion that bridges between the upper surface electrodes in each of the element portions surrounded by the vertical and horizontal divided portions, and forming a fusing portion by laser in the element portion Forming a trimming groove for resistance and a trimming groove for resistance value adjustment, and the element portion is formed by simultaneously plating all the element portions on the sheet-like insulating substrate.

以上のように本発明の回路保護素子の製造方法は、全ての素子部に同時にめっきすることによってエレメント部を形成するようにしているため、各素子部のエレメント部の厚みを略等しくすることができ、これにより、溶断部形成用トリミング溝の位置を変えさえすれば定格電流に応じた回路保護素子を得ることができるため、１つのシート状絶縁基板において複数の定格電流に対応した回路保護素子を得ることができ、この結果、歩留まりを向上させることができるという優れた効果を奏するものである。   As described above, in the method for manufacturing a circuit protection element of the present invention, since the element part is formed by plating all the element parts simultaneously, the thickness of the element part of each element part can be made substantially equal. As a result, a circuit protection element corresponding to the rated current can be obtained as long as the position of the fusing part forming trimming groove is changed, so that a circuit protection element corresponding to a plurality of rated currents can be obtained on one sheet-like insulating substrate. As a result, there is an excellent effect that the yield can be improved.

本発明の一実施の形態における回路保護素子の断面図Sectional drawing of the circuit protection element in one embodiment of this invention 同回路保護素子の一部切欠上面図Top view of part of the circuit protection element （ａ）（ｂ）同回路保護素子の製造方法の一部を示す一部切欠上面図(A) (b) Partially cutaway top view showing a part of the method for manufacturing the circuit protection element 従来の回路保護素子の上面図Top view of conventional circuit protection element

以下、本発明の一実施の形態における回路保護素子について、図面を参照しながら説明する。   Hereinafter, a circuit protection element according to an embodiment of the present invention will be described with reference to the drawings.

図１は本発明の一実施の形態における回路保護素子の断面図、図２は同回路保護素子の同一部切欠上面図である。   FIG. 1 is a sectional view of a circuit protection element according to an embodiment of the present invention, and FIG. 2 is a top view of the same part of the circuit protection element.

本発明の一実施の形態における回路保護素子は、図１、図２に示すように、絶縁基板１１と、この絶縁基板１１の上面の両端部に設けられた一対の上面電極１２と、この一対の上面電極１２間を橋絡するように形成され、かつ前記一対の上面電極１２と電気的に接続されるエレメント部１３と、このエレメント部１３と前記絶縁基板１１との間に設けられた下地層１４と、前記エレメント部１３を覆うように設けられた絶縁層１５と、絶縁基板１１の端面にエレメント部１３と接続する端面電極１６とを備えた構成としているものである。   As shown in FIGS. 1 and 2, the circuit protection element according to the embodiment of the present invention includes an insulating substrate 11, a pair of upper surface electrodes 12 provided at both ends of the upper surface of the insulating substrate 11, and the pair The element portion 13 is formed so as to bridge between the upper surface electrodes 12 and is electrically connected to the pair of upper surface electrodes 12, and the lower portion provided between the element portion 13 and the insulating substrate 11. The base layer 14, the insulating layer 15 provided so as to cover the element portion 13, and the end face electrode 16 connected to the element portion 13 on the end face of the insulating substrate 11 are provided.

また、エレメント部１３には、一対の溶断部形成用トリミング溝１７と抵抗値調整用トリミング溝１８が形成されるもので、これにより、エレメント部１３は蛇行状となっている。さらに、一対の溶断部形成用トリミング溝１７で囲まれた部分に溶断部１９が構成されている。そして、材質が同じであれば溶断部１９の体積（厚み×上面視での面積）に応じて定格電流が変わる。なお、図２においては絶縁層１５、端面電極１６を省略している。   Further, the element portion 13 is formed with a pair of fusing portion forming trimming grooves 17 and a resistance value adjusting trimming groove 18, whereby the element portion 13 has a meandering shape. Further, a fusing part 19 is formed in a part surrounded by the pair of fusing part forming trimming grooves 17. And if a material is the same, a rated current will change according to the volume (thickness x area in a top view) of fusing part 19. In FIG. 2, the insulating layer 15 and the end face electrode 16 are omitted.

次に、本発明の一実施の形態における回路保護素子の製造方法について説明する。   Next, the manufacturing method of the circuit protection element in one embodiment of the present invention is explained.

図３（ａ）において、まず、Ａｌ2Ｏ3を５５％〜９６％含有するアルミナで方形状に構成されたシート状絶縁基板２１を用意する。このシート状絶縁基板２１の上面には、複数の縦方向の分割部２２ａおよび複数の横方向の分割部２２ｂを有している。この縦方向の分割部２２ａと横方向の分割部２２ｂとで囲まれた部分が個片状の回路保護素子となる素子部２３である。シート状絶縁基板２１は個片状も回路保護素子（素子部２３）における絶縁基板１１となる。 In FIG. 3A, first, a sheet-like insulating substrate 21 configured in a square shape with alumina containing 55% to 96% of Al 2 O 3 is prepared. On the upper surface of the sheet-like insulating substrate 21, there are a plurality of vertical dividing portions 22a and a plurality of horizontal dividing portions 22b. A portion surrounded by the vertical division portion 22a and the horizontal division portion 22b is an element portion 23 that becomes a piece-like circuit protection element. The sheet-like insulating substrate 21 also becomes the insulating substrate 11 in the circuit protection element (element portion 23).

なお、図３においては、説明を簡単にするために、３本の縦方向の分割部２２ａ、４本の横方向の分割部２２ｂを形成し、素子部２３を６個設けたものを示す。また、縦方向、横方向の分割部２２ａ、２２ｂは分割用の溝であってもよいが、シート状絶縁基板２１が湾曲してめっき厚みが場所によって異なることがないようにする必要がある。   In FIG. 3, for the sake of simplicity of explanation, three vertical division parts 22 a, four horizontal division parts 22 b are formed, and six element parts 23 are provided. Further, the dividing portions 22a and 22b in the vertical and horizontal directions may be dividing grooves, but it is necessary to prevent the sheet-like insulating substrate 21 from being bent and the plating thickness from being different depending on the location.

次に、縦方向の分割部２２ａを跨ぐように銀ペーストまたは銀を主成分とする銀パラジウム合金導体ペーストを印刷して焼成することにより上面電極１２を複数形成する。これにより、各素子部２３の両端部に一対の上面電極１２が形成される。   Next, a plurality of upper surface electrodes 12 are formed by printing and baking a silver paste or a silver-palladium alloy conductor paste containing silver as a main component so as to straddle the vertical divisions 22a. Thereby, a pair of upper surface electrodes 12 are formed at both end portions of each element portion 23.

この後、各素子部２３の中央部に、ガラス、シリコン樹脂等からなる下地層１４を形成する（図３では図示せず）。   Thereafter, a base layer 14 made of glass, silicon resin or the like is formed at the center of each element portion 23 (not shown in FIG. 3).

さらに、実装時の安定性を確保するために、シート状絶縁基板２１の裏面における前記上面電極１２と対向する位置に、銀ペーストまたは銀を主成分とする銀パラジウム合金導体ペーストを印刷して焼成することにより裏面電極（図示せず）を形成してもよい。   Furthermore, in order to ensure the stability at the time of mounting, a silver paste or a silver palladium alloy conductor paste mainly composed of silver is printed and fired at a position facing the upper surface electrode 12 on the back surface of the sheet-like insulating substrate 21. By doing so, a back electrode (not shown) may be formed.

次に、下地層１４および一対の上面電極１２の上面にエレメント部１３を形成する。なお、このエレメント部１３は一対の上面電極１２間を橋絡して一対の上面電極１２と電気的に接続されるように構成する。   Next, the element portion 13 is formed on the upper surface of the base layer 14 and the pair of upper surface electrodes 12. The element portion 13 is configured so as to be electrically connected to the pair of upper surface electrodes 12 by bridging between the pair of upper surface electrodes 12.

そして、このエレメント部１３は、図１において、まず、Ｔｉ、Ｃｕ、ＴｉあるいはＣｒ、ＣｕＮｉを順番にスパッタすることにより第１のエレメント部１３ａを設け、その後、この第１のエレメント部１３ａをめっき核として第１のエレメント部１３ａの上面にＮｉ、Ｃｕ、Ａｇを無電解めっきまたは電解めっきして第２のエレメント部１３ｂを設けることにより形成される。なお、Ｎｉ、Ｃｕ、Ａｇは単体であってもよいし、合金であってもよいし、積層してもよい。さらに、第１のエレメント部１３ａは無くてもよい。   In FIG. 1, the element portion 13 is first provided with a first element portion 13a by sequentially sputtering Ti, Cu, Ti or Cr, and CuNi, and then the first element portion 13a is plated. It is formed by providing the second element part 13b by electroless plating or electrolytic plating of Ni, Cu, Ag on the upper surface of the first element part 13a as a nucleus. Ni, Cu, and Ag may be a single element, an alloy, or a laminate. Further, the first element portion 13a may be omitted.

このとき、シート状絶縁基板２１上の素子部２３全てに同時にめっきをし、全ての素子部２３のエレメント部１３のめっき厚みを略同一になるようにする。ここで、全ての素子部２３とは、ダミー部分を除いた実質的に回路保護素子となる全体の部分をいう。ただし、めっき厚みがより同一となり易いシート状絶縁基板２１の中央部のみを使用するのが好ましい。また、めっき厚みが厚くなりそうな箇所に、めっきが付き難くさせるための遮蔽物を配置し、めっき厚みが同一になるようにしてもよい。   At this time, all the element portions 23 on the sheet-like insulating substrate 21 are plated at the same time so that the plating thicknesses of the element portions 13 of all the element portions 23 are substantially the same. Here, all the element parts 23 means the whole part which becomes a circuit protection element substantially except a dummy part. However, it is preferable to use only the central portion of the sheet-like insulating substrate 21 in which the plating thickness tends to be the same. Further, a shielding object for preventing plating from being attached may be disposed at a place where the plating thickness is likely to be thick so that the plating thickness is the same.

次に、各素子部２３のエレメント部１３に、一対の溶断部形成用トリミング溝１７を形成し、かつ溶断部１９を設ける。このとき、要望された定格電流とその数量に応じて、溶断部形成用トリミング溝１７の位置を調整する。   Next, a pair of fusing part forming trimming grooves 17 and a fusing part 19 are provided in the element part 13 of each element part 23. At this time, the position of the fusing part forming trimming groove 17 is adjusted according to the desired rated current and the quantity thereof.

次に、図３（ｂ）に示すように、全ての素子部２３のエレメント部１３に一対の溶断部形成用トリミング溝１７を形成した後に、各素子部２３の一対の電極１２間の抵抗値を測定し、所定の抵抗値になるように抵抗値調整用トリミング溝１８をエレメント部１３に形成する。   Next, as shown in FIG. 3B, after forming a pair of fusing part forming trimming grooves 17 in the element parts 13 of all the element parts 23, the resistance value between the pair of electrodes 12 of each element part 23. And a resistance value adjusting trimming groove 18 is formed in the element portion 13 so as to have a predetermined resistance value.

このように、全ての素子部２３のエレメント部１３に溶断部形成用トリミング溝１７を形成した後に、抵抗値調整用トリミング溝１８を形成すれば、溶断部形成用トリミング溝１７の形成時に発生する熱が拡散しエレメント部１３が低温化した後で抵抗値調整用トリミング溝１８を形成できるため、溶断部形成用トリミング溝１７形成時の発熱によるエレメント部１３の抵抗値変化が無い状態で抵抗値調整でき、これにより、高精度の抵抗値が得られる。   In this manner, if the resistance adjustment trimming groove 18 is formed after the fusing part forming trimming groove 17 is formed in the element parts 13 of all the element parts 23, it is generated when the fusing part forming trimming groove 17 is formed. Since the resistance adjustment trimming groove 18 can be formed after the heat is diffused and the temperature of the element portion 13 is lowered, the resistance value is maintained in a state where there is no change in the resistance value of the element portion 13 due to heat generation when the fusing portion forming trimming groove 17 is formed. The resistance value can be adjusted, thereby obtaining a highly accurate resistance value.

すなわち、抵抗値調整用トリミング溝１８を形成しようとした時には、溶断部形成用トリミング溝１７の形成時に発生する熱がエレメント部１３全体に逃げているため、エレメント部１３は高温とならない。そして、このエレメント部１３が高温にならないことから、エレメント部１３の抵抗値は理論値に近づくため、所定の抵抗値になるようにエレメント部１３の抵抗値を測定しながら抵抗値調整用トリミング溝１８を形成すると、所定の抵抗値に極めて近い抵抗値が得られる。   That is, when the trimming groove 18 for adjusting the resistance value is to be formed, the heat generated during the formation of the fusing part forming trimming groove 17 escapes to the entire element part 13, so that the element part 13 does not reach a high temperature. Since the element portion 13 does not reach a high temperature, the resistance value of the element portion 13 approaches a theoretical value. Therefore, the resistance value adjusting trimming groove is measured while measuring the resistance value of the element portion 13 so as to be a predetermined resistance value. When 18 is formed, a resistance value very close to a predetermined resistance value is obtained.

なお、上記図３（ｂ）においては、抵抗値調整用トリミング溝１８を２本形成したものについて説明したが、他の本数でも構わない。   In FIG. 3B, the description has been given of the case where two resistance value adjusting trimming grooves 18 are formed, but other numbers may be used.

次に、シリコン等の樹脂を少なくとも溶断部１９を覆うように形成して絶縁層１５を形成する。   Next, the insulating layer 15 is formed by forming a resin such as silicon so as to cover at least the fusing portion 19.

次に、シート状絶縁基板２１を、複数の縦方向の分割部２２ａおよび複数の横方向の分割部２２ｂで分割して個片状の素子部２３を複数形成するとともに、各素子部２３の両端部においてエレメント部１３の一部と重なるように樹脂銀ペーストを塗布して硬化させることにより端面電極１６を形成する。   Next, the sheet-like insulating substrate 21 is divided by a plurality of vertical division parts 22a and a plurality of horizontal division parts 22b to form a plurality of piece-like element parts 23, and both ends of each element part 23 The end face electrode 16 is formed by applying and curing a resin silver paste so as to overlap a part of the element part 13 at the part.

最後に、前記端面電極１６の表面に、ニッケルと錫の２層構造からなるめっき膜（図示せず）を形成して、本発明の一実施の形態における回路保護素子を製造する。   Finally, a plated film (not shown) having a two-layer structure of nickel and tin is formed on the surface of the end face electrode 16 to manufacture the circuit protection element in one embodiment of the present invention.

上記したように本発明の一実施の形態においては、シート状絶縁基板２１上において全ての素子部２３に同時にめっきすることによってエレメント部１３を形成するようにしているため、各素子部２３のエレメント部１３の厚みを略等しくすることができ、これにより、溶断部形成用トリミング溝１７の位置を変えさえすれば定格電流に応じた回路保護素子を得ることができるため、１つのシート状絶縁基板２１において複数の定格電流に対応した回路保護素子を得ることができ、この結果、定格電流に応じて都度エレメント部１３の厚み等を変えることをせずに済むため、歩留まりを向上させることができるという効果が得られるものである。   As described above, in the embodiment of the present invention, the element portion 13 is formed by simultaneously plating all the element portions 23 on the sheet-like insulating substrate 21, so that the element of each element portion 23 is formed. Since the thickness of the portion 13 can be made substantially equal, and a circuit protection element corresponding to the rated current can be obtained only by changing the position of the fusing portion forming trimming groove 17, one sheet-like insulating substrate 21 can obtain a circuit protection element corresponding to a plurality of rated currents. As a result, it is not necessary to change the thickness or the like of the element portion 13 each time according to the rated current, so that the yield can be improved. The effect is obtained.

例えば、図３では、紙面上段の素子部２３においては、一対の溶断部形成用トリミング溝１７がオーバーラップしている寸法が長く、中段の素子部２３においては、一対の溶断部形成用トリミング溝１７がオーバーラップしている寸法が短く、下段の素子部２３においては、一対の溶断部形成用トリミング溝１７間の距離が長く、それぞれ溶断部１９の上面視での面積が異なっており、さらに、各エレメント部１３の厚みは略同一であるため、各々溶断部１９の体積が異なり、３種類の定格電流に応じたものを同時に得ることができる。   For example, in FIG. 3, in the upper element part 23, the pair of fusing part forming trimming grooves 17 have a long overlapping dimension, and in the middle element part 23, a pair of fusing part forming trimming grooves. In the lower element part 23, the distance between the pair of fusing part forming trimming grooves 17 is long, and the area of the fusing part 19 in the top view is different. Since the thickness of each element part 13 is substantially the same, the volume of the fusing part 19 is different, and the elements corresponding to the three types of rated current can be obtained simultaneously.

よって、一対の溶断部形成用トリミング溝１７の位置を変えて溶断部１９の面積を変化させるだけで、容易かつ安価に２種類以上の異なる定格電流が得られる。   Therefore, two or more different rated currents can be obtained easily and inexpensively by simply changing the position of the pair of fusing part forming trimming grooves 17 and changing the area of the fusing part 19.

そして、例えば、１つのシート状絶縁基板２１で得られる回路保護素子の全個数の１／３が低電流、２／３が高電流のものを受注したような場合でも、無駄なく対応できる。   For example, even when an order is received where 1/3 of the total number of circuit protection elements obtained with one sheet-like insulating substrate 21 is low current and 2/3 is high current, it can be handled without waste.

本発明に係る回路保護素子の製造方法は、歩留まりを向上させることができるという効果を有するものであり、特に過電流が流れると回路を遮断して各種電子機器を保護する回路保護素子等において有用となるものである。   The method for manufacturing a circuit protection element according to the present invention has an effect of improving the yield, and is particularly useful in a circuit protection element for interrupting a circuit and protecting various electronic devices when an overcurrent flows. It will be.

１２ 上面電極
１３ エレメント部
１７ 溶断部形成用トリミング溝
１８ 抵抗値調整用トリミング溝
２１ シート状絶縁基板
２２ａ 縦方向の分割部
２２ｂ 横方向の分割部
２３ 素子部 DESCRIPTION OF SYMBOLS 12 Upper surface electrode 13 Element part 17 Fusing part formation trimming groove 18 Resistance value adjusting trimming groove 21 Sheet-like insulating substrate 22a Vertical division part 22b Horizontal division part 23 Element part

Claims (3)

複数の縦方向および横方向の分割部を有するシート状絶縁基板を用意する工程と、前記シート状絶縁基板の前記縦方向の分割部を跨ぐように上面電極を複数形成し、前記縦方向および横方向の分割部で囲まれたそれぞれの素子部において前記上面電極間を橋絡するエレメント部を形成する工程と、前記エレメント部にレーザによって溶断部形成用トリミング溝および抵抗値調整用トリミング溝を形成する工程とを備え、前記シート状絶縁基板上において全ての前記素子部に同時にめっきすることによって前記エレメント部を形成するようにした回路保護素子の製造方法。 A step of preparing a sheet-like insulating substrate having a plurality of vertical and horizontal dividing portions; and a plurality of upper surface electrodes are formed so as to straddle the vertical dividing portions of the sheet-like insulating substrate. Forming an element part that bridges between the upper surface electrodes in each element part surrounded by a direction dividing part, and forming a fusing part forming trimming groove and a resistance value adjusting trimming groove by laser in the element part And a step of forming the element portion by simultaneously plating all the element portions on the sheet-like insulating substrate. ２種類以上の異なる定格電流の回路保護素子を作製するようにした請求項１に記載の回路保護素子の製造方法。 The method of manufacturing a circuit protection element according to claim 1, wherein two or more types of circuit protection elements having different rated currents are produced. 全ての前記素子部の前記エレメント部に前記溶断部形成用トリミング溝を形成した後、前記抵抗値調整用トリミング溝を形成するようにした請求項１に記載の回路保護素子の製造方法。 The method for manufacturing a circuit protection element according to claim 1, wherein the trimming groove for forming the fusing part is formed in the element part of all the element parts, and then the trimming groove for adjusting the resistance value is formed.
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JPH07122406A (en) * 1993-10-22 1995-05-12 Hokuriku Electric Ind Co Ltd Chip-shaped fuse resistor and manufacture thereof
JP2001167909A (en) * 1999-12-14 2001-06-22 Matsushita Electric Ind Co Ltd Fuse resistor and manufacturing method therefor
JP2003234057A (en) * 2003-03-10 2003-08-22 Koa Corp Fuse resistor and its manufacturing method
JP2005222762A (en) * 2004-02-04 2005-08-18 Kamaya Denki Kk Chip type fuse and its manufacturing method
JP2010067475A (en) * 2008-09-11 2010-03-25 Yazaki Corp Fuse, and method of manufacturing the same
JP2010080418A (en) * 2007-11-08 2010-04-08 Panasonic Corp Circuit protective device and method for manufacturing the same
JP2010236054A (en) * 2009-03-31 2010-10-21 Fujitsu Semiconductor Ltd Method of manufacturing semiconductor device and plating apparatus
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0243701A (en) * 1988-08-03 1990-02-14 Koa Corp Chip type fuse resistor and manufacture thereof
JPH07122406A (en) * 1993-10-22 1995-05-12 Hokuriku Electric Ind Co Ltd Chip-shaped fuse resistor and manufacture thereof
JP2001167909A (en) * 1999-12-14 2001-06-22 Matsushita Electric Ind Co Ltd Fuse resistor and manufacturing method therefor
JP2003234057A (en) * 2003-03-10 2003-08-22 Koa Corp Fuse resistor and its manufacturing method
JP2005222762A (en) * 2004-02-04 2005-08-18 Kamaya Denki Kk Chip type fuse and its manufacturing method
JP2010080418A (en) * 2007-11-08 2010-04-08 Panasonic Corp Circuit protective device and method for manufacturing the same
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