FR3031184A1 - Analyseur de couche de polissage de tampon de polissage mecano-chimique et procede correspondant - Google Patents

Analyseur de couche de polissage de tampon de polissage mecano-chimique et procede correspondant Download PDF

Info

Publication number
FR3031184A1
FR3031184A1 FR1563409A FR1563409A FR3031184A1 FR 3031184 A1 FR3031184 A1 FR 3031184A1 FR 1563409 A FR1563409 A FR 1563409A FR 1563409 A FR1563409 A FR 1563409A FR 3031184 A1 FR3031184 A1 FR 3031184A1
Authority
FR
France
Prior art keywords
image data
sheet
polymeric
polymeric sheets
light detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR1563409A
Other languages
English (en)
French (fr)
Inventor
Francis V Acholla
Andrew R Wank
Mark Gazze
Scott Chang
Jeff Tsai
William A Heeschen
James David Tate
Leo H Chiang
Swee-Teng Chin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3031184A1 publication Critical patent/FR3031184A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
FR1563409A 2014-12-29 2015-12-29 Analyseur de couche de polissage de tampon de polissage mecano-chimique et procede correspondant Pending FR3031184A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201462097174P 2014-12-29 2014-12-29

Publications (1)

Publication Number Publication Date
FR3031184A1 true FR3031184A1 (fr) 2016-07-01

Family

ID=56116788

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1563409A Pending FR3031184A1 (fr) 2014-12-29 2015-12-29 Analyseur de couche de polissage de tampon de polissage mecano-chimique et procede correspondant

Country Status (6)

Country Link
JP (1) JP2016136136A (zh)
KR (1) KR20160082929A (zh)
CN (1) CN105729296B (zh)
DE (1) DE102015016892A1 (zh)
FR (1) FR3031184A1 (zh)
TW (1) TW201629467A (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063860A1 (en) * 2000-11-24 2002-05-30 Jun Chung-Sam Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
US7027640B2 (en) * 2001-08-27 2006-04-11 Nanometrics Incorporated Method and apparatus for inspecting defects on polishing pads to be used with chemical mechanical polishing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JP3754556B2 (ja) * 1998-03-30 2006-03-15 真澄 坂 誘電体材料製品の内部品質評価装置および評価方法
JP3778004B2 (ja) * 2001-05-23 2006-05-24 株式会社日立製作所 電波が伝播できる検査対象の検査装置
KR20060009387A (ko) * 2003-06-13 2006-01-31 가부시키가이샤 에바라 세이사꾸쇼 측정장치
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020063860A1 (en) * 2000-11-24 2002-05-30 Jun Chung-Sam Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatus
US7027640B2 (en) * 2001-08-27 2006-04-11 Nanometrics Incorporated Method and apparatus for inspecting defects on polishing pads to be used with chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
JP2016136136A (ja) 2016-07-28
CN105729296B (zh) 2018-01-26
DE102015016892A1 (de) 2016-06-30
CN105729296A (zh) 2016-07-06
TW201629467A (zh) 2016-08-16
KR20160082929A (ko) 2016-07-11

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