JP2016038206A - Probe member for pogo pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe member for a pogo pin.SOLUTION: A probe member for a pogo pin used for the inspection of a semiconductor device has: at least a portion that is inserted into a cylindrical body and supported by an elastic member; and an upper end that is in contact with a terminal of a semiconductor device. The probe member includes: a probe part whose upper end is provided with multiple probes being in contact with the terminal of the semiconductor; and a connection part that is extended downward from the probe part, inserted into the cylindrical body, and connected to the cylindrical body. The probes are arranged in the center, and include: a first probe being in contact with the terminal of the semiconductor; and a second probe arranged adjacent to the first probe and provided with a guide face to guide the contacting terminal of the semiconductor device toward the first probe.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a probe member for a pogo pin, and more particularly to a probe member for a pogo pin that is in reliable contact with a terminal of a semiconductor device and has an excellent electrical conductivity.

  Generally, in order to inspect the electrical characteristics of a semiconductor device, the electrical connection between the semiconductor device and the test apparatus must be made stable. Generally, a test socket is used as an apparatus for connecting a semiconductor device and a test apparatus.

  The role of such a test socket is to connect the terminals of the semiconductor device and the pads of the test apparatus to each other so that electrical signals can be exchanged bidirectionally. For this purpose, pogo pins are used as contact means used inside the test socket. Such a pogo pin is provided with a spring inside, which facilitates the connection between the semiconductor device and the test equipment and can buffer the mechanical shock that can occur during the connection, and is used in most test sockets. ing.

In FIG. 1, a pogo pin according to the prior art is schematically illustrated.
The semiconductor device 1 that is the object to be tested is provided with an external connection terminal 2, and a test substrate 8 and a substrate pad 9 provided therein are installed at positions facing the external connection terminal 2. The pogo pin 3 is located between the two and electrically connects both sides. In FIG. 1, the test socket main body is omitted. As shown in the figure, the pogo pin 3 is provided with an upper plunger 5 and a lower plunger 6 at both ends of the main body 4, and a spring 7 is inserted into the internal space of the main body 4. Thereby, the upper plunger 5 and the lower plunger 6 receive an elastic force in a direction away from each other by the spring 7. At this time, the upper plunger 5 is connected to the external connection terminal 2 of the semiconductor device 1, and the lower plunger 6 is coupled to the substrate pad 9 of the test substrate 8, and as a result, the external connection terminal 2 and the substrate pad 9 are connected. Are electrically connected to each other. That is, if one end of the upper plunger 5 is in contact with the external connection terminal 2 of the semiconductor device 1 and one end of the lower plunger 6 is in contact with the substrate pad 9 of the test substrate 8, the external connection terminal 2 and the substrate pad 9 are connected. Electrically connected.

  Another prior art pogo pin is disclosed in Patent Document 1. Specifically, FIGS. 2 and 3 illustrate semiconductor device test pogo pins that electrically connect a semiconductor device (not shown) and a test substrate (not shown) for testing the semiconductor device. Has been. Such a pogo pin includes a first plunger 20, a second plunger 30, and an elastic member 40. The first plunger 20 has a moving space penetrating on both sides. The second plunger 30 is made of a conductive material, is inserted into the moving space of the first plunger 20, and one end thereof selectively protrudes through the upper end of the first plunger 20. The elastic member 40 is inserted between the first plunger 20 and the second plunger 30, and provides the first plunger 20 and the second plunger 30 with an elastic force in a direction away from each other. One end of the second plunger 30 is connected to a substrate pad of the test substrate (not shown), and the other end is connected to the first plunger 20 through relative movement between the first plunger 20 and the second plunger 30. 20 is exposed through one side and connected to an external connection terminal of the semiconductor device (not shown).

Such conventional pogo pins have the following problems.
The pogo pin formed on the upper end of the semiconductor device is such that the probe is mechanically processed or manufactured by a general plating method, and the shape of the probe to be actually realized by the user can be expressed as it is. There is a problem that it is not done.

  In other words, it is impossible to implement probes of various shapes such as realizing a probe of a desired shape in a desired portion, changing the material of each probe, or changing the height of the probe. There is a point.

Korean Published Patent No. 10-2011-0127010

  The present invention was created to solve the above-described problems, and more specifically, a pogo pin having a probe having a desired shape can be embodied, and a material such as a material of each probe is changed. It is an object of the present invention to provide a pogo pin probe member capable of realizing a pogo pin desired by a person.

  The probe member for pogo pins of the present invention for achieving the above-described object is a probe member for pogo pins used for inspection of a semiconductor device, and at least a part thereof is inserted into the cylindrical body and is an elastic member. A probe member for pogo pins that has an upper end in contact with a terminal of a semiconductor device, and the probe member includes a first probe portion having a probe in contact with a terminal of the semiconductor device at the upper end; A first probe plate that extends downward from one probe portion, is inserted into the cylindrical body, and is coupled to the tubular body; and a probe that contacts a terminal of the semiconductor device; Is provided at the upper end, is extended from the second probe portion downward from the second probe portion having a shape different from that of the first probe portion, and is inserted into the cylindrical main body, A second coupling portion that is coupled to the serial tubular body, a second probe plate comprising; including, the second probe plate and the first probe plate are integrally connected to each other.

  In the pogo pin probe member, the first probe plate and the second probe plate may be made of different materials.

  In the pogo pin probe member, the first probe plate is made of a material having higher hardness than the second probe plate.

  In the pogo pin probe member, the second probe plate is made of a material that is more conductive than the first probe plate.

  In the pogo pin probe member, when the first probe plate and the second probe plate are integrated with each other, the top end heights of the probes are different from each other.

  In the pogo pin probe member, the first probe plate is made of a material having a hardness higher than that of the second probe plate, but the uppermost end height of the probe of the first probe plate is the highest of the probe of the second probe plate. Higher than the top height.

  In the pogo pin probe member, a probe that contacts a terminal of the semiconductor device is provided at an upper end, a third probe part having a shape different from that of the second probe part, and extended downward from the third probe part, A third probe plate that is inserted into the cylindrical main body and includes a third coupling portion that is coupled to the cylindrical main body. The third probe plate sandwiches the second probe plate, and It is arranged on the opposite side of one probe plate and integrated with the second probe plate.

  In the pogo pin probe member, the first probe plate and the third probe plate are made of a material having a hardness higher than that of the second probe plate.

  The probe member for pogo pins of the present invention for achieving the above-described object is a probe member for pogo pins used for inspection of a semiconductor device, and at least a part thereof is inserted into the cylindrical body and is an elastic member. A probe member for pogo pins that is supported by the upper end of the probe and contacts the terminal of the semiconductor device, and the probe member includes a probe unit provided at the upper end of the probe that contacts the terminal of the semiconductor device, and the probe unit. A plurality of probe plates having different cross sections when cut in the vertical direction, including a coupling portion that extends downward and is inserted into the cylindrical main body and coupled to the cylindrical main body. They may be integrated with each other.

  In the pogo pin probe member, at least one of the plurality of probe plates has a higher hardness than other probe plates.

  In the pogo pin probe member, at least one of the plurality of probe plates is different in thickness from the other probe plates.

  In the pogo pin probe member, at least one of the plurality of probe plates has a probe height different from that of the other probe plates.

  In the pogo pin probe member, at least one of the plurality of probe plates has a different number of probes from other probe plates.

  The probe member for pogo pins of the present invention for achieving the above-described object is a probe member for pogo pins used for inspection of a semiconductor device, and at least a part thereof is inserted into the cylindrical body and is an elastic member. A probe member for pogo pins that is supported by the upper end of the probe and contacts the terminal of the semiconductor device, and the probe member includes a probe unit provided at the upper end of the probe that contacts the terminal of the semiconductor device, and the probe unit. A plurality of probe plates having a fixed shape extending in a direction perpendicular to the vertical direction, and extending downward, inserted into the tubular body, and coupled to the tubular body However, they may be integrated with each other.

  The probe member for pogo pins according to the present invention has a shape in which a large number of probe plates on which probes are provided are integrally connected to each other, and has a shape desired by the manufacturer or different materials for each probe. Can be used.

1 is a schematic diagram of a pogo pin according to the prior art. It is the isolation | separation perspective view of the pogo pin by a prior art. FIG. 3 is a cross-sectional view of FIG. 2. It is a perspective view of the pogo pin comprised including the probe member for pogo pins by one Embodiment of this invention. FIG. 5 is a connection diagram of FIG. 4. It is an operation | movement figure of the pogo pin of FIG. It is an operation | movement figure of the pogo pin of FIG. 5 is a drawing of a probe member for pogo pins according to another embodiment of the present invention.

  Hereinafter, a pogo pin probe member according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  The pogo pin probe member 110 according to the present invention is used for inspecting the semiconductor device 150. At least a part of the probe member 110 is inserted into the cylindrical main body 120 and supported by the elastic member 130, and the upper end is the semiconductor device. It contacts 150 terminals 151.

  Such a pogo pin probe member 110 is characterized in that a large number of probe plates each composed of a probe portion and a coupling portion are integrally attached to each other. Specifically, each probe plate is provided with a probe portion and a coupling portion, and probe plates having different shapes are integrated and attached to each other. . At that time, the probe plate has a substantially thin plate shape.

  Specifically, the probe plate 111 will be described as follows. For example, in the probe member 110 for pogo pins in FIG. 4, the probe plate 111 located at the forefront is referred to as a first probe plate 112, and the probe plates 111 disposed thereafter are the second probe plate 113 and the first probe plate 111, respectively. These are referred to as a three-probe plate 114, a fourth probe plate 115, and a fifth probe plate 116, and each probe plate has the following characteristics.

  First, the first probe plate 112 includes a first probe part 112a having a probe that contacts the terminal 151 of the semiconductor device 150 at its upper end, and extends downward from the first probe part 112a. And a first coupling part 112b inserted into the cylindrical body 120 and coupled to the cylindrical main body 120.

  Specifically, the first probe plate 112 is configured in a thin plate shape, and the first probe portion 112a has a quadrangular shape, but has a shape in which two protrusions are provided on the top.

  The first coupling part 112b extends downward from the first probe part 112a, but has a rectangular shape with a narrower left-right width than the first probe part 112a.

  The second probe plate 113 is integrally attached adjacent to the first probe plate 112, and includes a second probe portion 113a and a second coupling portion 113b.

  The second probe portion 113a of the second probe plate 113 has a probe that contacts the terminal 151 of the semiconductor device 150 at the upper end, and has a shape different from that of the first probe portion 112a. Specifically, the second probe unit 113a is configured to have a wide width and a single protrusion compared to the first probe unit 112a. At this time, the second probe unit 113a includes a single probe. In addition, the thickness of the second probe portion 113a is configured to be thicker than the thickness of the first probe portion 112a.

  The second coupling part 113b extends downward from the second probe part 113a, is inserted into the cylindrical body 120, and is coupled to the cylindrical body 120.

  The second coupling part 113b has a rectangular shape with a narrower left-right width than the second probe part 113a. In addition, the lateral width of the second coupling part 113b is wider than the lateral width of the first coupling part 112b.

  The third probe plate 114 is formed in a thin plate shape and includes a third probe portion 114a and a third coupling portion 114b. The third probe unit 114a is disposed adjacent to the second probe unit 113a, and is disposed on the opposite side of the first probe unit 112a with the second probe unit 113a interposed therebetween.

  The third probe portion 114a has a shape different from that of the second probe portion 113a. Specifically, the thickness of the third probe portion 114a is thicker than that of the second probe portion 113a, and the shape of the protrusions and the number of probes constituting the probe are different.

  The third coupling part 114b extends downward from the third probe part 114a, is inserted into the cylindrical body 120, and is coupled to the cylindrical body 120. The third coupling part 114b has a narrower width than the lateral width of the third probe part 114a.

  On the other hand, the fourth probe plate 115 includes a fourth probe portion and a fourth coupling portion, and the fifth probe plate 116 includes a fifth probe portion and a fifth coupling portion. Since specific matters are similar to the above-described configuration, they are omitted.

  Meanwhile, it goes without saying that the first probe plate 112 and the second probe plate 113 have different shapes, and may be made of different materials. For example, the first probe portion 112a may be made of a high hardness material including a nickel alloy, and the second probe portion 113a may be made of a metal material having excellent conductivity such as gold or silver. As described above, if the first probe plate 112 and the second probe plate 113 are made of different materials, the first probe portion 112a can be obtained when a foreign substance such as an oxide film is attached to the surface of the terminal 151 of the semiconductor device 150. Performs a function of breaking the oxide film, and the second probe unit 113a can realize excellent conductivity. It goes without saying that the first probe plate 112 can also take charge of the electrical conduction function.

  The third probe portion 114a is made of a material having a hardness higher than that of the second probe portion 113a, and the fourth probe portion is made of a material having excellent conductivity. That is, the high hardness material and the material having excellent conductivity are configured to repeat each other.

  Further, when the number of probes on each probe plate 111 is different, the probes may not be positioned on the same line but may be configured in a zigzag shape.

  Meanwhile, the overall configuration of the pogo pin 100 including the pogo pin probe member 110 of the present invention will be described as follows. The pogo pin includes the above-described pogo pin probe member 110, a cylindrical main body 120, an elastic member 130 that is disposed in the cylindrical main body 120, and biases the pogo pin probe member 110 upward. The lower probe member 140 is at least partially protruded through the lower opening of the main body 120 and supported by the elastic member 130. At this time, the pogo pin 100 is inserted into a housing (not shown) in which an opening is formed in the vertical direction.

Such a pogo pin probe member according to the present invention has the following effects.
First, as illustrated in FIG. 6, if the terminal 151 of the semiconductor device 150 comes into contact with the probe member as illustrated in FIG. 7 while the terminal 151 of the semiconductor device 150 is lowered, the terminal 151 is The probe member effectively contacts a plurality of probes of the probe member.

  The probe member of the present invention configured by integrating a plurality of probe plates can freely realize the shape and position of the probe according to the intention of the designer, and has an optimal contact form that meets the design conditions. Can do.

  In addition, if the materials of the probe plates that contact the terminals of the semiconductor device are different from each other, one probe mainly performs the function of removing foreign substances attached to the terminals, and the other probes contact the terminals and perform electrical functions. It is possible to perform a function of increasing the electrical conductivity and obtain a desired effect. For example, if the entire probe is made of the same material, that is, if all the probes are made of a hard material, the conductivity is low and undesirable in terms of electrical conductivity, and all probes are conductive However, in the present invention, the probe plate made of a high hardness material and the low hardness are likely to be worn out in the process of repeated contact with the terminal. However, the probe plates made of materials having excellent conductivity are mutually arranged to perform complementary functions.

  The probe member for pogo pins according to the embodiment of the present invention is manufactured as follows. First, after forming a conductive layer on the substrate, a dry film is arranged, and after forming a predetermined groove with a photoresist in the dry film, the groove is filled with a plating material, and a first probe plate is manufactured, Thereafter, after dry film is re-laminated, a groove having a necessary shape is formed again, and then the plating material is filled in the groove to produce a second probe plate. Such operations are repeated until the fifth probe plate is manufactured, and then all dry films are removed, and the pogo pin probe member manufactured from the substrate is separated to complete the manufacture.

  On the other hand, the pogo pin probe member according to the present invention is not limited to the above-described embodiment, and may be modified as follows.

  That is, as shown in FIG. 8, it is also possible to manufacture the probe plates having different probe heights. For example, the first probe plate 112 ′ is made of a material having a hardness higher than that of the second probe plate 113 ′, and then the uppermost end height of the probe of the first probe plate 112 ′ is set to the second probe plate 113 ′. It is located higher than the top end height of the probe. In this way, if the probe of the first probe plate 112 ′ made of a high hardness material is positioned high, the probe made of the high hardness material is attached to the terminal while first contacting the terminal of the semiconductor device. The foreign matter is removed, and then the probe of the second probe plate 113 ′ is brought into contact to perform an effective electrical conduction function. It is desirable that the uppermost end of the probe plate made of a high hardness material be positioned higher than the uppermost end of the probe plate made of a low hardness material.

  Although the present invention has been described in detail with preferred embodiments, the present invention is not necessarily limited to such embodiments, and various modifications can be made without departing from the technical idea of the present invention. It is implemented.

  The probe member for pogo pins of the present invention can be effectively applied to, for example, a technical field related to half body device inspection.

DESCRIPTION OF SYMBOLS 1,150 Semiconductor device 2 External connection terminal 3,100 Pogo pin 4 Main body 5 Upper plunger 6 Lower plunger 7 Spring 8 Test substrate 9 Substrate pad 20 First plunger 30 Second plunger 40, 130 Elastic member 110 Probe member 111 Probe plate 112, 112 ′ first probe plate 112a first probe portion 112b first coupling portion 113, 113 ′ second probe plate 113a second probe portion 113b second coupling portion 114 third probe plate 114a third probe portion 114b third coupling portion 115 Fourth probe plate 116 Fifth probe plate 120 Tubular body 140 Lower probe member 151 Terminal of semiconductor device

Claims (14)

A pogo pin probe member used for inspection of a semiconductor device, wherein at least a part thereof is inserted into a cylindrical body and supported by an elastic member, and an upper end of the probe member contacts a terminal of the semiconductor device. A member,
The probe member is
A first probe portion provided at the upper end with a probe that contacts a terminal of the semiconductor device, and extends downward from the first probe portion, is inserted into the cylindrical main body, and is coupled to the cylindrical main body A first probe plate including a first coupling portion;
A probe that contacts a terminal of the semiconductor device is provided at an upper end, a second probe portion having a shape different from that of the first probe portion, extended downward from the second probe portion, and inserted into the cylindrical main body. A second probe plate including a second coupling portion coupled to the cylindrical body,
The probe member for a pogo pin, wherein the first probe plate and the second probe plate are integrally connected to each other.   The pogo pin probe member according to claim 1, wherein the first probe plate and the second probe plate are made of different materials.   The probe member for pogo pins according to claim 2, wherein the first probe plate is made of a material having a hardness higher than that of the second probe plate.   The pogo pin probe member according to claim 2 or 3, wherein the second probe plate is made of a material that is more conductive than the first probe plate.   2. The pogo pin probe member according to claim 1, wherein when the first probe plate and the second probe plate are integrated with each other, the top end heights of the probes are different from each other.   The first probe plate is made of a material having a hardness higher than that of the second probe plate, and an uppermost end height of the probe of the first probe plate is higher than an uppermost end height of the probe of the second probe plate. The probe member for pogo pins according to claim 5. A probe in contact with the terminal of the semiconductor device is provided at the upper end, a third probe portion having a shape different from that of the second probe portion, extended downward from the third probe portion, and inserted into the cylindrical main body. A third probe plate including a third coupling portion coupled to the cylindrical body,
2. The pogo pin according to claim 1, wherein the third probe plate is disposed on the opposite side of the first probe plate with the second probe plate interposed therebetween, and is integrated with the second probe plate. Probe member.   The pogo pin probe member according to claim 7, wherein the first probe plate and the third probe plate are made of a material having a hardness higher than that of the second probe plate. A pogo pin probe member used for inspection of a semiconductor device, wherein at least a part thereof is inserted into a cylindrical body and supported by an elastic member, and an upper end of the probe member contacts a terminal of the semiconductor device. A member,
The probe member is
A probe part provided at the upper end of a probe that contacts a terminal of the semiconductor device; a coupling part that extends downward from the probe part, is inserted into the cylindrical body, and is coupled to the cylindrical body; Including
A probe member for a pogo pin, wherein a plurality of probe plates having different cross sections when cut in the vertical direction are integrated with each other.   10. The pogo pin probe member according to claim 9, wherein at least one of the plurality of probe plates has higher hardness than the other probe plates. 11.   The probe member for a pogo pin according to claim 9, wherein at least one of the plurality of probe plates has a thickness different from that of the other probe plates.   The probe member for a pogo pin according to claim 9, wherein at least one of the plurality of probe plates has a probe height different from that of the other probe plates.   The probe member for a pogo pin according to claim 9, wherein at least one of the plurality of probe plates has a different number of probes from other probe plates. A pogo pin probe member used for inspection of a semiconductor device, wherein at least a part thereof is inserted into a cylindrical body and supported by an elastic member, and an upper end of the probe member contacts a terminal of the semiconductor device. A member,
The probe member is
A probe part provided at the upper end of a probe that contacts a terminal of the semiconductor device; a coupling part that extends downward from the probe part, is inserted into the cylindrical body, and is coupled to the cylindrical body; Including
A probe member for a pogo pin, wherein a plurality of probe plates having a fixed shape in a direction perpendicular to the vertical direction are integrated with each other.

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