JP2016136136A - ケミカルメカニカルポリッシングパッド、研磨層アナライザー及び方法 - Google Patents

ケミカルメカニカルポリッシングパッド、研磨層アナライザー及び方法 Download PDF

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Publication number
JP2016136136A
JP2016136136A JP2015251945A JP2015251945A JP2016136136A JP 2016136136 A JP2016136136 A JP 2016136136A JP 2015251945 A JP2015251945 A JP 2015251945A JP 2015251945 A JP2015251945 A JP 2015251945A JP 2016136136 A JP2016136136 A JP 2016136136A
Authority
JP
Japan
Prior art keywords
sheet
polymer
image data
photodetector
sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015251945A
Other languages
English (en)
Japanese (ja)
Inventor
フランシス・ブイ・アコーラ
V Acholla Francis
アンドリュー・アール・ワンク
Andrew R Wank
マーク・ガッツェ
Gazze Mark
スコット・チャン
Chang Scott
ジェフ・ツァイ
Tsai Jeff
ウィリアム・エー・ヒーシェン
A Heeschen William
ジェームズ・デイビッド・テイト
David Tate James
レオ・エイチ・チャン
H Chiang Leo
スウィー−テン・チン
Chin Swee-Teng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2016136136A publication Critical patent/JP2016136136A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2015251945A 2014-12-29 2015-12-24 ケミカルメカニカルポリッシングパッド、研磨層アナライザー及び方法 Pending JP2016136136A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462097174P 2014-12-29 2014-12-29
US62/097,174 2014-12-29

Publications (1)

Publication Number Publication Date
JP2016136136A true JP2016136136A (ja) 2016-07-28

Family

ID=56116788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015251945A Pending JP2016136136A (ja) 2014-12-29 2015-12-24 ケミカルメカニカルポリッシングパッド、研磨層アナライザー及び方法

Country Status (6)

Country Link
JP (1) JP2016136136A (zh)
KR (1) KR20160082929A (zh)
CN (1) CN105729296B (zh)
DE (1) DE102015016892A1 (zh)
FR (1) FR3031184A1 (zh)
TW (1) TW201629467A (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JP3754556B2 (ja) * 1998-03-30 2006-03-15 真澄 坂 誘電体材料製品の内部品質評価装置および評価方法
KR100383324B1 (ko) * 2000-11-24 2003-05-12 삼성전자주식회사 반도체 장치의 제조에서 연마 패드 검사 방법과 이를 수행하기 위한 검사 장치 및 이를 채용한 연마 장치.
JP3778004B2 (ja) * 2001-05-23 2006-05-24 株式会社日立製作所 電波が伝播できる検査対象の検査装置
KR100436861B1 (ko) * 2001-08-27 2004-06-30 나노메트릭스코리아 주식회사 화학적 기계적 연마장치에 사용하는 연마 패드의 결함검사 방법 및 장치
KR20060009387A (ko) * 2003-06-13 2006-01-31 가부시키가이샤 에바라 세이사꾸쇼 측정장치
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad

Also Published As

Publication number Publication date
KR20160082929A (ko) 2016-07-11
CN105729296B (zh) 2018-01-26
FR3031184A1 (fr) 2016-07-01
DE102015016892A1 (de) 2016-06-30
CN105729296A (zh) 2016-07-06
TW201629467A (zh) 2016-08-16

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