JP2016066800A5 - - Google Patents
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- Publication number
- JP2016066800A5 JP2016066800A5 JP2015202777A JP2015202777A JP2016066800A5 JP 2016066800 A5 JP2016066800 A5 JP 2016066800A5 JP 2015202777 A JP2015202777 A JP 2015202777A JP 2015202777 A JP2015202777 A JP 2015202777A JP 2016066800 A5 JP2016066800 A5 JP 2016066800A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- conductor
- silver
- printed
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 229910000765 intermetallic Inorganic materials 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 25
- 229910052710 silicon Inorganic materials 0.000 claims 25
- 239000010703 silicon Substances 0.000 claims 25
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 12
- 229910052709 silver Inorganic materials 0.000 claims 12
- 239000004332 silver Substances 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 239000002390 adhesive tape Substances 0.000 claims 3
- 238000007641 inkjet printing Methods 0.000 claims 3
- 238000009713 electroplating Methods 0.000 claims 2
- 238000007639 printing Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000001995 intermetallic alloy Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95105507P | 2007-07-20 | 2007-07-20 | |
| US60/951,055 | 2007-07-20 | ||
| US12/175,381 US8304062B2 (en) | 2007-07-20 | 2008-07-17 | Electrical conductors and methods of making and using them |
| US12/175,381 | 2008-07-17 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010517187A Division JP2010534407A (ja) | 2007-07-20 | 2008-07-18 | 導電体およびそれらを作製し使用する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016066800A JP2016066800A (ja) | 2016-04-28 |
| JP2016066800A5 true JP2016066800A5 (https=) | 2016-12-01 |
Family
ID=40281732
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010517187A Pending JP2010534407A (ja) | 2007-07-20 | 2008-07-18 | 導電体およびそれらを作製し使用する方法 |
| JP2015202777A Pending JP2016066800A (ja) | 2007-07-20 | 2015-10-14 | 基板上に導体が配列された装置および導体を形成する方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010517187A Pending JP2010534407A (ja) | 2007-07-20 | 2008-07-18 | 導電体およびそれらを作製し使用する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8304062B2 (https=) |
| EP (1) | EP2173496A4 (https=) |
| JP (2) | JP2010534407A (https=) |
| KR (2) | KR20100046204A (https=) |
| CN (2) | CN101903114A (https=) |
| HK (1) | HK1212813A1 (https=) |
| WO (1) | WO2009015020A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8753983B2 (en) | 2010-01-07 | 2014-06-17 | Freescale Semiconductor, Inc. | Die bonding a semiconductor device |
| US8643389B2 (en) * | 2011-01-06 | 2014-02-04 | General Electric Company | Corrosion sensor and method for manufacturing a corrosion sensor |
| US9297742B2 (en) | 2011-01-06 | 2016-03-29 | General Electric Company | Method for manufacturing a corrosion sensor |
| JP5489305B2 (ja) * | 2012-06-27 | 2014-05-14 | 石原ケミカル株式会社 | 回路基板及び導電膜形成方法 |
| US20140262798A1 (en) * | 2013-03-15 | 2014-09-18 | Xtalic Corporation | Electrodeposition methods and baths for use with printed circuit boards and other articles |
| KR101522350B1 (ko) * | 2014-10-10 | 2015-05-26 | 한국기초과학지원연구원 | 초음파 조사를 이용한 단원자층 흑린의 제조방법 |
| US20180226533A1 (en) * | 2017-02-08 | 2018-08-09 | Amberwave Inc. | Thin Film Solder Bond |
| DE102018202513B4 (de) * | 2018-02-20 | 2023-08-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Verfahren zur Metallisierung eines Bauelements |
| JP7561139B2 (ja) * | 2019-03-25 | 2024-10-03 | シノヴィア テクノロジーズ | 非平衡熱硬化プロセス |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5426676A (en) * | 1977-07-29 | 1979-02-28 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacture |
| US5178685A (en) * | 1991-06-11 | 1993-01-12 | Mobil Solar Energy Corporation | Method for forming solar cell contacts and interconnecting solar cells |
| JP3323573B2 (ja) * | 1992-03-31 | 2002-09-09 | キヤノン株式会社 | 太陽電池モジュール及びその製造方法 |
| US5391235A (en) * | 1992-03-31 | 1995-02-21 | Canon Kabushiki Kaisha | Solar cell module and method of manufacturing the same |
| CA2089791C (en) * | 1992-04-24 | 1998-11-24 | Michael J. Brady | Electronic devices having metallurgies containing copper-semiconductor compounds |
| US5633047A (en) * | 1994-02-22 | 1997-05-27 | International Business Machines Corporation | Electronic devices having metallurgies containing copper-semiconductor compounds |
| JP3613838B2 (ja) * | 1995-05-18 | 2005-01-26 | 株式会社デンソー | 半導体装置の製造方法 |
| US6344271B1 (en) | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
| US6180869B1 (en) * | 1997-05-06 | 2001-01-30 | Ebara Solar, Inc. | Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices |
| US6083829A (en) * | 1998-05-22 | 2000-07-04 | Taiwan Semiconductor Manufacturing Company | Use of a low resistivity Cu3 Ge interlayer as an adhesion promoter between copper and tin layers |
| JP5008216B2 (ja) * | 2000-10-13 | 2012-08-22 | 株式会社アルバック | インクジェット用インクの製法 |
| JP2004193337A (ja) * | 2002-12-11 | 2004-07-08 | Sharp Corp | 太陽電池の電極形成方法およびその方法により製造される太陽電池 |
| GB0301933D0 (en) * | 2003-01-28 | 2003-02-26 | Conductive Inkjet Tech Ltd | Method of forming a conductive metal region on a substrate |
| JP2004281813A (ja) * | 2003-03-17 | 2004-10-07 | Ebara Corp | 太陽電池の製造方法 |
| KR101105991B1 (ko) * | 2003-07-09 | 2012-01-18 | 프라이즈 메탈즈, 인크. | 침착 및 패턴 공정 |
| JP2005135942A (ja) * | 2003-10-28 | 2005-05-26 | Canon Inc | 電極配設方法 |
| CN1961381A (zh) * | 2004-02-18 | 2007-05-09 | 弗吉尼亚科技知识产权公司 | 用于连接的纳米级金属糊及其使用方法 |
| TW200640596A (en) | 2005-01-14 | 2006-12-01 | Cabot Corp | Production of metal nanoparticles |
| US20060163744A1 (en) | 2005-01-14 | 2006-07-27 | Cabot Corporation | Printable electrical conductors |
| US7556748B2 (en) * | 2005-04-14 | 2009-07-07 | E. I. Du Pont De Nemours And Company | Method of manufacture of semiconductor device and conductive compositions used therein |
| JP4808994B2 (ja) * | 2005-05-19 | 2011-11-02 | 信越半導体株式会社 | 太陽電池の製造方法 |
| US7968008B2 (en) | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
-
2008
- 2008-07-17 US US12/175,381 patent/US8304062B2/en active Active
- 2008-07-18 WO PCT/US2008/070483 patent/WO2009015020A1/en not_active Ceased
- 2008-07-18 KR KR1020107003562A patent/KR20100046204A/ko not_active Ceased
- 2008-07-18 CN CN2008801075328A patent/CN101903114A/zh active Pending
- 2008-07-18 EP EP08782067A patent/EP2173496A4/en not_active Ceased
- 2008-07-18 CN CN201510240608.6A patent/CN104821346A/zh active Pending
- 2008-07-18 JP JP2010517187A patent/JP2010534407A/ja active Pending
- 2008-07-18 KR KR1020167002300A patent/KR20160018819A/ko not_active Ceased
-
2015
- 2015-10-14 JP JP2015202777A patent/JP2016066800A/ja active Pending
-
2016
- 2016-01-19 HK HK16100548.9A patent/HK1212813A1/zh unknown
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