JP2016115399A5 - - Google Patents

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Publication number
JP2016115399A5
JP2016115399A5 JP2014250384A JP2014250384A JP2016115399A5 JP 2016115399 A5 JP2016115399 A5 JP 2016115399A5 JP 2014250384 A JP2014250384 A JP 2014250384A JP 2014250384 A JP2014250384 A JP 2014250384A JP 2016115399 A5 JP2016115399 A5 JP 2016115399A5
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JP
Japan
Prior art keywords
resin core
connection terminal
color
transparent electrode
connection
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JP2014250384A
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English (en)
Japanese (ja)
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JP2016115399A (ja
JP6457255B2 (ja
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Priority claimed from JP2014250384A external-priority patent/JP6457255B2/ja
Priority to JP2014250384A priority Critical patent/JP6457255B2/ja
Priority to CN201580064653.9A priority patent/CN107005012B/zh
Priority to KR1020177014219A priority patent/KR101908876B1/ko
Priority to TW104141229A priority patent/TWI694473B/zh
Priority to PCT/JP2015/084478 priority patent/WO2016093261A1/ja
Publication of JP2016115399A publication Critical patent/JP2016115399A/ja
Publication of JP2016115399A5 publication Critical patent/JP2016115399A5/ja
Publication of JP6457255B2 publication Critical patent/JP6457255B2/ja
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JP2014250384A 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法 Active JP6457255B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014250384A JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法
PCT/JP2015/084478 WO2016093261A1 (ja) 2014-12-10 2015-12-09 接続体の検査方法、接続体、導電性粒子及び異方性導電接着剤
KR1020177014219A KR101908876B1 (ko) 2014-12-10 2015-12-09 접속체의 검사 방법, 접속체, 도전성 입자 및 이방성 도전 접착제
TW104141229A TWI694473B (zh) 2014-12-10 2015-12-09 連接體之檢查方法、連接體、導電性粒子及異向性導電接著劑
CN201580064653.9A CN107005012B (zh) 2014-12-10 2015-12-09 连接体的检查方法、连接体、导电性粒子及各向异性导电粘接剂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014250384A JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法

Publications (3)

Publication Number Publication Date
JP2016115399A JP2016115399A (ja) 2016-06-23
JP2016115399A5 true JP2016115399A5 (enrdf_load_stackoverflow) 2018-01-11
JP6457255B2 JP6457255B2 (ja) 2019-01-23

Family

ID=56107438

Family Applications (1)

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JP2014250384A Active JP6457255B2 (ja) 2014-12-10 2014-12-10 接続体の検査方法、接続体、導電性粒子、異方性導電接着剤及び接続体の製造方法

Country Status (5)

Country Link
JP (1) JP6457255B2 (enrdf_load_stackoverflow)
KR (1) KR101908876B1 (enrdf_load_stackoverflow)
CN (1) CN107005012B (enrdf_load_stackoverflow)
TW (1) TWI694473B (enrdf_load_stackoverflow)
WO (1) WO2016093261A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6766558B2 (ja) * 2016-09-29 2020-10-14 セイコーエプソン株式会社 ヘッドユニット
JP2023072774A (ja) * 2021-11-15 2023-05-25 株式会社ケムソル 異方性導電フィルム並びにそれを用いた接合方法及び接合体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3542611B2 (ja) * 1991-07-26 2004-07-14 積水化学工業株式会社 導電性微粒子、電極接続構造体及びその製造方法
CN1240527A (zh) * 1996-10-15 2000-01-05 西门子公司 带接点区的芯片卡以及制造这种芯片卡的方法
KR20010098662A (ko) * 2000-04-17 2001-11-08 가마이 고로 터치식 액정 표시 장치 및 입력 검출 방법
JP2005026577A (ja) 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP2006054109A (ja) * 2004-08-12 2006-02-23 Seiko Instruments Inc 異方性導電膜及びそれを用いた表示装置、並びに、表示装置の検査方法及び検査装置
KR100720895B1 (ko) * 2005-07-05 2007-05-22 제일모직주식회사 농도 구배를 갖는 이종(異種) 복합 금속층이 형성된 전도성미립자, 그 제조방법 및 이를 이용한 이방 전도성 접착제조성물
KR20070096572A (ko) * 2006-03-27 2007-10-02 삼성전자주식회사 표시 장치
KR101368836B1 (ko) * 2008-09-19 2014-02-28 가부시기가이샤 닛뽕쇼꾸바이 도전성 미립자 및 그것을 사용한 이방성 도전재료
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法
JP4968414B2 (ja) * 2010-07-05 2012-07-04 Ｄｉｃ株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル
GB201212489D0 (en) * 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
KR101477237B1 (ko) 2012-12-27 2014-12-29 제일모직 주식회사 레이저를 이용한 접속 방법

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