JP2016049566A5 - - Google Patents

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Publication number
JP2016049566A5
JP2016049566A5 JP2015154944A JP2015154944A JP2016049566A5 JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5 JP 2015154944 A JP2015154944 A JP 2015154944A JP 2015154944 A JP2015154944 A JP 2015154944A JP 2016049566 A5 JP2016049566 A5 JP 2016049566A5
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JP
Japan
Prior art keywords
solder mask
ink composition
group
viscosity
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015154944A
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English (en)
Japanese (ja)
Other versions
JP6424148B2 (ja
JP2016049566A (ja
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Publication date
Priority claimed from US14/471,967 external-priority patent/US9606430B2/en
Application filed filed Critical
Publication of JP2016049566A publication Critical patent/JP2016049566A/ja
Publication of JP2016049566A5 publication Critical patent/JP2016049566A5/ja
Application granted granted Critical
Publication of JP6424148B2 publication Critical patent/JP6424148B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015154944A 2014-08-28 2015-08-05 ソルダーマスクインク組成物をエアロゾル印刷する方法 Expired - Fee Related JP6424148B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/471,967 2014-08-28
US14/471,967 US9606430B2 (en) 2014-08-28 2014-08-28 Method of aerosol printing a solder mask ink composition

Publications (3)

Publication Number Publication Date
JP2016049566A JP2016049566A (ja) 2016-04-11
JP2016049566A5 true JP2016049566A5 (enExample) 2018-08-30
JP6424148B2 JP6424148B2 (ja) 2018-11-14

Family

ID=54011537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015154944A Expired - Fee Related JP6424148B2 (ja) 2014-08-28 2015-08-05 ソルダーマスクインク組成物をエアロゾル印刷する方法

Country Status (4)

Country Link
US (2) US9606430B2 (enExample)
EP (1) EP2996447B1 (enExample)
JP (1) JP6424148B2 (enExample)
CA (1) CA2901007C (enExample)

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CN107614264B (zh) 2014-12-05 2020-02-04 佛罗里达大学研究基金会有限公司 使用相变材料作为支撑体的3d打印
WO2016130953A1 (en) 2015-02-13 2016-08-18 University Of Florida Research Foundation, Inc. High speed 3d printing system for wound and tissue replacement
TWI600125B (zh) * 2015-05-01 2017-09-21 精材科技股份有限公司 晶片封裝體及其製造方法
US11390835B2 (en) 2015-05-08 2022-07-19 University Of Florida Research Foundation, Inc. Growth media for three-dimensional cell culture
US20180226377A1 (en) * 2015-08-27 2018-08-09 Intel IP Corporation Robust intermetallic compound layer interface for package in package embedding
US11027483B2 (en) 2015-09-03 2021-06-08 University Of Florida Research Foundation, Inc. Valve incorporating temporary phase change material
WO2017096263A1 (en) 2015-12-04 2017-06-08 University Of Florida Research Foundation, Incorporated Crosslinkable or functionalizable polymers for 3d printing of soft materials
US11124644B2 (en) * 2016-09-01 2021-09-21 University Of Florida Research Foundation, Inc. Organic microgel system for 3D printing of silicone structures
DE102017121726A1 (de) * 2017-09-19 2019-03-21 FELA GmbH Leiterplatte mit Lötstoppschicht und Verfahren zur mindestens abschnittsweisen Beschichtung einer Leiterplatte mit einer Lötstoppschicht
EP3765265A4 (en) * 2018-08-27 2021-09-08 Hewlett-Packard Development Company, L.P. BINDING AGENT
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
CN118109082A (zh) * 2024-03-12 2024-05-31 深圳市墨库新材料集团股份有限公司 一种阻焊喷墨墨水及其应用

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JPS5975955A (ja) 1982-10-22 1984-04-28 Kansai Paint Co Ltd 自己熱硬化性塗料用樹脂組成物
AU3994785A (en) * 1984-02-13 1985-08-27 Schmitt, J.J. 111 Method and apparatus for the gas jet deposition of conductingand dielectric thin solid films and products produced there by
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
IL94474A (en) * 1989-06-09 1993-07-08 Morton Int Inc Photoimageable compositions
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US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
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KR20080069354A (ko) * 2007-01-23 2008-07-28 타무라 카켄 코포레이션 레지스트 잉크, 프린트 배선판 및 레지스트 잉크의 제조방법
KR101591820B1 (ko) * 2007-11-14 2016-02-05 더 유니버시티 오브 퀸스랜드 마이크로입자 제조장치 및 방법
JP5295669B2 (ja) * 2008-07-14 2013-09-18 新光電気工業株式会社 配線基板の製造方法
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US9796864B2 (en) 2014-08-28 2017-10-24 Xerox Corporation Solder mask ink composition

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