JP2016115819A5 - - Google Patents

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Publication number
JP2016115819A5
JP2016115819A5 JP2014253583A JP2014253583A JP2016115819A5 JP 2016115819 A5 JP2016115819 A5 JP 2016115819A5 JP 2014253583 A JP2014253583 A JP 2014253583A JP 2014253583 A JP2014253583 A JP 2014253583A JP 2016115819 A5 JP2016115819 A5 JP 2016115819A5
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JP
Japan
Prior art keywords
sample
plasma
temperature
processing apparatus
voltage
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JP2014253583A
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English (en)
Japanese (ja)
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JP6407694B2 (ja
JP2016115819A (ja
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Priority claimed from JP2014253583A external-priority patent/JP6407694B2/ja
Priority to JP2014253583A priority Critical patent/JP6407694B2/ja
Priority to KR1020150108307A priority patent/KR101746046B1/ko
Priority to CN201510459206.5A priority patent/CN106206233B/zh
Priority to TW104126389A priority patent/TWI594287B/zh
Priority to US14/834,404 priority patent/US11424108B2/en
Publication of JP2016115819A publication Critical patent/JP2016115819A/ja
Publication of JP2016115819A5 publication Critical patent/JP2016115819A5/ja
Publication of JP6407694B2 publication Critical patent/JP6407694B2/ja
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Priority to US17/866,687 priority patent/US12191121B2/en
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JP2014253583A 2014-12-16 2014-12-16 プラズマ処理装置 Active JP6407694B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014253583A JP6407694B2 (ja) 2014-12-16 2014-12-16 プラズマ処理装置
KR1020150108307A KR101746046B1 (ko) 2014-12-16 2015-07-30 플라즈마 처리 장치
CN201510459206.5A CN106206233B (zh) 2014-12-16 2015-07-30 等离子体处理装置
TW104126389A TWI594287B (zh) 2014-12-16 2015-08-13 Plasma processing equipment
US14/834,404 US11424108B2 (en) 2014-12-16 2015-08-24 Plasma processing apparatus
US17/866,687 US12191121B2 (en) 2014-12-16 2022-07-18 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014253583A JP6407694B2 (ja) 2014-12-16 2014-12-16 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2016115819A JP2016115819A (ja) 2016-06-23
JP2016115819A5 true JP2016115819A5 (OSRAM) 2017-11-24
JP6407694B2 JP6407694B2 (ja) 2018-10-17

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ID=56111849

Family Applications (1)

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JP2014253583A Active JP6407694B2 (ja) 2014-12-16 2014-12-16 プラズマ処理装置

Country Status (5)

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US (2) US11424108B2 (OSRAM)
JP (1) JP6407694B2 (OSRAM)
KR (1) KR101746046B1 (OSRAM)
CN (1) CN106206233B (OSRAM)
TW (1) TWI594287B (OSRAM)

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KR102269344B1 (ko) * 2017-07-25 2021-06-28 주식회사 원익아이피에스 기판처리장치
CN109427610B (zh) * 2017-08-23 2021-01-29 北京北方华创微电子装备有限公司 晶片温控系统、晶片温控方法及反应腔室
WO2019140200A1 (en) 2018-01-15 2019-07-18 Applied Materials, Inc. Advanced temperature monitoring system and methods for semiconductor manufacture productivity
JP7061922B2 (ja) * 2018-04-27 2022-05-02 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP7258562B2 (ja) * 2019-01-11 2023-04-17 東京エレクトロン株式会社 処理方法及びプラズマ処理装置
CN112616320B (zh) * 2019-08-05 2024-04-05 株式会社日立高新技术 等离子处理装置
JP7398909B2 (ja) * 2019-09-12 2023-12-15 東京エレクトロン株式会社 静電吸着方法及びプラズマ処理装置
JP7604111B2 (ja) * 2020-04-07 2024-12-23 株式会社日立ハイテク プラズマ処理装置
US12013291B2 (en) * 2020-10-14 2024-06-18 Applied Materials, Inc. Advanced temperature monitoring system with expandable modular layout design
WO2023238235A1 (ja) * 2022-06-07 2023-12-14 株式会社日立ハイテク プラズマ処理装置
KR20240123168A (ko) * 2023-02-06 2024-08-13 주식회사 원익아이피에스 기판 지지 장치의 조립 방법

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