JP2016049566A5 - - Google Patents
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- Publication number
- JP2016049566A5 JP2016049566A5 JP2015154944A JP2015154944A JP2016049566A5 JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5 JP 2015154944 A JP2015154944 A JP 2015154944A JP 2015154944 A JP2015154944 A JP 2015154944A JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5
- Authority
- JP
- Japan
- Prior art keywords
- solder mask
- ink composition
- group
- viscosity
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/471,967 | 2014-08-28 | ||
| US14/471,967 US9606430B2 (en) | 2014-08-28 | 2014-08-28 | Method of aerosol printing a solder mask ink composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016049566A JP2016049566A (ja) | 2016-04-11 |
| JP2016049566A5 true JP2016049566A5 (https=) | 2018-08-30 |
| JP6424148B2 JP6424148B2 (ja) | 2018-11-14 |
Family
ID=54011537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015154944A Expired - Fee Related JP6424148B2 (ja) | 2014-08-28 | 2015-08-05 | ソルダーマスクインク組成物をエアロゾル印刷する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9606430B2 (https=) |
| EP (1) | EP2996447B1 (https=) |
| JP (1) | JP6424148B2 (https=) |
| CA (1) | CA2901007C (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11192292B2 (en) | 2014-12-05 | 2021-12-07 | University Of Florida Research Foundation, Inc. | 3D printing using phase changing matertials as support |
| WO2016130953A1 (en) | 2015-02-13 | 2016-08-18 | University Of Florida Research Foundation, Inc. | High speed 3d printing system for wound and tissue replacement |
| TWI600125B (zh) * | 2015-05-01 | 2017-09-21 | 精材科技股份有限公司 | 晶片封裝體及其製造方法 |
| JP6998215B2 (ja) | 2015-05-08 | 2022-02-10 | ユニバーシティ オブ フロリダ リサーチ ファンデーション インコーポレーティッド | 3次元細胞培養のための成長培地 |
| DE112015006844T5 (de) * | 2015-08-27 | 2018-08-16 | Intel IP Corporation | Robuste Intermetallische-Verbindung-Schicht-Grenzfläche für ein Gehäuse in einer Gehäuseeinbettung |
| US11027483B2 (en) | 2015-09-03 | 2021-06-08 | University Of Florida Research Foundation, Inc. | Valve incorporating temporary phase change material |
| WO2017096263A1 (en) | 2015-12-04 | 2017-06-08 | University Of Florida Research Foundation, Incorporated | Crosslinkable or functionalizable polymers for 3d printing of soft materials |
| US11124644B2 (en) * | 2016-09-01 | 2021-09-21 | University Of Florida Research Foundation, Inc. | Organic microgel system for 3D printing of silicone structures |
| DE102017121726A1 (de) * | 2017-09-19 | 2019-03-21 | FELA GmbH | Leiterplatte mit Lötstoppschicht und Verfahren zur mindestens abschnittsweisen Beschichtung einer Leiterplatte mit einer Lötstoppschicht |
| EP3765265A4 (en) * | 2018-08-27 | 2021-09-08 | Hewlett-Packard Development Company, L.P. | BINDER |
| US20200102468A1 (en) * | 2018-10-02 | 2020-04-02 | Xerox Corporation | Dielectric ink composition |
| CN118109082A (zh) * | 2024-03-12 | 2024-05-31 | 深圳市墨库新材料集团股份有限公司 | 一种阻焊喷墨墨水及其应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4019188A (en) * | 1975-05-12 | 1977-04-19 | International Business Machines Corporation | Micromist jet printer |
| JPS5975955A (ja) | 1982-10-22 | 1984-04-28 | Kansai Paint Co Ltd | 自己熱硬化性塗料用樹脂組成物 |
| JPH0627329B2 (ja) * | 1984-02-13 | 1994-04-13 | シュミット,ジェロウム・ジェイ・ザ・サ−ド | 導電および誘電性固体薄膜のガスジェット付着方法および装置とそれによって製造される生産物 |
| US5045141A (en) * | 1988-07-01 | 1991-09-03 | Amoco Corporation | Method of making solderable printed circuits formed without plating |
| US5229252A (en) * | 1989-06-09 | 1993-07-20 | Morton International, Inc. | Photoimageable compositions |
| IL94474A (en) * | 1989-06-09 | 1993-07-08 | Morton Int Inc | Photoimageable compositions |
| US6207346B1 (en) * | 1997-04-09 | 2001-03-27 | Advanced Coatings International | Waterborne photoresists made from urethane acrylates |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| JP2000347402A (ja) * | 1999-06-02 | 2000-12-15 | Toagosei Co Ltd | レジスト組成物 |
| JP2001013679A (ja) * | 1999-04-30 | 2001-01-19 | Toagosei Co Ltd | レジスト組成物 |
| US6458509B1 (en) | 1999-04-30 | 2002-10-01 | Toagosei Co., Ltd. | Resist compositions |
| JP2002338612A (ja) | 2001-05-11 | 2002-11-27 | Toyobo Co Ltd | 光硬化性組成物およびその硬化方法 |
| GB0221893D0 (en) * | 2002-09-20 | 2002-10-30 | Avecia Ltd | Process |
| US7439285B2 (en) * | 2004-01-23 | 2008-10-21 | Printar Ltd. | Liquid thermosetting ink |
| US20090163615A1 (en) * | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| US7964032B2 (en) | 2006-10-17 | 2011-06-21 | Momentive Performance Materials Inc. | Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions |
| KR20080069354A (ko) * | 2007-01-23 | 2008-07-28 | 타무라 카켄 코포레이션 | 레지스트 잉크, 프린트 배선판 및 레지스트 잉크의 제조방법 |
| US9157054B2 (en) * | 2007-11-14 | 2015-10-13 | The University Of Queensland | Device and method for preparing microparticles |
| JP5295669B2 (ja) * | 2008-07-14 | 2013-09-18 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP5569216B2 (ja) * | 2010-07-27 | 2014-08-13 | Jnc株式会社 | 熱硬化性組成物およびその用途 |
| US9796864B2 (en) | 2014-08-28 | 2017-10-24 | Xerox Corporation | Solder mask ink composition |
-
2014
- 2014-08-28 US US14/471,967 patent/US9606430B2/en not_active Expired - Fee Related
-
2015
- 2015-08-05 JP JP2015154944A patent/JP6424148B2/ja not_active Expired - Fee Related
- 2015-08-13 EP EP15180965.4A patent/EP2996447B1/en active Active
- 2015-08-17 CA CA2901007A patent/CA2901007C/en active Active
-
2017
- 2017-01-19 US US15/409,923 patent/US9840088B2/en not_active Expired - Fee Related
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