JP2016085982A - 異方導電性フィルム及び接続構造体 - Google Patents
異方導電性フィルム及び接続構造体 Download PDFInfo
- Publication number
- JP2016085982A JP2016085982A JP2015210658A JP2015210658A JP2016085982A JP 2016085982 A JP2016085982 A JP 2016085982A JP 2015210658 A JP2015210658 A JP 2015210658A JP 2015210658 A JP2015210658 A JP 2015210658A JP 2016085982 A JP2016085982 A JP 2016085982A
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- Prior art keywords
- conductive particles
- conductive
- anisotropic
- conductive film
- anisotropic conductive
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Abstract
【解決手段】絶縁接着剤層10と、該絶縁接着剤層に格子状に配置された導電粒子Pを含む異方導電性フィルム1Aであって、基準導電粒子P0と、基準導電粒子P0に最も近接した第1導電粒子P1と、第1導電粒子P1と同等又は第1導電粒子P1の次に基準導電粒子P0に近接した導電粒子であって、基準導電粒子P0と第1導電粒子P1を含む格子軸上に無い第2導電粒子P2について、基準導電粒子P0の異方導電性フィルムの長手方向の投影像q1と第1導電粒子P1又は第2導電粒子P2が重なり、基準導電粒子Pの異方導電性フィルムの短手方向の投影像q2と第2導電粒子P2又は第1導電粒子P1が重なる。これらの重なり幅W1、幅W2の少なくとも一方が導電粒子Pの粒子径Dの1倍未満である。
【選択図】図1
Description
基準導電粒子と、
基準導電粒子に最も近接した第1導電粒子と、
第1導電粒子と同等又は第1導電粒子の次に基準導電粒子に近接した導電粒子であって、基準導電粒子と第1導電粒子を含む格子軸上に無い第2導電粒子について、
基準導電粒子の異方導電性フィルムの長手方向の投影像と第1導電粒子又は第2導電粒子が重なり、
基準導電粒子の異方導電性フィルムの短手方向の投影像と第2導電粒子又は第1導電粒子が重なり、
基準導電粒子の異方導電性フィルムの長手方向の投影像と、第1導電粒子又は第2導電粒子との重なり領域の異方導電性フィルムの短手方向の最大幅(以下、異方導電性フィルムの長手方向で隣接する導電粒子の重なり幅という)、及び基準導電粒子の異方導電性フィルムの短手方向の投影像と、第2導電粒子又は第1導電粒子との重なり領域の異方導電性フィルムの長手方向の最大幅(以下、異方導電性フィルムの短手方向で隣接する導電粒子の重なり幅という)の少なくとも一方が導電粒子の粒子径の1倍未満である異方導電性フィルムを提供する。
(1)異方導電性フィルムの製造
フェノキシ樹脂(熱可塑性樹脂)(新日鐵住金(株)、YP−50)60質量部、エポキシ樹脂(熱硬化性樹脂)(三菱化学(株)、jER828)40質量部、カチオン系硬化剤(三新化学工業(株)、SI−60L)2質量部、及びシリカ微粒子(日本アエロジル(株)、アエロジルRY200)20質量部を含む絶縁性樹脂の混合溶液を調製し、それを、フィルム厚さ50μmのPETフィルム上に塗布し、80℃のオーブンにて5分間乾燥させ、PETフィルム上に厚み20μmの粘着層を形成した。
各実施例及び比較例の異方導電性フィルムにおいて、基準導電粒子P0と、該基準導電粒子P0に最も近接した第1導電粒子P1との中心間距離L1を、光学顕微鏡を用いて計測して確認した。この場合、基準導電粒子P0の中心と第1導電粒子P1の中心とを結んだ第1配列軸A1上にある導電粒子100個50組を任意に計測し、その平均値を求め、所期の中心間距離L1であることを確認した。結果を表1に示す。
各実施例及び比較例の異方導電性フィルムにおいて、異方導電性フィルムの長手方向F1において隣接する導電粒子Pの重なり幅W1及び異方導電性フィルムの短手方向F2で隣接する導電粒子Pの重なり幅W2を金属顕微鏡を用いて計測した。結果を表1に示す。
各実施例及び比較例の異方導電性フィルムの(a)初期導通抵抗、(b)導通信頼性、(c)ショート発生率を、それぞれ次のように評価した。結果を表1に示す。
各実施例及び比較例の異方導電性フィルムを、初期導通および導通信頼性の評価用ICとガラス基板の間に挟み、加熱加圧(180℃、80MPa、5秒)して各評価用接続物を得た。この場合、異方導電性フィルムの長手方向と接続端子の短手方向を合わせた。そして、この評価用接続物の導通抵抗を測定した。
外径 0.7×20mm
厚み 0.2mm
バンプ仕様 金メッキ、高さ12μm、サイズ15×100μm、バンプ間距離15μm
ガラス材質 コーニング社製
外径 30×50mm
厚み 0.5mm
電極 ITO配線
(a)初期導通抵抗の評価用ICと各実施例及び比較例の異方導電性フィルムとの評価用接続物を温度85℃、湿度85%RHの恒温槽に500時間おいた後の導通抵抗を、(a)と同様に測定した。なお、この導通抵抗が5Ω以上であると、接続した電子部品の実用的な導通安定性の点から好ましくない。
ショート発生率の評価用ICとして次のIC(7.5μmスペースの櫛歯TEG(test element group))を用意した。
外径 1.5×13mm
厚み 0.5mm
バンプ仕様 金メッキ、高さ15μm、サイズ25×140μm、バンプ間距離7.5μm
(a)初期導通抵抗の評価用ICと各実施例及び比較例の異方導電性フィルムとの評価用接続物において、隣り合う接続端子間100個中で、端子と接続することなく存在する導電粒子であって2個連結した導電粒子塊の数、又は3個連結した導電粒子塊の数を、金属顕微鏡を用いて計測した。結果を表1に示す。
3 端子又は接続端子
10 絶縁接着剤層
A1 第1配列軸
A2 第2配列軸
F1 異方導電性フィルムの長手方向
F2 異方導電性フィルムの短手方向
L1 基準導電粒子と第1導電粒子との中心間距離
L2 基準導電粒子と第2導電粒子との中心間距離
P 導電粒子
P0 基準導電粒子
P1 第1導電粒子
P2 第2導電粒子
q1 基準導電粒子の異方導電性フィルムの長手方向の投影像
q2 基準導電粒子の異方導電性フィルムの短手方向の投影像
W1 異方導電性フィルムの長手方向で隣接する導電粒子の重なり幅
W2 異方導電性フィルムの短手方向で隣接する導電粒子の重なり幅
Claims (8)
- 絶縁接着剤層と、該絶縁接着剤層に格子状に配置された導電粒子を含む異方導電性フィルムであって、
基準とする任意の導電粒子(以下、基準導電粒子という)と、
基準導電粒子に最も近接した第1導電粒子と、
第1導電粒子と同等又は第1導電粒子の次に基準導電粒子に近接した導電粒子であって、基準導電粒子と第1導電粒子を含む格子軸上に無い第2導電粒子について、
基準導電粒子の異方導電性フィルムの長手方向の投影像と第1導電粒子又は第2導電粒子が重なり、
基準導電粒子の異方導電性フィルムの短手方向の投影像と第2導電粒子又は第1導電粒子が重なり、
基準導電粒子の異方導電性フィルムの長手方向の投影像と、第1導電粒子又は第2導電粒子との重なり領域の異方導電性フィルムの短手方向の最大幅(以下、異方導電性フィルムの長手方向で隣接する導電粒子の重なり幅という)、及び基準導電粒子の異方導電性フィルムの短手方向の投影像と、第2導電粒子又は第1導電粒子との重なり領域の異方導電性フィルムの長手方向の最大幅(以下、異方導電性フィルムの短手方向で隣接する導電粒子の重なり幅という)の少なくとも一方が導電粒子の粒子径の1倍未満である異方導電性フィルム。 - 導電粒子の格子状の配置が斜方格子である請求項1記載の異方導電性フィルム。
- 異方導電性フィルムの長手方向で隣接する導電粒子の重なり幅が導電粒子の粒子径に等しい請求項1又は2記載の異方導電性フィルム。
- 異方導電性フィルムの短手方向で隣接する導電粒子の重なり幅が導電粒子の粒子径に等しい請求項1又は2記載の異方導電性フィルム。
- 異方導電性フィルムの長手方向で隣接する導電粒子の重なり幅及び異方導電性フィルムの短手方向で隣接する導電粒子の重なり幅の少なくとも一方が導電粒子の粒子径の0.5倍未満である請求項1〜4記載の異方導電性フィルム。
- 基準導電粒子と第1導電粒子との中心間距離及び基準導電粒子と第2導電粒子の中心間距離が、それぞれ導電粒子の粒子径の1.5〜2000倍である請求項1〜5のいずれかに記載の異方導電性フィルム。
- 基準導電粒子と第1導電粒子との中心間距離及び基準導電粒子と第2導電粒子の中心間距離が、それぞれ導電粒子の粒子径の1.5〜5倍である請求項1〜6のいずれかに記載の異方導電性フィルム。
- 請求項1〜7のいずれかに記載の異方導電性フィルムで第1電子部品と第2電子部品が異方導電性接続されている接続構造体。
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JP6187665B1 (ja) * | 2016-10-18 | 2017-08-30 | デクセリアルズ株式会社 | 異方性導電フィルム |
WO2023189416A1 (ja) * | 2022-03-31 | 2023-10-05 | デクセリアルズ株式会社 | 導電フィルム、接続構造体及びその製造方法 |
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US20170338204A1 (en) * | 2016-05-17 | 2017-11-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device and Method for UBM/RDL Routing |
KR20170130003A (ko) * | 2016-05-17 | 2017-11-28 | 삼성디스플레이 주식회사 | 이방성 도전 필름을 포함하는 표시 장치 및 이방성 도전 필름의 제조 방법 |
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JP2020095922A (ja) * | 2018-12-14 | 2020-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN112562886A (zh) * | 2019-09-10 | 2021-03-26 | 南昌欧菲生物识别技术有限公司 | 异方性导电膜及其制备方法、邦定结构和超声波生物识别装置 |
KR20220016364A (ko) | 2020-07-30 | 2022-02-09 | 삼성디스플레이 주식회사 | 전자장치 |
JP2023117329A (ja) * | 2022-02-10 | 2023-08-23 | デクセリアルズ株式会社 | 導電フィルムの設計方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1021741A (ja) * | 1996-07-03 | 1998-01-23 | Asahi Chem Ind Co Ltd | 異方導電性組成物及びフィルム |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
JP4887700B2 (ja) * | 2005-09-09 | 2012-02-29 | 住友ベークライト株式会社 | 異方導電性フィルムおよび電子・電機機器 |
JP2014044947A (ja) * | 2012-08-01 | 2014-03-13 | Dexerials Corp | 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE794600A (fr) | 1972-01-28 | 1973-05-16 | Usel Hubert | Cartouche sans etui pour mise a feu electrique |
KR20070010015A (ko) * | 2004-03-30 | 2007-01-19 | 도카이 고무 고교 가부시키가이샤 | 이방성 도전막 및 그 제조방법 |
US8802214B2 (en) * | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
WO2007125993A1 (ja) * | 2006-04-27 | 2007-11-08 | Asahi Kasei Emd Corporation | 導電粒子配置シート及び異方導電性フィルム |
TWI307406B (en) * | 2006-07-06 | 2009-03-11 | Au Optronics Corp | Misalignment detection devices |
JP5234048B2 (ja) * | 2009-04-28 | 2013-07-10 | 日立化成株式会社 | 異方導電粒子 |
KR101345694B1 (ko) * | 2011-03-11 | 2013-12-30 | 옵토팩 주식회사 | 파이버, 파이버 집합체 및 이를 포함하는 접착제 |
US9102851B2 (en) * | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
JP2013105636A (ja) * | 2011-11-14 | 2013-05-30 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
JP6209313B2 (ja) * | 2012-02-20 | 2017-10-04 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法及び接続方法 |
KR101706821B1 (ko) * | 2014-09-01 | 2017-02-14 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
-
2015
- 2015-10-27 CN CN201580055238.7A patent/CN106797080B/zh active Active
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- 2015-10-27 KR KR1020177004491A patent/KR20170033378A/ko active Search and Examination
- 2015-10-28 TW TW104135392A patent/TWI699788B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1021741A (ja) * | 1996-07-03 | 1998-01-23 | Asahi Chem Ind Co Ltd | 異方導電性組成物及びフィルム |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
JP4887700B2 (ja) * | 2005-09-09 | 2012-02-29 | 住友ベークライト株式会社 | 異方導電性フィルムおよび電子・電機機器 |
JP2014044947A (ja) * | 2012-08-01 | 2014-03-13 | Dexerials Corp | 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6187665B1 (ja) * | 2016-10-18 | 2017-08-30 | デクセリアルズ株式会社 | 異方性導電フィルム |
WO2023189416A1 (ja) * | 2022-03-31 | 2023-10-05 | デクセリアルズ株式会社 | 導電フィルム、接続構造体及びその製造方法 |
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